• Title/Summary/Keyword: soldering process

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A useful application method of reliability technology for the environmental material classification (환경물질 분류에 따른 기업의 신뢰성기술 적용방법에 관한 연구)

  • Lee Jong-Beom;Cho Jai-Rip
    • Proceedings of the Korean Society for Quality Management Conference
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    • 2004.04a
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    • pp.302-306
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    • 2004
  • When we include environment side safety, environmental material's reliability technology and study for the application method, the evidence supporting the investment of R&D person and financial. Clearly, the most important task in electrical and electronics company's product soldering process the probability of heavy metals exclude is to identify the mechanisms by which they may take place. Therefore, this study emphasis on the application environmental material classification and reliability technology.

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Estimate on related to Chip Set and the other Various Parameter in Electronic Plastic Package (반도체 패키지의 칩셋과 다른 설계변수와의 연관성 평가)

  • Kwon, Yong-Su
    • Journal of the Korean Society of Industry Convergence
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    • v.2 no.2
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    • pp.131-137
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    • 1999
  • Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

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Aging Characteristic of Shear Strength in Micro Solder Bump (마이크로 솔더 범프의 전단강도와 시효 특성)

  • 김경섭;유정희;선용빈
    • Journal of Welding and Joining
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    • v.20 no.5
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    • pp.72-77
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    • 2002
  • Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

The Fluxless Wetting Properties of UBM-Coated Si-Wafer to the Pb-Free Solders (UBM이 단면 증착된 Si-Wafer에 대한 Pb-free 솔더의 무플럭스 젖음 특성)

  • 홍순민;박재용;김문일;정재필;강춘식
    • Journal of Welding and Joining
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    • v.18 no.6
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    • pp.74-82
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    • 2000
  • The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

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The Study of Solderability according to Chemical Analysis in Plating Process (도금공정의 액 분석에 따른 Solderability 개선 연구)

  • 이준호
    • Journal of the Korean institute of surface engineering
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    • v.36 no.2
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    • pp.168-175
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    • 2003
  • The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

Current Status of Joining Ceramics and Metals (세라믹스의 접합기술)

  • Suganuma, Katsuaki
    • Ceramist
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    • v.9 no.6
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    • pp.30-36
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    • 2006
  • Joining ceramics to metals has a variety of applications both in the structural and the electronics fields. One of the great benefits of the adoption of joining into the structural applications is to provide reliability to the ceramic components by backing up with metal components. In joining ceramics and metals, two key factors, i.e., establishing chemical bonding at interfaces and dissipation of thermal stress across interfaces, should be paid for attention. Many joining methods have been already established such as adhesive and mechanical joining, brazing and soldering, and solid state bonding. Each has its own benefits with some drawbacks. One can select a suitable process and materials following the requirements of the application. This report focuses on the current status of joining technology for ceramics/metal system.

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Jangdo(Small Ornamental Knives) manufacturing process and restoration research using Odong Inlay application (오동상감(烏銅象嵌)기법을 활용한 장도(粧刀)의 제작기술 및 복원연구)

  • Yun, Yong Hyun;Cho, Nam Chul;Jeong, Yeong Sang;Jang, Chu Nam
    • Korean Journal of Heritage: History & Science
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    • v.49 no.2
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    • pp.172-189
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    • 2016
  • In this research, literature research on the Odong material, mixture ratio, casting method and casting facility was conducted on contemporary documents, such as Cheongong Geamul. Also, a long sword was produced using the Odong inlay technique. The sword reproduction steps were as follows; Odong alloying, silver soldering alloying, Odong plate and Silver plate production, hilt and sheath production, metal frame and decorative elements, such as a Dugup (metal frame), production, Odong inlay assembly and final assembly. For the Odong alloy production, the mixture ratio of the true Odong, which has copper and gold ratio of 20:1, was used. This is traditional ratio for high quality product according to $17^{th}$ century metallurgy instruction manual. The silver soldering alloy was produced with silver and brass(Cu 7 : Zn 3) ratio of 5:1 for inlay purpose and 5:2 ratio for simple welding purpose. The true Odong alloy laminated with silver plate was used to produce hilt and sheath. The alloy went through annealing and forging steps to make it into 0.6 mm thick plate and its backing layer, which is a silver plate, had the matching thickness. After the two plates were adhered, the laminated plate went through annealing, forging, engraving, silver inlaying, shaping, silver welding, finishing and polishing steps. During the Odong colouring process, its red surface turns black by induced corrosion and different hues can be achieved depending on its quality. To accomplish the silver inlay Odong techniques, a Hanji saturated with thirty day old urine is wrapped around a hilt and sheath material, then it is left at warm room temperature for two to three hours. The Odong's surface will turn black when silver inlay remains unchanged. Various scientific analysis were conducted to study composition of recreated Odong panel, silver soldering, silver plate and the colouring agent on Odong's surface. The recreated Odong had average out at Cu 95.57 wt% Au 4.16wt% and Cu 98.04 wt% Au 1.95wt%, when documented ratio in the old record is Cu 95wt% and Au 5wt%. The recreated Odong was prone to surface breakage during manufacturing process unlike material made with composition ratio written in the old record. On the silver plate of the silver and Odong laminate, 100wt% Ag was detected and between the two layers Cu, Ag and Au were detected. This proves that the adhesion between the two layers was successfully achieved. The silver soldering had varied composition of Ag depending on the location. This shows uneven composition of the silver welding. A large quantities of S, that was not initially present, was detected on the surface of the black Odong. This indicates that presence of S has influence on Odong colour. Additional study on the chromaticity, additional chemical compounds and its restoration are needed for the further understanding of the origin of Odong colour. The result of Odong alloy testing and recreation, Odong silver inlay long sword production, scientific analysis of the Odong black colouring agent will form an important foundation of knowledge for conservation of Odong artifact.

An Automatic Teaching Method by Vision Information for A Robotic Assembly System

  • Ahn, Cheol-Ki;Lee, Min-Cheol;Kim, Jong-Hyung
    • 제어로봇시스템학회:학술대회논문집
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    • 1999.10a
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    • pp.65-68
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    • 1999
  • In this study, an off-line automatic teaching method using vision information for robotic assembly task is proposed. Many of industrial robots are still taught and programmed by a teaching pendant. The robot is guided by a human operator to the desired application locations. These motions are recorded and are later edited, within the robotic language using in the robot controller, and played back repetitively to perform the robot task. This conventional teaching method is time-consuming and somewhat dangerous. In the proposed method, the operator teaches the desired locations on the image acquired through CCD camera mounted on the robot hand. The robotic language program is automatically generated and transferred to the robot controller. This teaching process is implemented through an off-line programming(OLP) software. The OLP is developed for the robotic assembly system used in this study. In order to transform the location on image coordinates into robot coordinates, a calibration process is established. The proposed teaching method is implemented and evaluated on the assembly system for soldering electronic parts on a circuit board. A six-axis articulated robot executes assembly task according to the off-line automatic teaching.

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Reliability of Joint Between Solder Bump and Ag-Pd Thick Film Conductor and Interfacial Reaction (솔더범프와 Ag-Pd 후막도체의 접합 신뢰성 및 계면반응)

  • Kim Gyeong Seop;Lee Jong Nam;Yang Taek Jin
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.151-155
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    • 2003
  • The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

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Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu (Sn-3.0Ag-0.5Cu 솔더링에서 플럭스 잔사가 전기화학적 마이그레이션에 미치는 영향)

  • Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.29 no.5
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    • pp.95-98
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    • 2011
  • Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.