• 제목/요약/키워드: silicon ingot

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실리콘 단결정 잉곳용 석영유리 도가니의 brownish ring에 대한 연구 (A study on the brownish ring of quartz glass crucible for silicon single crystal ingot)

  • 정윤성;최재호;민경원;변영민;임원빈;노성훈;강남훈;김형준
    • 한국결정성장학회지
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    • 제32권3호
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    • pp.115-120
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    • 2022
  • 반도체 웨이퍼용 실리콘 잉곳 제조과정에서 사용되는 석영유리 도가니 내측표면의brownish ring (BR)에 대해 연구하였다. BR의 크기는 20~30 ㎛이고 비대칭 갈색 고리형태이다. 도가니 위치에 따라 BR의 크기와 분포가 상이하며, Si 잉곳 성장시 도가니 온도가 가장 높은 round 부가 가장 크고 많았다. BR은 석영유리보다 열팽창계수가 큰 cristobalite를 함유하고 있어 표면 crack이 나타나는 것으로 판단된다. BR의 발색 현상과 p in hole은 산소 결손에 의한 것으로 생각된다.

Wafer Sawing 공정의 폐슬러리로부터 금속 실리콘 회수에 관한 연구 (Recovery of Metallurgical Silicon from Slurry Waste)

  • 김종영;김응수;황광택;조우석;김경자
    • 한국세라믹학회지
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    • 제48권2호
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    • pp.189-194
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    • 2011
  • Metallurgical grade silicon was recovered from slurry waste for ingot sawing process by acid leaching and thermal treatment. SiC abrasive was removed by gravity concentration and centrifugation. Metal impurities were removed by the acid leaching using HF/HCl. The remaining SiC was separated by the thermal treatment at $1600^{\circ}C$ in an inert atmosphere by the difference in melting points. The purity of the obtained silicon was found to be around 99.7%.

실리콘 웨이퍼 연마헤드의 강제구동 방식이 웨이퍼 연마 평탄도에 미치는 영향 연구 (Effects of Forced Self Driving Function in Silicon Wafer Polishing Head on the Planarization of Polished Wafer Surfaces)

  • 김경진;박중윤
    • 반도체디스플레이기술학회지
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    • 제13권1호
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    • pp.13-17
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    • 2014
  • Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

Pulling rate, rotation speed 및 melt charge level 최적화에 의한 쵸크랄스키 공정 실리콘 단결정의 O2 불순물 최소화 설계 (A Czochralski Process Design for Si-single Crystal O2 Impurity Minimization with Pulling Rate, Rotation Speed and Melt Charge Level Optimization)

  • 전혜준;박주홍;블라디미르 아르테미예프;황선희;송수진;김나영;정재학
    • Korean Chemical Engineering Research
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    • 제58권3호
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    • pp.369-380
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    • 2020
  • 대부분의 단결정 실리콘 잉곳은 초크랄스키(Czochralski(Cz)) 공정으로 제조된다. 그러나 단결정 실리콘 잉곳을 제품화 및 태양 전지 기판으로 가공하였을 때 산소 불순물이 있는 경우 낮은 효율성을 나타내는 경향이 있다. 단결정 Si-잉곳의 생산을 위해서는 용융 Si를 녹인 다음 단결정 Si의 시드(Seed)로 결정화하는 초크랄스키(Cz) 공정을 도입한다. 용융된 다결정 Si-덩어리를 단결정 Si-잉곳으로 결정성장 될 때, 열 전달은 Cz-공정의 구조에서 중요한 역할을 한다. 본 연구에서 고품질 단결정 실리콘 잉곳을 얻기 위해 Cz-공정의 최적화된 설계를 구성하였다. 결정 성장 시뮬레이션로부터 결정성장을 위한 Pulling rate 및 Rotation speed에 최적의 변수값을 형성하기 위해 사용되었으며, 변형된 Cz-공정에 대한 연구 및 해당 결과가 논의되며 결정 성장 시뮬레이션을 사용하여 Cz-공정의 Pulling rate, Rotation speed 및 Melt charge level의 최적화된 설계로 인한 결정성장시 단결정 실리콘으로 유입되는 산소 농도 최소화를 설계하였다.

Bridgman법에 의한 금속급 다결정 Si의 결정성장 및 특성평가에 관한 연구 (Crystal Growth and Characterization of Metallurgical-grade Polycrystalline Silicon by the Bridgman Method)

  • 이창원;김계수;홍준표
    • 한국주조공학회지
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    • 제14권1호
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    • pp.28-34
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    • 1994
  • Metallurgical-grade polycrystalline silicon was directionally solidified at growth rates of $0.2{\sim}1.0mm/min$ by using split type, reusable graphite molds which were coated with $Si_3N_4$ powder. The resultant grain sizes of the silicon ingots and the shapes of the solid/liquid(S/L) interfaces were investigated. X-ray diffraction was used to determine the preferred orientation in each of the silicon ingots. The impurity content of the silicon was analyzed and the resistivities of the ingots were measured. During the growth of an ingot, the shape of the S/L interface was concave to the silicon melt, and the resistivity decreased. The presence of Al which can be acting as a carrier, is thought to be the main factor causing such a decrease in resistivity. When a growth rate of 0.2㎜/min was used, the preferred orientation was found to be (111).

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결정질 실리콘 기반 태양광산업에서의 근로자노출 가능 유해인자 (Workers' Possible Exposure Hazards in Solar Energy Industries)

  • 장재길;박현희
    • 한국태양에너지학회 논문집
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    • 제33권5호
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    • pp.24-33
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    • 2013
  • Renewable energy industries, including sola cell plants, has been ever increasing ones for reducing fossil fuel consumption and strengthening national energy policy. In this paper we tried to identify occupational health hazards in solar cell-related industries operated in Korea. Poly silicon, silicon ingot and wafer, solar cell and module are major processes for producing solar cells. Poly silicon operations may cause hazards to workers from metal silicon, silanes, silicon, hydro fluoric acid and nitric acid. Solar cells could not be constructed without using metals such as aluminum and silver, acids such as hydrofluoric acid and nitric acid, bases such as sodium hydroxide and potassium hydroxide, and solvent and phosphorus chloride oxide. Workers in module assembly process may exposed to isopropanol, flux, solders that contain lead, tin and/or copper. To prevent occupational exposure to these hazards, it is essential to identify the hazards in each process and educate workers in industries with proper engineering and administrative control measures.

실리콘 잉고트 절단 슬러지로부터 실리콘 및 실리콘카바이드 분리 회수 (Separation and Recovery of Silicon and Silicon Carbide from Slicing Sludge of Silicon Ingot)

  • 김병규;장희동;장원철
    • 한국자원리싸이클링학회:학술대회논문집
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    • 한국자원리싸이클링학회 2004년도 춘계임시총회 및 제23회 학술대회
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    • pp.186-190
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    • 2004
  • 실리콘 잉곳의 절단공정에서 발생하는 폐슬러지는 실리콘과 실리콘카바이드 등의 유가자원이 함유되어 있으며, 이를 효과적으로 분리, 회수하는 방법에 대해 검토하였다. 폐슬러지에 함유된 오일은 유기 용매에 의해 용해되어 효과적으로 분리되었고, 불순물인 철분은 자력선별에 의해 제거할 수가 있었다. 또한 실리콘과 실리콘카바이드의 혼합 분말은 중액선별을 통하여 고순도의 실리콘과 실리콘카바이드로 분리할 수가 있었다.

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일방향 응고법에 의한 단결정 Si의 결정성장에 관한 연구 (Crystal Growth of Polycrystalline Silicon by Directional Solidification)

  • 김계수;이창원;홍준표
    • 한국결정성장학회지
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    • 제3권2호
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    • pp.149-156
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    • 1993
  • Si과 흑연 주형사이에 release layer로서 $CaCl_2$를 사용하여 vold와 crack이 없는 건전한 다결정 Si ingot를 제조하였다. 원소재로서 merallurgical-grade Si를 사용하였으며, 결정성장속도와 응고분율에 따른 불순물농도변화, X-선 회절분석, 비저항측정등을 행하였다. X-선 회절분석 결과 R=0.5mm/min으로 성장된 다결정 Si의 우선성장방향은 (220)면이고, R=0.2mm/min의 경우 우선성장방향은 (111)면임을 확인하였다. 또한 결정성장속도 및 응고분율의 증가에 따라 비저항값은 감소하는 경향을 나타내었다.

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Interpretation of the Asymmetric Color and Shape of Brownish Ring in Quartz Crucible

  • Jung, YoonSung;Choi, Jae Ho;Min, Kyung Won;Byun, Young Min;Im, Won Bin;Kim, Hyeong-Jun
    • 반도체디스플레이기술학회지
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    • 제21권4호
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    • pp.50-52
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    • 2022
  • Brownish rings (BRs) with white interiors are formed during the manufacture of silicon ingots in quartz glass crucibles. These BRs inhibit the yield of silicon ingots. However, the composition and mechanism of the formation of these BRs remain unclear thus far. Therefore, in this study, we analyzed the color and shape of these BRs. Raman analysis revealed that the brown and white colors appear owing to oxygen deficiency rather than crystallization from excess oxygen supply as previously assumed. Moreover, the dark shade of the brown areas depends on the degree of oxygen deficiency and the asymmetrical width of the brown areas is attributed to the direction of the molten silicon flow, which is influenced by the rotation and heat of the ingot crucible.

Influence of KOH Solution on the Passivation of Al2O3 Grown by Atomic Layer Depostion on Silicon Solar Cell

  • 조영준;장효식
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.299.2-299.2
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    • 2013
  • We investigated the potassium remaining on a crystalline silicon solar cell after potassium hydroxide (KOH) etching and its effect on the lifetime of the solar cell. KOH etching is generally used to remove the saw damage caused by cutting a Si ingot; it can also be used to etch the rear side of a textured crystalline silicon solar cell before atomic layer-deposited Al2O3 growth. However, the potassium remaining after KOH etching is known to be detrimental to the efficiency of Si solar cells. In this study, we etched a crystalline silicon solar cell in three ways in order to determine the effect of the potassium remnant on the efficiency of Si solar cells. After KOH etching, KOH and tetramethylammonium hydroxide (TMAH) were used to etch the rear side of a crystalline silicon solar cell. To passivate the rear side, an Al2O3 layer was deposited by atomic layer deposition (ALD). After ALD Al2O3 growth on the KOH-etched Si surface, we measured the lifetime of the solar cell by quasi steady-state photoconductance (QSSPC, Sinton WCT-120) to analyze how effectively the Al2O3 layer passivated the interface of the Al2O3 layer and the Si surface. Secondary ion mass spectroscopy (SIMS) was also used to measure how much potassium remained on the surface of the Si wafer and at the interface of the Al2O3 layer and the Si surface after KOH etching and wet cleaning.

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