• Journal of Korean Tunnelling and Underground Space Association
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• v.19 no.3
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• pp.463-473
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• 2017

Bentonite swells when it comes into contact with water and makes it a viscous fluid. Thus it is widely used in civil engineering works for waterproofing. Utilizing the properties of bentonite, the slurry shield TBM supports excavated face with pressurized slurry as well as transporting excavated muck. When bentonite is in contact with seawater, due to the change of double layer thickness, its expandability and viscosity are lowered. This may cause problems for excavation stability and muck discharge due to the increase of sea water inflow when Slurry TBM is used under sea water conditions. In this study, the change of slurry condition caused by the inflow of sea water during tunnel excavation with Slurry TBM was investigated and a slurry management guideline was proposed. For this purpose, a laboratory test was carried out based on the slurry management criterions applied in the field, and a method applicable to the field where sea water is affected has been proposed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.1
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• pp.56-61
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• 2002

Porous clay ceramics was fabricated using the surfactant as a foaming agent in the secondary-clay produced at Young-Am area in Chun-Nam province. The concentration of surfactant in ceramic slurry was the key factor controlling the pore characteristics and physical properties of the porous ceramics. The more increase of the surfactant concentration increase the more foaming ability and the stability of foamed layer were improved, but the foaming ability was limited within 6.0 wt% of surfactant because the initial viscosity of the slurry increased with increasing the amounts of surfactant. The formed specimen were sintered at both $1150^{\circ}C$ and $1200^{\circ}C$, the porous ceramics showed 0.9 of specific gravity, 50% of water absorption, 45% of apparent porosity, 14% of shrinkage and 70 kg/$\textrm{cm}^2$ of compressive strength.

• Journal of Korean Tunnelling and Underground Space Association
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• v.13 no.4
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• pp.347-370
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• 2011

Slurry type shield would be very effective for the tunnelling in a sandy ground, when the slurry pressure would be properly adjusted. Low slurry pressure could cause a tunnel face failure or a ground settlement in front of the tunnel face. Thus, the stability of tunnel face could be maintained by applying an excess slurry pressure that is larger than the active earth pressure. However, the slurry pressure should increase properly because an excessively high slurry pressure could cause the slurry flow out or the passive failure of the frontal ground. It is possible to apply the high slurry pressure without passive failure if a horizontal impermeable layer is located in the ground in front of the tunnel face, but its location, size, and effects are not clearly known yet. In this research, two-dimensional model tests were carried out in order to find out the effect of a horizontal impermeable layer for the slurry shield tunnelling in a saturated sandy ground. In tests slurry pressure was increased until the slurry flowed out of the ground surface or the ground fails. Location and dimension of the impermeable layer were varied. As results, the maximum and the excess slurry pressure in sandy ground were linearly proportional to the cover depth. Larger slurry pressure could be applied to increase the stability of the tunnel face when the impermeable layer was located in the ground above the crown in front of the tunnel face. The most effective length of the impermeable grouting layer was 1.0 ~ 1.5D, and the location was 1.0D above the crown level. The safety factor could be suggested as the ratio of the maximum slurry pressure to the active earth pressure at the tunnel face. It could also be suggested that the slurry pressure in the magnitude of 3.5 ~4.0 times larger than the active earth pressure at the initial tunnel face could be applied if the impermeable layer was constructed at the optimal location.

• Journal of Korean Tunnelling and Underground Space Association
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• v.14 no.3
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• pp.261-275
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• 2012

This paper presents numerical analysis of the mud cake infiltration behaviour which is influenced tunnel face stability during excavation by slurry shield TBM. This analysis method can make useful data to select proper shield TBM type and to set up the construction plan. But effective analysis did not proposed until now. In this paper, we carried out numerical analysis using by $PFC^{2D}$ fluid coupling simulation which is suitable for sandy soil modelling. As a analysis result, we checked that the slurry infiltration behaviour varied with soil permeability and slurry characteristic(specific weight, viscosity etc). This analysis method is helpful safety excavation through anticipating the proper slurry viscosity at the design stage and verifying the slurry quality at initial excavation stage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1296-1300
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• 2004

SnO$_2$ is one of the most suitable gas sensor materials. The microstructure and surface morphology of films must be controlled because the electrical and optical properties of SnO$_2$ films depend on these characteristics. The effects of chemical mechanical polishing(CMP) on the variation of morphology of SnO$_2$ films prepared by RF sputtering system were investigated. The commercially developed ceria-based oxide slurry, silica-based oxide slurry, and alumina-based tungsten slurry were used as CMP slurry. Non-uniformities of all slurries met stability standards of less than 5 %. Silica slurry had the highest removal rate among three different slurries, sufficient thin film topographies and suitable root mean square(RMS) values.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.3
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• pp.175-184
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• 2001

In this study, the improved throughput and stability in device fabrication could be obtained by applying CMP process to STi structue in 0.18 um semiconductor device. To employ the CMP process in STI structure, the Reverse Moat Process used to be added after STI Fill, as a result, the process became more complex and the defect were seriously increased than they had been,. Removal rate of each thin film in STI CMP was not uniform, so, the device must have been affected. That is, in case of excessive CMP, the damage on the active area was occurred, and in the case of insufficient CMP nitride remaining was happened on that area. Both of them deteriorated device characteristics. As a solution to these problems, the development of slurry having high removal rate and high oxide to nitride selectivity has been studied. The process using this slurry afford low defect levels, improved yield, and a simplified process flow. In this study, we evaluated the 'High Selectivity Slurry' to do a global planarization without reverse moat step, and also we evaluated EPD(Eend Point Detection) system with which 'in-situ end point detection' is possible.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.9
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• pp.1001-1005
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• 2004

Rye-sensitized solar cell (DSSC) is a new class of solar cell, which consists of nanoporous TiO$_2$ electrode, dye-sensitizer, electrolyte, and counter electrode. Such cell is operated in sunlight via the principle of photosynthetic electrochemistry. In order to obtain the good dispersion of nano size TiO$_2$ particles In slurry, the pH of solvent, the sort and quantify of solvent additive and the quantity of surfactant were adjusted. As results, the lower the pH of solvent was the lower the viscosity of the slurry became. The addition of ethylene glycol and propylene glycol to dilute HNO$_3$ brought about the lowering of viscosity and the enhancement of stability in slurry. The addition of surfactant lowered the viscosity of slurry. It was possible to obtain the homogeneous and uniformly dispersed mesoporous TiO$_2$ film using the dilute HNO$_3$ solvent of pH 2 with the addition of ethylene glycol and neutral surfactant. DSSC was assembled with TiO$_2$ electrode and Pt electrode, and its photoelectric property was measured using the monochromatic wavelength in the rangee of 350∼700 nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP Process, deionized water (DIW) pressure, purified $N_2$ (P$N_2$) gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• Transactions on Electrical and Electronic Materials
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• v.4 no.6
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• pp.28-31
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• 2003

Copper CMP in terms of the effect of slurry chemicals (oxidizer, corrosion inhibitor, complexing agent) on the process characteristics has been performed. Corrosion inhibitors, benzotriazole (BTA) and tolytriazol (TTA) were used to control the removal rate and avoid isotropic etching. When complexing agent is added with H$_2$O$_2$ 2 wt% in the slurry, the corrosion rate was presented very well. In the case of complexing agent, it was estimated that the proper concentration is 1 wt%, because the addition of tartaric acid to alumina slurry causes low pH and the slurry dispersion stability become unstable. There was not much change of the removal rate. It was assumed that BTA 0.05 wt% is suitable. Most of all, it was appeared that BTA is possible to be replaced by TTA. TTA was distinguished for the effect among complexing agents.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.2
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• pp.618-629
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• 1991

The purpose of this experiment is to understand the distribution of coal particles inside CWM droplet which is believed to be a very important factor controlling the flame stability. CWM slurry is atomized by an air assisted twin fluid nozzle. An experimental rig is designed and fabricated. The mean size of coal particle distribution in CWM slurry, atomizing air pressure, coal particle loading in slurry and sampling position inside spray are main experimental variables. The atomized CWM droplets are sampled on the thin white layer of magnesium oxide by the emergency sampling shutter. The sampled coal particles on magnesium oxide layers are collected into test tubes and dispersed completely by Ultra-Sonicator. The size distribution of coal particles inside droplets are measured by Coulter Counter. The presence of coal particle inside the impressions of droplets on magnesium oxide layer are investigated by photo technique. There are quite many droplets which do not have any coal particles. Those are just water droplets, not CWM droplets. The population ratio of droplets without coal particles to toal number of droplets is strongly affected by the mean size of coal particle distribution in slurry and this ration becomes bigger number as the mean size of coal particles be larger. The size distribution of coal particles inside CWM droplets is not even and depends on the size of droplet. Experimental results show that the larger CWM droplets has droplets has bigger mean value of particle size distribution. This trend becomes more evident as the atomizing air pressure is raised and the mean size of coal particles in CWM slurry is bigger. That is, the distribution of coal particles inside CWM dropolets is very much affected by the atomizing air pressure and the mean size of pulverized coal particles in CWM slurry.