• Title/Summary/Keyword: sputtering target

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Workers' Exposure to Indium Compounds at the Electronics Industry in Republic of Korea

  • Yi, Gwangyong;Jeong, Jeeyeon;Bae, Yasung;Shin, Jungah;Ma, Hyelan;Lee, Naroo;Park, Seung-Hyun;Park, Dooyong
    • Safety and Health at Work
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    • v.12 no.2
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    • pp.238-243
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    • 2021
  • Objectives: The aim of this study was to provide baseline data for the assessment of exposure to indium and to prevent adverse health effects among workers engaged in the electronics and related industries in Republic of Korea. Methods: Total (n = 369) and respirable (n = 384) indium concentrations were monitored using personal air sampling in workers at the following 19 workplaces: six sputtering target manufacturing companies, four manufacturing companies of panel displays, two companies engaged in cleaning of sputtering components, two companies dedicated to the cleaning of sputtering target, and five indium recycling companies. Results: The level of exposure to total indium ranged from 0.9 to 609.3 ㎍/m3 for the sputtering target companies; from 0.2 to 2,782.0 ㎍/m3 for the panel display companies and from 0.5 to 2,089.9 ㎍/m3 for the indium recycling companies. The level of exposure to respirable indium was in the range of 0.02 to 448.6 ㎍/m3 for the sputtering target companies; 0.01 to 419.5 ㎍/m3 for the panel display companies; and 0.5 to 436.3 ㎍/m3 for the indium recycling companies. The indium recycling companies had the most samples exceeding the exposure standard for indium, followed by sputtering target companies and panel display companies. Conclusions: The main finding from this exposure assessment is that many workers who handle indium compounds in the electronics industry are exposed to indium levels that exceed the exposure standards for indium. Hence, it is necessary to continuously monitor the indium exposure of this workforce and take measures to reduce its exposure levels.

Characterization of ZTO Thin Films Transistor Deposited by On-axis Sputtering and Facing Target Sputtering(FTS) (On-axis 스퍼터링과 FTS 공정으로 증착한 ZTO 박막트랜지스터의 특성)

  • Lee, Se-Hee;Yoon, Soon-Gil
    • Korean Journal of Materials Research
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    • v.26 no.12
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    • pp.676-680
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    • 2016
  • We have investigated the properties of thin film transistors(TFT) fabricated using zinc tin oxide(ZTO) thin films deposited via on-axis sputtering and FTS methods. ZTO thin films deposited by FTS showed lower root-mean-square(RMS) roughness and more uniformity than those deposited via on-axis sputtering. We observed enhanced electrical properties of ZTO TFT deposited via FTS. The ZTO films were deposited at room temperature via on-axis sputtering and FTS. The as-deposited ZTO films were annealed at $400^{\circ}C$. The TFT using the ZTO films deposited via FTS process exhibited a high mobility of $12.91cm^2/V.s$, a low swing of 0.80 V/decade, $V_{th}$ of 5.78 V, and a high $I_{on/off}$ ratio of $2.52{\times}10^6$.

Microstructure and tribological properties of CrZr-Si-N films synthesized by unbalanced magnetron sputtering with Cr-Zr-Si segment target (Unbalanced magnetron sputtering과 Segment target을 활용한 CrZr-Si-N 박막의 미세구조와 마모특성)

  • Kim, Dong-Jun;Ra, Jeong-Hyeon;Kim, Seong-Min;Lee, Sang-Yul;Lee, Sang-Yong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.11a
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    • pp.113-114
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    • 2012
  • 본 연구는 segment target을 사용하여 unbalanced magnetron sputtering을 활용하여 고 CrZr-Si-N 박막을 합성하고 박막의 미세구조 및 마모 특성을 연구하는데 그 목적이 있다. 박막의 Si 함량을 조절하기 위하여 각 segment target은 Cr,Zr을 일정vol% 유지하며 Si vol%만 변화하여 설계하였다. Si 함량별로 제작된 마모실험 시편의 미세구조는 XRD, FE-SEM, AFM, TEM을 통하여 분석하였으며, ball on disk type의 마모 시험기를 통해 그 마모 특성을 분석하였으며,

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Thin films made by magnetron sputtering cathode with wide target erosion (고효율 마그네트론 스퍼트링 캐소드의 설계 및 박막 제작 특성)

  • Park, Jang-Sick;Lee, Won-Geon;Jung, Min-Gi;Park, Lee-Soon;An, Chang-Ku
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.365-366
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    • 2007
  • High quality cathode with high deposition rate of thin films and long target life time is required for manufacturing TFT-LCD and semiconductor. We developed WV(wide view) sputtering cathode with wide erosion area and high deposition rate. Ti thin film thickness variation in WV cathode is below 5% for 380 kWh target life time. Al thin film thickness using normal cathode is decreased about 20%. By using WV cathode, target using efficiency was improved 40%. in comparison with normal cathode.

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Characteristics of VOx Thin Films Fabricated by Sputtering as Buffer Layer in Inverted Organic Solar Cell (역구조 유기태양전지 버퍼층 응용을 위한 스퍼터링 방법으로 제작된 VOx 박막의 특성 )

  • Seong-Soo Yang;Yong Seob Park
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.1
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    • pp.36-41
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    • 2023
  • We investigated the properties of vanadium oxide (VOx) buffer layers deposited by a dual RF magnetron sputtering method under various target powers for inverted organic solar cells (IOSCs). Sputter fabricatged VOx thin films exhibited higher crystallinity with the increase of target power, resulting in a uniform and large grain size. The electrical properties of VOx films are improved with the increase of target power because of the increase of V content. In the results, the performance of IOSCs critically depended on the target power during the film growth because the crystalllinity of the VOx film affects the carrier mobility of the VOx film.

Influence of sputtering parameter on the properties of silver-doped zinc oxide sputtered films

  • S. H. Jeong;Lee, S. B.;J.H. Boo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2003.10a
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    • pp.58-58
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    • 2003
  • Silver doped ZnO (SZO) films were prepared by rf magnetron sputtering on glass substrates with extraordinary designed ZnO target. With the doping source for target, use AgNO$_3$ powder on a various rate (0, 2, and 4 wt.%). We investigated dependence of coating parameter such as dopant content in target and substrate temperature in the SZO films. The SZO films have a preferred orientation in the (002) direction. As amounts of the Ag dopant in the target were increased, the crystallinity and the transmittance and optical band gap were decreased. And the substrate temperature were increased, the crystallinity and the transmittance were increased. But the crystallinity and the transmittance of SZO films were retrograde at 200$^{\circ}C$. Upside facts were related with composition. In addition, the Oxygen K-edge features of the SZO films were investigated by using near edge X-ray absorption fine structure (NEXAFS) spectroscopy. Changes of optical band gap of the SZO films were explained compared with XRD, XPS and NEXAFS spectra.

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Bulk and Surface of Al2O3 doped ZnO Films at Different Target Angles by DC magnetron sputtering

  • Kang, Junyoung;Park, Hyeongsik;Yi, Junsin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.345.2-345.2
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    • 2016
  • Alumina (Al2O3) doped zinc oxide (ZnO) films (AZO) have been prepared from 2 wt.% Al2O3 doped ZnO target by DC magnetron sputtering at a 2 mTorr (0.27 Pa) chamber pressure in (15 sccm) argon ambient. We obtained films of various opto-electronic properties by variation of target angle from 32.5o to 72.5o. At lower target angle deposited films show higher values in optical gap, mobility of charge carrier, carrier concentration, crystallite grain size, transmission range of wavelength, which are favorable characteristics of AZO as a transparent conducting oxide (TCO). At higher target angle the sheet resistance, work function, surface roughness for the AZO films increases. Measured haze ratio of the films changed lower to higher and size of characteristic surface structure of as deposited film ranges from ~40 nm to ~300 nm. By a combination of low and high target angle we obtained a textured TCO film with high conductivity.

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Deposition of Al Doped ZnO Films Using ICP-assisted Sputtering on the Plastic Substrate (유도결합 플라즈마 스퍼터링을 이용한 플라스틱 기판 상의 Al이 도핑된 ZnO 박막 증착)

  • Jung, Seung-Jae;Han, Young-Hun;Lee, Jung-Joong
    • Journal of Surface Science and Engineering
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    • v.39 no.3
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    • pp.98-104
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    • 2006
  • Al-doped ZnO (AZO) films were deposited on the plastic substrate by inductively coupled plasma (ICP) assisted DC magnetron sputtering. The AZO films were produced by sputtering a metallic target (Zn/Al) in a mixture of argon and oxygen gases. AZO films with an electrical resistivity of ${\sim}10^3\;{\Omega}cm$ and an optical transmittance of 80% were obtained even at a low deposition temperature. In-situ process control methods were used to obtain stable deposition conditions in the transition region without any hysteresis effect. The target voltage was controlled either at a constant DC power. It was found that the ratio of the zinc to oxygen emission intensity, I (O 777)/I (Zn 481) decreased with increasing the target voltage in the transition region. The $Ar/O_2$ plasma treatment improve the adhesion strength between the polycarbonate substrate and AZO films.

Study on the Development of RF Magnetron Sputter-Deposition System(I) (RF마그네트론 스퍼터 증착장치 개발연구(I))

  • Kim, Hee-Je;Moon, Dek-Soi;Jin, Yun-Sik;Lee, Hong-Sik
    • Proceedings of the KIEE Conference
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    • 1993.07b
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    • pp.612-614
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    • 1993
  • Sputtering requires a way to bombard the target with sufficient momentum. Positive ions are the most convenient source since their energy and momentum can be controlled by applying a potential to the target. Although many types of discharges have been used for sputtering, magnetrons are now the most widely used because of the high ion current densities. Namely, plasma near the target electrode is confined by magnetic field using permanent magnet, so that the collision probability is increased. It is important to develop RF magnetron sputtering system which has many excellent merits compared with conventional methods. Our study aims to develop 1 kW RF source(13.56 MHz, TR type) and to accumulate the design and construction technology of RF magnetron sputter-deposition system. We developed 1 kW RF sputtering system to deposit thin film. These films are deposited by this RF source matched by auto-matching system using primarily argon gas. Target of Au, Ni, Al, and $SiO_2$ was well deposited on the argon pressure of 5-10 mTorr.

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