• Title/Summary/Keyword: spiral coil

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An Integrated LTCC Inductor and Its Application (LTCC 기술을 이용한 마이크로 인덕터의 개발과 응용)

  • Kim, Chan-Young;Kim, Hee-Jun
    • Proceedings of the KIEE Conference
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    • 2004.04a
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    • pp.129-132
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    • 2004
  • An integrated inductor using low temperature cofiring ceramics(LTCC) technology has been fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn $\times$ 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick, For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured value. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1W output power and 1MHz switching frequency using the inductor has been developed. For the converter the maximum efficiency of about 81% was obtained.

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Impedance Properties of Thin Film Inductors by Fabricated Wet Etching Method (습식 식각법으로 제조된 박막 인덕터의 임피턴스 특성)

  • 김현식;송재성;오영우
    • Electrical & Electronic Materials
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    • v.10 no.8
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    • pp.813-818
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    • 1997
  • In this study the thin film air core and magnetic core inductors consisting of planar coil and/or CoNbZr amorphous magnetic layers on a Si substrate were fabricated as spiral type by using rf magnetron sputtering and wet etching methods. The etchant solution was achieved by iron chloride solution(17.5 mol%) mixed with HF (20 mol%) during 150 sec which etched Cu films and CoNbZr/Cu/CoNbZr multi-layer films. They were about 10${\mu}{\textrm}{m}$ of thickness and 10$\times$10 mm$^2$of size. The properties of thin film magnetic core inductor were 400 nH of Q value at 10 MHz and the resonance frequency was about 300 MHz.

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An LTCC Inductor Embedding NiZn Ferrite and Its Application (NiZn 페라이트를 내장한 LTCC 인덕터 개발 및 응용)

  • Won, Yu-June;Kim, Hee-Jun
    • Proceedings of the KIEE Conference
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    • 2006.07b
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    • pp.939-940
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    • 2006
  • An integrated inductor using the low-temperature co-fired ceramics(LTCC ) technology for low-power electronics was fabricated. In the inductor NiZn ferrite sheet(${\mu}_r=230$), was embedded to increase inductance. The inductor has Ag spiral coil with 14 turns($7turns{\times}2layers$), a dimension of 0.6mm in width, 10um in thickness, and 0.15mm pitch. To evaluate the inductance, including the parasitic resistance, the fabricated inductor was calculated and measured. It was confirmed that calculated values were very close to the measured values. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1W output power and up to 0.5MHz switching frequency using the inductor fabricated was develop.

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Critical Current and AC loss Characteristics of mini-model HTS cable (고온 초전도 모델 케이블의 임계전류 및 교류손실 특성)

  • Kim, Hae-Joon;Sim, Ki-Deok;Kim, Jae-Ho;Cho, Jeon-Wook
    • Proceedings of the KIEE Conference
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    • 2006.07b
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    • pp.809-810
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    • 2006
  • Reduction of AC losses is very important for realizing HTS cable and it had been reported that the same layer current controlled by twisting pitch and direction could reduce the AC losses effectively. During the long-term development of HTS cables, the superconductor AC losses will need to be reduced to a level determined by the economics of each installation and the efficiency of the refrigeration. Theoretical models have been developed to predict the magnitude of the losses in cables composed of several layers of flat HTS tapes. This paper is manufactured mini-model HTS cable and voltage signal line to spiral shape. Mini-model HTS cable is composed of 13 HTS tape. We measured to critical current and AC loss and compared used lock-in-amp to cancel coil. This data is useful to HTS cable of DAPAS program.

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An Integrated LTCC Inductor and Its Application (LTCC 기술을 이용한 마이크로 인덕터 및 응용)

  • Kim Chan-Young;Kim Hee-Jun
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.53 no.11
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    • pp.680-686
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    • 2004
  • An integrated inductor using the low temperature cofiring ceramics(LTCC) technology was fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn x 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick. For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured one. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1.32W output power and 1MHz switching frequency using the inductor fabricated was developed. For the converter the maximum efficiency of about 81% was obtained.

An LTCC Inductor Embedding NiZn Ferrite and Its Application (NiZn 페라이트를 내장한 LTCC 인덕터 및 응용)

  • Won, Yu-June;Kim, Hee-Jun
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.55 no.10
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    • pp.534-539
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    • 2006
  • An integrated inductor using the low-temperature co-fired ceramics(LTCC) technology for low-power electronics was fabricated. In the inductor NiZn ferrite sheet$({\mu}_r=230)$, was embedded to increase inductance. The inductor has Ag spiral coil with 14 turns$(7turns{\times}2layers)$, a dimension of 0.6mm in width, 10um in thickness, and 0.15mm pitch. To evaluate the inductance, including the parasitic resistance, the fabricated inductor was calculated and measured. It was confirmed that calculated values were very close to the measured values. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC boost DC/DC converter with 1W output power and up to 0.5MHz switching frequency using the inductor fabricated was developed.

Optimal Structure of Planar Spiral Coil in Inductive Power Transformer (무선전력 전송용 평판 나선형 코일의 최적 형상)

  • Kang, Min-Hyuck;Lee, Jae-Woo;Joo, Dong-Myoung;Ryu, Seung-Hee;Yoo, Bong-Gi;Lee, Byoung-Kuk
    • Proceedings of the KIPE Conference
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    • 2015.07a
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    • pp.455-456
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    • 2015
  • 본 논문에서는 무선전력 전송을 위한 평판 나선형 코일의 최적 형상 선정을 위해 각 코일의 형태에 따른 출력 성능을 비교 및 평가한다. 코일 간 결합계수, 각 코일의 Q-factor 측면에서 송수신 패드의 성능을 비교하며, 이를 위해 송수신 패드가 차지하는 면적을 최대한 활용하여 모델링 한다. 모델링한 코일에 대하여 수신패드의 수직 및 수평이동에 대한 성능 지표를 평가하고 코일의 최적 형상을 선정한다.

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Robust controller design and performance analysis of seeker scan-loop (탐색기 주사루프의 강인 제어기 설계와 성능분석)

  • Lee, Ho-Pyeong;Hwang, Hong-Yeon;Song, Chang-Seop
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.2
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    • pp.110-119
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    • 1994
  • The Robust Controller for scan-loop is designed using LQG/LTR Methodology. The design and analysis of spiral, rosette and conical scan patterns are discussed. The perfermance and robustness of the LQG/LTR controller are analyzed through experiments and cpmpared with those of the P-controller. Especially to improve the scan performance at large look angle, the cage coil output is linearized using a binomial equation. It is demonstrated that the scan-loop system by the LQG/LTR control is very robust to phase uncertainties.

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Fabrication of Planar Type Inductors Using FeTaN Magnetic Thin Films

  • Kim, Chung-Sik;Seok Bae;Jeong, Jong-Han;Nam, Seoung-Eui;Kim, Hyoung-June
    • Journal of Magnetics
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    • v.6 no.2
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    • pp.73-76
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    • 2001
  • A double rectangular spiral type inductor has been fabricated by using FeTaN films. The inductor is composed of internal coils sandwiched by magnetic layers. Characteristics of inductor performance are investigated with an emphasis on planarization of magnetic films. In the absence of the planarization process, the grating topology of the upper magnetic films over the coil arrays degrades the soft magnetic properties and the inductor performance. It also induces a longitudinal magnetic anisotropy with the easy axis aligned to the magnetic flux direction. This alignment prevents the upper magnetic films from contributing to the total induction. Glass bonding is a viable method for achieving a completely planar inductor structure. The planar inductor with glass bonding shows excellent performance: inductance of 1.1 $\mu H$, Q factor of 7 (at 5 MHz), and the current capability up to 100 mA.

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Optimization of Plain Jacked Vessel Design in Adhesive Production Process Using Computational Fluid Dynamics (Computational Fluid Dynamics를 활용한 점/접착 생산 공정 내 Jacketed Vessel 설계 최적화)

  • Joo, Chonghyo;Park, Hyundo;Cho, Hyungtae;Kim, Junghwan
    • Applied Chemistry for Engineering
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    • v.31 no.6
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    • pp.596-602
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    • 2020
  • Blending process of adhesive production has a cooling process to cool down the temperature of the solution which was heated up to 76 ℃ with a mineral insulated (MI) cable by 30 ℃ at room temperature. Using a MI cable in the adhesive production process makes the production inefficient because it takes about 10 h for the cooling process. If a jacketed vessel is used instead of the MI cable, it would shorten the cooling downtime without any additional cooling system by using cold water. However, there are various types of jacketed vessels, and thus the most suitable type should be found before set up. In this study, we designed the optimized jacketed vessel for the adhesive production process by calculating the cooling downtime, which impacts production efficiency, as a function of the jacket types using computational fluid dynamics. As a result, the cooling performance of the plain jacket was 32.7% superior to that of the half-pipe coil jacket with the same height. In addition, the plain jacket with 60% spiral baffle reduced the cooling downtime and operating time by 80.4% and 25.1%, respectively.