• Transactions of Materials Processing
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• v.20 no.3
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• pp.250-256
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• 2011

Vacuum-assisted thermoforming is one of the critical steps for the successful application of film insert molding(FIM) to parts of complex shapes. If the thickness distribution of the formed film is non-uniform, cracking, deformation, warping, and wrinkling can easily occur at the injection molding stage. In this study, the effects of processing parameters, which include the film heating time, plug depth, plug speed and vacuum delay time, on film thickness distribution were investigated. It was found that the film thickness at the part sidewall decreases with increasing the film heating time and plug depth, but the thickness at the bottom was found to exhibit the opposite behavior. The film thickness of the sidewall was observed to increase at higher plug speed and vacuum delay time of 0 ~ 0.3sec.

• 한국전산유체공학회:학술대회논문집
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• 2001.10a
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• pp.112-117
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• 2001

A numerical investigation is made of unsteady double-diffusive convection of a Boussinesq fluid in a rectangular cavity subject to time-periodic thermal excitations. The fluid is initially stratified between the top endwall of low solute concentration and the bottom endwall of high solute concentration. A time-dependent heat flux varying in a square wave fashion, is applied on one sidewall to induce buoyant convection. The influences of the imposed periodicity on double-diffusive convection are scrutinized. A special concern is on the occurrence of resonance that the fluctuations of flow and attendant heat and mass transfers are mostly amplified at certain eigenmodes of the fluid system. Numerical solutions are analyzed to illustrate the characteristic features of resonant convection.

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.476-481
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• 1999

Characteristics of platinum dry etching were investigated in a cryogenic magnetized inductively coupled plasma (MICP). The problem with platinum etching is the redeposition of sputtered platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned platinum structure produces feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape [1]. The main object of this study was to investigate a new process technology for fence-free Pt etching As bias voltage increased, the height of fence was reduced. In cryogenic etching, the height of fence was reduced to 20% at-$190^{\circ}C$ compared with that of room temperature, however the etch profile was not still fence-free. In Ar/$SF_6$ Plasma, fence-free Pt etching was possible. As the ratio of $SF_6$ gas flow is more than 14% of total gas flow, the etch profile had no fence. Chemical reaction seemed to take place in the etch process.

• Korean Journal of Crystallography
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• v.12 no.3
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• pp.166-170
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• 2001

Dopants implanted in silicon substrate affect the reaction between cobalt and silicon substrate. Phosphorous, unlike boron and arsenic, suppressing the reaction between cobalt and silicon induces CoSi formation during a low temperature thermal treatment instead of CoSi₂formation. The CoSi layer should move to the silicon substrate to fill the vacant volume that is generated in the silicon substrate due to the silicon out-diffusion into the cobalt/CoSi interface. The movement of CoSi at gate sidewall spacer region is suppressed by a cohesion between gate oxide and CoSi layers, resulting in a void formation at the gate sidewall spacer edge.

• Proceeding of Spring/Autumn Annual Conference of KHA
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• 2003.11a
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• pp.67-72
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• 2003

The present article evaluates a performance hall, which improves sound efficiency. In general, the sidewall of the music hall is plane circle. thus there happens a focus phenomenon. To overcome it. the music hall improves its sound efficiency by making its sidewall irregular. After measuring impulse response from the performance hall, evaluation indices on the temporal distribution of sound energy such as RT, EDT, D50, C80, RASTI and BR were obtained, and based on them, indoor acoustic characteristics and the generation of echoes were determined. According to the results, evaluation indices showed that the acoustic condition was satisfactory in general. This study is to provide fundamental data for acoustic design of music hall with round form by analyzing the room acoustic characteristics of music hall.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.438-445
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• 2000

Tire performance is significantly influenced by the cord tension distribution, and which is governed by the tire shape. To increase the tire performance, it is very important for one to find the shape with the ideal distribution of tension. But it is not easy to find such an optimal tire shape. Therefore, in order for the successful tire-shape optimization, we need to investigate how the change of tire shape influences on the cord tension. In this paper, we intend to numerically analyse the relation between the carcass shape and the cord tension.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.45-50
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• 2000

A numerical investigation is made of three-dimensional buoyant convection of a Boussinesq-fluid in a vertical cylinder. The top and bottom endwalls are thermally insulated. Flow is driven by the substantial azimuthal variations in thermal boundary conditions. Comprehensive numerical solutions to the Navier-Stokes equations are obtained. The representative Rayleigh number is large, thus, the overall flow pattern is of boundary layer-type. Three-dimensional (low characteristics are described. Specially, the global flow and the heat transfer features are delineated when the severity of azimuthal variation of sidewall temperature n, is intensified. Temperature and velocity fields on the meridional planes and the planes of constant height are presented. The global flow weakens as n becomes large. The pattern of the local Nusselt number on the surface of cylinder is similar regardless of n. The convective gain in heat transfer activities is reduced as n increases.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.332-332
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• 2015

Block Copolymer lithography는 deep nano-scale device 제작을 위한 기존의 top-down방식의 photo-lithography를 대체할만한 기술로 많은 연구가 진행되고 있다. polystyrene(PS)/poly-methyl methacrylate (PMMA)로 구성된 BCP의 nano-scale PS mask는 일반적인 플라즈마 공정에 쉽게 damage를 입는다. 중성빔 식각을 이용하여 식각 공정 중 발생하는 BCP의 degradation을 감소시키고, 비등방성 식각 profile을 얻을 수 있으며 sidewall roughness(SWR)와 sidewall angle(SWA)가 향상되는 것을 알 수 있었다.

• Steel and Composite Structures
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• v.1 no.1
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• pp.131-144
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• 2001

Overpressurization can occur due to the ignition of flammable vapors existing inside aboveground oil storage tanks. Such accidents could happen more frequently than other types of accident. In the tank design, when the internal pressure increases, the sidewall-to-roof joint is expected to fail before failure occurs in the sidewall-to-bottom joint. This design concept is the socalled "frangible roof joint" introduced in API Standard 650. The major failure mode is bifurcation buckling in this case. This paper presents the bifurcation buckling pressures in both joints under internal pressure. Elastic and elastic-plastic axisymmetric shell finite element analysis was performed involving large deformation in the prebuckling state. Results show that API Standard 650 does not evaluate the frangible roof joint design conservatively in small diameter tanks.

• ETRI Journal
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• v.36 no.4
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• pp.617-624
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• 2014

Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.