• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.11
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• pp.18-28
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• 1999

A new equivalent circuit model of package (SOP, Small Outline Package) is presented for designing radio frequency integrated circuits (RFIC). In the RF region, the paddle of a package does not work as an ideal ground. Further parasitics due to both coupling and loss have a substantial effect on MMIC. The equivalent circuit model and parameter extraction methodology for the electrical characteristics of the package are described by illustrating the SOP type packages. The accuracy of the model is evaluated by comparing the s-parameters of the commercial full-wave solver and those of HSPICE simulation with the circuit model. The proposed model shows an excellent agreement with full-wave analysis up to about 8GHz.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.