• Journal of the Ergonomics Society of Korea
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• v.29 no.6
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• pp.943-949
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• 2010

When PCB soldering is performed with microscope due to the electronic components' microminiaturization, workers' awkward upper body postures and difficulties being in focus among lens, object and eyes are one of reasons for productivity decline. The object of this study is to investigate the level of difficulties of work and the extent of productivity improvement by changing work interfaces from the work using microscope to the work using LCD monitor. Independent variables was usage of microscope and image system and dependent variables were upper body segments including neck, shoulder, back, and waist, task convenience and eye fatigue. The Visual Analogue Scale (10cm) was used for questionnaire and one way ANOVA (two levels) and two sample t-test were conducted. In addition, RULA rating was conducted for working postures. The result showed that interface changes of LCD monitor, suggested by productivity comparison per one Man Hour, highly contributed to work convenience and productivity improvement.

• Journal of Technologic Dentistry
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• v.30 no.1
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• pp.131-139
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• 2008

It's very important to find the most appropriate adhesion technique available, taking into consideration factors such as biocompatibility, non-corrosiveness, mechanical stability, etc. Laser welding is the best choice you can make because from a mechanical viewpoint, a laser welded surface has better particle structure than does a casted particle structure. Furthermore, it requires no additional material and the same metal alloy which is used when casting can be used. Therefore, the resulting mixture will consist of a single alloy, instead of utilizing different alloy combinations. Another benefit is the low economic cost. The most beneficial aspects of laser welding is that it is biologicallly friendlly, doesn't require soldering, can fuse different metal alloys together, and can weld on heat-sensitive spots(E.g. around resin or ceramic). A consistent strong pulse is possible. This technique is capable of welding on master models and creates accurate welds. It is capable of due to its stronger, non-corrosive microscope, which allows 25times magnification during the soldering process. This is possible because of its high stability from the tiny particle structure.

• Korean Journal of Materials Research
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• v.31 no.11
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• pp.601-607
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• 2021

Laser cladding a surface treatment process that grants superior characteristics such as toughness, hardness, and corrosion resistance to the surface, and rebuilds cracked molds; as such, it can be a strong tool to prolong service life of mold steel. Furthermore, compared with the other similar coating processes - thermal spray, etc., laser cladding provides superior bonding strength and precision coating on a local area. In this study, surface characteristics are studied after laser cladding of low carbon steel using 18%Cr-2.5%Ni-Fe powder (Rockit404), known for its high hardness and excellent corrosion resistance. A diode laser with wavelength of 900-1070 nm is adopted as laser source under argon atmosphere; electrical power for the laser cladding process is 5, 6, and 10 kW. Fundamental surface characteristics such as crossectional microstructure and hardness profile are observed and measured, and special evaluation, such as a soldering test with molten ALDC12 alloy, is conducted to investigate the corrosion resistance characteristics. As a result of the die-soldering test by immersion of low carbon alloy steel in ALDC12 molten metal, the clad layer's soldering thickness decreases.

• Progress in Superconductivity and Cryogenics
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• v.10 no.1
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.791-797
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• 2002

This paper introduces the partial melting process for solder application and characterization of its feasibility using Sn-Ag, and Sn-Cu solder alloys. ill order to show that the liquid phase in the semi-liquid state maintains the similar wettability as single-phase liquid, the wetting balance tests are conducted with varying temperatures and compositions. Also, as a new soldering technology, the microstructural and mechanical test were investigated. The results from this research indicate that the partial melting can yield satisfactory sider joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4065-4071
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• 2014

The analysis results of the temperature distribution and deformation at the PV cell with a thickness of $200{\mu}m$ according to hot-air temperature at the soldering process of a PV cell and ribbon tend to agree somewhat with the experimental measured values. The best result of the electrical efficiency appears in the module soldered at a hot-air temperature of $390^{\circ}C$. An analysis of the soldering PV cell with a thickness of $150{\mu}m$ at a hot-air temperature of $350^{\circ}C$ confirmed that the maximum deformation was approximately 5.9mm. As the temperature of hot air is set to decrease, the deformation is reduced and it is predicted that the electrical efficiency can be improved.

• Current Photovoltaic Research
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• v.7 no.3
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• pp.65-70
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• 2019

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.

• Journal of Practical Engineering Education
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• v.16 no.2
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• pp.179-184
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• 2024

Printed circuit boards (PCBs) are a key component widely used in the production of electronic products, and not only quantitative growth but also qualitative developments such as integration cannot be ignored. Wave soldering equipment is commonly used equipment at manufacturing sites, but it is impossible to configure a dedicated equipment environment suitable for each PCB specification during the preliminary research and prototype development stage. It is neither suitable for development within limited time line nor manufacturing various product groups because only equipment setting conditions can be changed within a given time. In this study, we introduce a case of introducing a PCB pallet to enable selection of optimal process conditions within the limited environment described above. In addition, by presenting a discriminant that can determine in advance whether production is possible with current general-purpose equipment, it is expected that problems that may arise due to limitations in the general-purpose wave soldering equipment environment can be identified and resolved in advance. Ultimately, this palette makes it possible to shorten the development period and improve productivity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.709-716
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• 2004

In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.

• Journal of Mechanical Science and Technology
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• v.18 no.3
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.