• Title/Summary/Keyword: shear property

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Material Property Estimation of Paper for Dynamic Behavior Simulation (동적 거동 시뮬레이션을 위한 종이의 물성치 추정)

  • Lee, Geun-Pyo;Choi, Jin-Hwan;Lee, Soon-Geul
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.5
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    • pp.103-111
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    • 2008
  • This study proposes a technique to estimate the material property of a paper by using an experimental methods and commercial CAE software. Under gravitation, if one side of the paper is attached to the ground, the opposite side of paper is largely deformed, and vibrates freely. Since the paper has an orthotropic characteristic due to its treatment, the deformations in two orthogonal directions of the dry paper are different. An experimental method to measure the static deformation of the paper introduces this phenomenon. And dynamic behavior, frequency of free vibration is measured. And then. virtual prototypes that can represent the static and dynamic behavior are modeled by using the commercial CAE software $RecurDyn^{MT}$/MTT3D, which has been widely used by the printer makers. While comparing the deformation and frequency from the experiment and simulation, a design optimization technique in the commercial CAE software of R-INOPL, $RecurDyn^{TM}$/AutoDesign is used to estimate the material property such as Young's modulus, shear modulus and density of the paper.

A Sliding Mode Control for an Engine Mount Using Magneto-Rheological Fluid (MR유체를 이용한 엔진마운트의 슬라이딩모드제어)

  • 이동길;안영공;정석권;양보석
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2001.11b
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    • pp.1144-1149
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    • 2001
  • In this paper, a sliding mode controller of a fluid engine mount using MR (Magneto-Rheological) fluid was discussed When the MR fluid is applied to a fluid mount, resistance of MR fluid can be controlled by electro-magnetic valve installed in the inertia track. Since the rheological property of the MR fluid shows a function of shear rate, the damping characteristics of the mount will be change according to the frequency. Changing an applied magnetic field to the valve changes the property of the mount, such as the resistance of the MR fluid, the notch and the resonant frequencies due to the fluid passing, quantity of the fluid passing, the effective piston area of the volumetric damping and stiffness. Therefore, the fluid mount using MR fluid can be regarded as a variable structure system The sliding mode control known well as a particular type of variable structure control was introduced in this study. The sliding mode control, which has inherent robustness, is also expected to improve the control performance in the engine mount The sliding mode controller for the mount formatted by taking into account the response property with a time constant to MR fluid and the variable mount property. The motion equations of the fluid mount are derived from Newton's law of motion and used in numerical simulation. Numerical simulations illustrate the effectiveness of the sliding mode controller.

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Optimization of Soldering Process of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Alloys for Solar Combiner Junction Box Module (태양광 접속함 정션박스 모듈 적용을 위한 Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In 솔더링의 공정최적화)

  • Lee, Byung-Suk;Oh, Chul-Min;Kwak, Hyun;Kim, Tae-Woo;Yun, Heui-Bog;Yoon, Jeong-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.3
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    • pp.13-19
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    • 2018
  • The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

A Case Study of Sediment Transport on Trenched Backfill Granular and Cohesive Material due to Wave and Current

  • Choi, Byoung-Yeol;Lee, Sang-Gil;Kim, Jin-Kwang;Oh, Jin-Soo
    • Journal of Advanced Research in Ocean Engineering
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    • v.2 no.2
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    • pp.86-98
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    • 2016
  • In this study, after the installation of a subsea pipeline, backfilling was performed in the trenched area. During these operations, a stability problem in the subsea pipeline occurred. The pipeline was directly impacted by environmental loading such as waves and currents that were caused by backfill material when scouring or sediment transport and siltation was carried out. Therefore, this study reviewed whether trenching was necessary, and conducted research into an indigenous seabed property that contains granular soil. A study of cohesive soil was also conducted in order to cross-correlate after calculating the values of the critical Shields parameter relevant to elements of the external environment such as waves and current, and the shear Shields parameter that depends on the actual shearing stress. In case of 1), sedimentation or erosion does not occur. In the case of 2), partial sedimentation or erosion occurs. If the case is 3), full sedimentation or erosion occurs. Therefore, in the cases of 1) or 2), problems in structural subsea pipeline stability will not occur even if partial sedimentation or erosion occurs. This should be reflected particularly in cases with granular and cohesive soil when a reduction in shear strength occurs by cyclic currents and waves. In addition, since backfilling material does not affect the original seabed shear strength, a set-up factor should be considered to use a reduced of the shear strength in the original seabed.

Nail Shear Performance of Structural Members with OSB (오에스비에 대한 각종 부재의 못전단성능)

  • Hwang, Kweonhwan;Park, Moon-Jae
    • Journal of the Korean Wood Science and Technology
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    • v.36 no.4
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    • pp.66-76
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    • 2008
  • Recently, demands for the structural uses with domestic Japanese larch and SPF(spruce-pine-fir) lumber from North America have been increased. Shear properties of nailed joints that are the most simple and optimum fastening method in wooden constructions, especially in light frame construction. For the nailed joints, in North America and Japan, a number of basic and practical studies have been performed. The shear behaviors for the double nailed joint with variations of member and its direction, were examined. Shear properties of the shear specimens with SPF stud showed more remarkable variation than larch glulam and larch stud. Furthermore, the relationships between slip modulus and strength are not coincided in every case.

Shear Strength Property of Wood Treated by Steam Treatment at High Temperature (고온수증기처리 목재의 전단강도 특성)

  • Kim, Jung-Hwan;Lee, Weon-Hee;Kim, Jong-Man
    • Journal of the Korean Wood Science and Technology
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    • v.29 no.4
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    • pp.9-15
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    • 2001
  • This study deals with shear strength test for Pinus densiflora and Pinus radiata treated at above $100^{\circ}C$ by heat steam. Treatment conditions of this experiment were operated at regular intervals of $20^{\circ}C$ at temperatures up to $200^{\circ}C$ for 5, 10, 20 and 30 minutes by using the steam-explosion apparatus. It was examined, at high temperatures, degradation of some compounds from wood composition could lead to reduced the shear strength through heat steaming processes and play a large part in the plastic process of solid wood materials. It could be estimated that the shear strength of woods were gradually reduced by heat steaming time. Remarkable reduction of shear strength of woods was observed with increasing steaming temperatures above 10 minutes steaming time. Furthermore, this phenomenon shows a tendency to increase with higher temperatures. Therefore, it was considered that the softening by steaming treatment at high temperatures is necessary for the improvement on the wood processing ability.

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Determination of Shear Wave Velocity Profile under Existing Building for Site Response Analysis Using HWAW Method (HWAW방법을 이용한 기존 건물 내진 보강을 위한 건물 하부지반 전단파 속도 주상도 결정)

  • Park, Hyung-Choon;Hwang, Hea-Jin
    • Journal of the Korean Geotechnical Society
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    • v.33 no.5
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    • pp.15-23
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    • 2017
  • The evaluation of earthquake load on the surface is very important factor for the seismic reinforcement of existing building, and the magnitude of earthquake load depends on a shear wave velocity profile of soil under a building. To determine a shear wave velocity profile under a existing building, test method should be able to determine a reliable shear wave velocity profile under conditions such as heavy background noise and the small test area, and be sensitive to the variation of material property. In this research, HWAW (Harmonic Wavelet Analysis of Waves) method is applied to determine a shear wave velocity profile under a existing building. In this paper, through numerical simulations and field tests, the feasibility of the proposed method was shown.

Influence of ultrasonic impact treatment on microstructure and mechanical properties of nickel-based alloy overlayer on austenitic stainless steel pipe butt girth joint

  • Xilong Zhao;Kangming Ren;Xinhong Lu;Feng He;Yuekai Jiang
    • Nuclear Engineering and Technology
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    • v.54 no.11
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    • pp.4072-4083
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    • 2022
  • Ultrasonic impact treatment (UIT) is carried out on the Ni-based alloy stainless steel pipe gas tungsten arc welding (GTAW) girth weld, the differences of microstructure, microhardness and shear strength distribution of the joint before and after ultrasonic shock are studied by microhardness test and shear punch test. The results show that after UIT, the plastic deformation layer is formed on the outside surface of the Ni-based alloy overlayer, single-phase austenite and γ type precipitates are formed in the overlayer, and a large number of columnar crystals are formed on the bottom side of the overlayer. The average microhardness of the overlayer increased from 221 H V to 254 H V by 14.9%, the shear strength increased from 696 MPa to 882 MPa with an increase of 26.7% and the transverse average residual stress decreased from 102.71 MPa (tensile stress) to -18.33 MPa (compressive stress), the longitudinal average residual stress decreased from 114.87 MPa (tensile stress) to -84.64 MPa (compressive stress). The fracture surface has been appeared obvious shear lip marks and a few dimples. The element migrates at the fusion boundary between the Ni-based alloy overlayer and the austenitic stainless steel joint, which is leaded to form a local martensite zone and appear hot cracks. The welded joint is cooled by FA solidification mode, which is forming a large number of late and skeleton ferrite phase with an average microhardness of 190 H V and no obvious change in shear strength. The base metal is all austenitic phase with an average microhardness of 206 H V and shear strength of 696 MPa.

Shear correction factors of a new exponential functionally graded porous beams

  • Mohammed Sid Ahmed Houari;Aicha Bessaim;Tarek Merzouki;AhmedAmine Daikh;Aman Garg;Abdelouahed Tounsi;Mohamed A. Eltaher;Mohamed-Ouejdi Belarbi
    • Structural Engineering and Mechanics
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    • v.89 no.1
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    • pp.1-11
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    • 2024
  • This article introduces a novel analytical model for examining the impact of porosity on shear correction factors (SCFs) in functionally graded porous beams (FGPB). The study employs uneven and logarithmic-uneven modified porosity-dependent power-law functions, which are distributed throughout the thickness of the FGP beams. Additionally, a modified exponential-power law function is used to estimate the effective mechanical properties of functionally graded porous beams. The correction factor plays a crucial role in this analysis as it appears as a coefficient in the expression for the transverse shear stress resultant. It compensatesfor the assumption that the shear strain is uniform across the depth of the cross-section. By applying the energy equivalence principle, a general expression for static SCFs in FGPBs is derived. The resulting expression aligns with the findings obtained from Reissner's analysis, particularly when transitioning from the two-dimensional case (plate) to the one-dimensional case (beam). The article presents a convenient algebraic form of the solution and provides new case studies to demonstrate the practicality of the proposed formulation. Numerical results are also presented to illustrate the influence of porosity distribution on SCFs for different types of FGPBs. Furthermore, the article validates the numerical consistency of the mechanical property changesin FG beams without porosity and the SCF by comparing them with available results.

Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB (Sn-58Bi Solder와 OSP 표면 처리된 PCB의 접합강도에 미치는 시효처리와 에폭시의 영향)

  • Kim, Jungsoo;Myung, Woo-Ram;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.97-103
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    • 2014
  • Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.