• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.304-307
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• 2003

Replacement of aluminum by copper for interconnections in the semiconductor industry has raised a number of important issues. The integration of copper interconnection can be carried out by CMP(chemical mechanical polishing) is used to planarize the surface topography. In this experiments, we evaluated the optimization of several conditions for chemical additives during Cu CMP process. It was presented that the main cause of grown particle size is tartaric acid. The particle size was in inverse propotion to a quantity of bead and the time of milling process. The slurry stabilizer and oxidizer have been shown to have very good effect by addition in later milling process.

• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.1-4
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• 2003

The purpose of this study was to investigate the characteristics of slurry including phosphoric acid for chemical-mechanical planarization of copper and tantalum nitride. In general, the slurry for copper CMP consists of alumina or colloidal silica as an abrasive, organic acid as a complexing agent, an oxidizing agent, a film forming agent, a pH control agent and additives. Hydrogen peroxide (H$_2$O$_2$) is the material that is used as an oxidizing agent in copper CMP. But, the hydrogen peroxide needs some stabilizers to prevent decomposition. We evaluated phosphoric acid (H$_3$PO$_4$) as a stabilizer of the hydrogen peroxide as well as an accelerator of the tantalum nitride CMP process. We also estimated dispersion stability and zeta potential of the abrasive with the contents of phosphoric acid. An acceleration of the tantalum nitride CMP was verified through the electrochemical test. This approach may be useful for the development of the 2$\^$nd/ step copper CMP slurry and hydrogen peroxide stability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.136-139
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• 2003

Copper has attractive properties as a multi-level interconnection material due to lower resistivity and higher electromigration resistance as compared with Alumina and its alloy with Copper(0.5%). Among a variety of agents in Copper CMP slurry, $H_2O_2$ has commonly been used as the oxidizer However. $H_2O_2$ is so unstable that it requires stabilization to use as oxidizer Hence, stabilization of $H_2O_2$ is a vital process to get better yield in practical CMP process. In this article the stability of Hydrogen Peroxide as oxidizer of Copper CMP slurry has been investigated. When alumina abrasive was used, $\gamma$-particle Alumina C had a better stability than $\alpha$-particle abrasive. As adding KOH as pH buffering agent, $H_2O_2$ stability in slurry decreased. Urea hydrogen peroxide was used as oxidizer, an enhanced stability was gotten. When $H_3PO_4$ as $H_2O_2$ stabilizer was added, the decrease of $H_2O_2$ concentration in slurry became slower. Even though adding $H_2O_2$ in slurry after bead milling lead to better stability than in advance of bead milling, it had a lower dispersibility.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.557-560
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• 2003

Magnetorheological finishing(MRF) is a newly developed and recently commercialized for finishing optical components. The magnetorheological fluid consists of a water based suspension of carbonyl iron, nonmagnetic polishing abrasives, and small amounts of stabilizer. This magnetorheological fluid is pumped from conditioner on the rotating wheel and suctioned back to the conditioner, where it cooled to setpoint temperature and evaporative losses are replaced. This method could produce some problems in suction. So newly designed MRF tools is proposed in which MR fluid is not circulated and conditioned by the slurry. The new polishing mechanism is experimented. Measured surface roughness supports the validity of this mechanism.

• Applied Chemistry for Engineering
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• v.17 no.1
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• pp.106-110
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• 2006

If drugs are made from nanoparticles, their formulations can be more effective than the conventional ones. Especially, water insoluble drugs having low absorption rates into our body could show improvement in their adsorption and bioavailability by decreasing their particle sizes to nanometers. In this study, polyvinylpyrrolidone (PVP) and various sugars were employed as stabilizers for the nanoparticles of a water insoluble drug, Itraconazole. Nanoparticles were successfully produced by the wet slurry process for five days. Then, spray drying converted the aqueous dispersions into dry powders, and the redispersibility of dried nanoparticles into water was investigated. The effects of temperature, pressure, and flow rate were studied to understand the importance of processing variables on redispersibility. It was found in particle size analysis that nanoparticles containing sugars have better redispersibility than those without sugars. Additionally, the mainly spherical morphology of dried nanoparticles was identified by SEM (Scanning Electron Microscopy) and AFM (Atomic Force Microscopy).