• 한국품질경영학회:학술대회논문집
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• 한국품질경영학회 2004년도 품질경영모델을 통한 가치 창출
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• pp.302-306
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• 2004

When we include environment side safety, environmental material's reliability technology and study for the application method, the evidence supporting the investment of R&D person and financial. Clearly, the most important task in electrical and electronics company's product soldering process the probability of heavy metals exclude is to identify the mechanisms by which they may take place. Therefore, this study emphasis on the application environmental material classification and reliability technology.

• 한국산업융합학회 논문집
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• 제2권2호
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Journal of Welding and Joining
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• 제20권5호
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of Welding and Joining
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• 제18권6호
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• 한국표면공학회지
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• 제36권2호
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• pp.168-175
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• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

• 세라미스트
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• 제9권6호
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• pp.30-36
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• 2006

Joining ceramics to metals has a variety of applications both in the structural and the electronics fields. One of the great benefits of the adoption of joining into the structural applications is to provide reliability to the ceramic components by backing up with metal components. In joining ceramics and metals, two key factors, i.e., establishing chemical bonding at interfaces and dissipation of thermal stress across interfaces, should be paid for attention. Many joining methods have been already established such as adhesive and mechanical joining, brazing and soldering, and solid state bonding. Each has its own benefits with some drawbacks. One can select a suitable process and materials following the requirements of the application. This report focuses on the current status of joining technology for ceramics/metal system.

• 헤리티지:역사와 과학
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• 제49권2호
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• pp.172-189
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• 2016

본 연구에서는 "오주서종박물고변(五洲書種博物考辯)", "천공개물(天工開物)" 등 고문헌에 기록된 오동 재료와 합금비, 주조 시설, 주조법 등을 확인하고 이를 기초자료로 활용하여 오동상감기법으로 장도를 제작하였다. 오동상감기법 장도 제작은 크게 오동 합금, 은땜 합금, 오동판과 은판 제작, 칼자루와 칼집 제작, 장도의 장석인 두겁 및 부속품 제작, 오동 상감, 조립의 순으로 진행하였다. 오동의 합금은 "오주서종박물고변"에 보이는 상품(上品)으로 전통방식의 진오동(眞烏銅) 합금비인 구리와 금을 20:1의 중량비로 하였다. 은땜의 합금은 상감된 문양에 사용한 경우 은과 황동(Cu 7 : Zn 3)을 중량비 5:1로, 단순 접합 사용한 경우에는 은과 황동을 중량비 5:2로 합금하여 은땜판을 제작하였다. 칼집과 칼자루 제작은 진오동 합금비로 만든 오동 괴를 풀림과 단조작업을 실시하여 오동판의 두께를 0.6mm로, 오동의 뒷면인 은판도 두께 0.6mm로 제작한 뒤, 오동판과 은판 접합, 풀림과 단조, 오동판에 문양 새기기, 은 상감하기, 오동판으로 칼집과 칼자루 모양잡기, 은땜으로 접합하기, 연마 및 광택내기 등의 과정을 거쳐 완성하였다. 붉은색의 오동판 표면을 검은색으로 부식시키는 '오동 살리기(발색하기)'는 오동 합금의 품위에 따라 발색 효과가 차이가 난다. 한지를 30일 정도 썩힌 인뇨(人尿)에 적셔 칼집과 칼자루 등에 감아 따뜻한 곳($25^{\circ}C$ 이상)에 두고 2~3시간이 경과하면 오동판의 겉면만 검은색으로 발색되고 은이 상감된 문양은 그대로 있어 오동상감기법을 재현할 수 있었다. 오동상감 복원에 사용했던 오동판, 은판, 은땜판의 합금성분과 오동의 표면 발색성분을 알기 위해 과학분석을 실시하였다. 오동 합금 분석(시료 2개)결과 고문헌 기록(Cu 95wt%, Au 5wt%)과 평균성분비가 유사한 Cu 95.57wt%, Au 4.16wt%과 차이가 있는 Cu 98.04wt%, Au 1.95wt%로 검출되었는데, 전자는 오동판 가공에 성공률이 높은 반면, 후자는 가공과정에서 터지는 등의 실패가 있었다. 오동판과 은판이 부착된 시료의 성분분석 결과 은판 부분은 Ag 100wt%로 검출되었고, 오동판과 은판이 접합된 부분은 Cu, Ag, Au가 모두 검출되어 접합이 잘 되었음을 확인할 수 있었다. 은과 황동을 합금한 은땜판은 분석결과 Ag 성분이 다양하게 검출되고 있어 성분비와 관계없이 매우 불균질하게 섞여있음을 관찰하였다. 오동판에 검은색으로 발색된 부분의 성분분석 결과 소지 금속에서 검출되지 않았던 S의 함량이 검출되어 S의 함량이 오동 색상에 영향을 미친 것으로 판단되었다. 향후 발색에 대한 정확한 메커니즘을 밝히기 위해서는 추가적인 화합물, 색도 및 재현 연구 등 추가연구가 필요하다. 이번 연구를 통해 시도 및 확인된 고문헌 속의 오동합금 실험 및 재현, 오동상감기법에 의한 장도제작, 오동판 검은색 발색 메커니즘의 과학 분석결과 등은 오동상감기법의 복원을 위한 중요한 기초자료로 활용될 수 있을 것이다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1999년도 제14차 학술회의논문집
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• pp.65-68
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• 1999

In this study, an off-line automatic teaching method using vision information for robotic assembly task is proposed. Many of industrial robots are still taught and programmed by a teaching pendant. The robot is guided by a human operator to the desired application locations. These motions are recorded and are later edited, within the robotic language using in the robot controller, and played back repetitively to perform the robot task. This conventional teaching method is time-consuming and somewhat dangerous. In the proposed method, the operator teaches the desired locations on the image acquired through CCD camera mounted on the robot hand. The robotic language program is automatically generated and transferred to the robot controller. This teaching process is implemented through an off-line programming(OLP) software. The OLP is developed for the robotic assembly system used in this study. In order to transform the location on image coordinates into robot coordinates, a calibration process is established. The proposed teaching method is implemented and evaluated on the assembly system for soldering electronic parts on a circuit board. A six-axis articulated robot executes assembly task according to the off-line automatic teaching.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• Journal of Welding and Joining
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• 제29권5호
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.