Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.05b
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- Pages.94-97
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- 2005
Sticking processing of Bi high $T_c$ superconducting thin films
Bi 고온 초전도 박막의 부착 공정
- Cheon, Min-Woo (DongShin Uni.) ;
- Kim, Tae-Gon (DongShin Uni.) ;
- Park, Yong-Pil (DongShin Uni.)
- Published : 2005.05.27
Abstract
Bismuth high Tc superconducting thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra low growth rate, and sticking processing of the respective elements are evaluated. The sticking processing of bismuth element in bismuth high Tc superconducting thin film formation was observed to show a unique temperature dependence; it was almost a constant value of 0.49 below about