• 한국정밀공학회지
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• 제21권8호
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• pp.152-156
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• 2004

A new tool of surface patterning technique for general purpose lithography was developed based on shadow mask method. This paper describes the fabrication of a new type of miniaturized shadow mask. The shadow mask is fabricated by photolithography and etching of 100-mm full wafer. The fabricated shadow mask has over 388 membranes with apertures of micrometer length scale ranging from 1${\mu}{\textrm}{m}$ to 100s ${\mu}{\textrm}{m}$ made on each 2mm${\times}$2mm large low stress silicon nitride membrane. It allows micro scale patterns to be directly deposited on substrate surface through apertures of the membrane. This shadow mask method has much wider choice of deposit materials, and can be applied to wider class of surfaces including chemical functional layer, MEMS/NEMS surfaces, and biosensors.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.318-321
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• 2005

FIB (Focused ion Beam) milling on a 500-nm-thick silicon nitride membrane was studied in order to fabricate a high-resolution shadow mask, or called a nanostencil. The silicon nitride membrane was fabricated by MEMS processes of LPCVD, photolithography, ICP etching and bulk silicon etching. The apertures made by FIB milling and normal photolithography were compared. The square metal pattern deposited through FIB milled shadow mask showed 6 times smaller comer radius than the case of photolithography. The results show high resolution patterning could be achieved by local deposition through FIB milled shadow-mask.

• 소성∙가공
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• 제12권2호
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• pp.123-127
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• 2003

The cold rolling conditions for the ultra thin steel for tension mask are very important because the residual stress that affects the flatness of strip is generate during the cold rolling. The residual stress in the sheet causes etching curls when it suffers perforation process. The residual stress through the thickness. To estimate the residual stress and deformation due to etching curl. FEM analysis is performed. Numerical simulation employ a ANSY5 5.6 and an elastic-plastic constitutive equation. The simulation results indicate the distribution of residual stress in the rolled sheet can be controlled by selecting the rolling conditions properly.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1164-1167
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• 2003

Recently CRT is getting flatted, As change of CRT trend from normal type to Flat type, the material of Shadow Mask was also changed from AK(Aluminum Killed) to Invar(Fe-Ni alloy) materials Until now we have used just AK(Aluminum Killed) for normal type TV(not flat type), but main raw material of shadow mask component was changed. . However recently Invar(Fe-Ni alloy) materials, which has advantage of Low Thermal Expansion and High Strength, has been developed as well as applying in mass production as CRT's trend has become more flat and fine pitch. As main raw material of shadow mask component was changed, conditions of process were changed. One of them, the importance of pre-etching process (assistant process for developing & etching) is improved because there are so many particles in the pre-etching bath because of Ni compounds. Since the solubility of Ni in pre-etching solvent is very low related to Fe's, so the compounds of Ni happen to make particles.(the solubility of Fe is twenty times Ni's) that particles happen to make process troubles and NG productions so to clear the particles we had to established high cost filtering system, but it is useless. As time goes by the quantity of particles (Ni compounds) was increased because of the capability of filtering system was not enough, the particles was produced continuous in bath, and it make quality problems. Hence we tried to develop the new pre-etching solution to remove the particles (Ni compounds) and to cost down the filtering system's running cost. But in improving the solution we discovered the new pre-etching solution made the PR developing better. In former solution there were three kinds of chemistry (COOH)2 , H2O2 , H2S04 .first the function of (COOH)2 is drilling the surface of Invar, during this mechanism Ni compounds occurred. Second the function of H202 is removing the PR fringe (half UV exposure zone on PR(PVA)), Third the function of H2S04 is the catalysis of (COOH)2 In those, (COOH)2 was the main reason to make the Ni compounds. So to improve the solutions we had to change (COOH)2 to the other material. the chemistry we improved was a complex chemistry based on H2S04 . after using this chemistry the particles problem was disappeared and there was another advantage cut down the PR fringe. The New solution made the function of H202 better so the PR developing improved. To be direct the catalyst of the new solution helped the H202. anyway First thing after change the solution the quality of shadow Mask for flat color TV was improved & the yield also improved. But the more important thing is how to control the new solution. So we accepted the new concept which was the degree of freshness. The degree of freshness is based on non-reacted solution which was 100% ( the degree of freshness) and calculated the melted Ni quantity as time goes by. So we made the gauging liner plot. In conclusion, many companies tried to make fine pitched Shadow Mask ,generally to make quality jump up it needed a lot of cost & persons .in this case the shift of core material made it possible.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1277-1280
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• 2005

A high-aspect-ratio and high-resolution stainless steel shadow mask for organic thin-film transistors (OTFTs) circuit has been fabricated by a new method which combines photochemical machining, micro-electrical discharge machining (micro-EDM), and electrochemical etching (ECE). First, connection lines and source-drain holes are roughly machined by photochemical etching, and then the part of source and drain holes is finished by the combination of micro-EDM and ECE processes. Using this method a $100\;\mu{m}$ thick stainless steel (AISI 304) shadow mask for inverter can be fabricated with the channel length of $30\;\mu{m}\;and\;10\;\mu{m}\;respectively.\;The\;width\;of\;connection line\;is\;150\;\mu{m}$. The aspect ratio of the wall is about 5 and 15, respectively. Metal lines and source-drain electrodes of OTFTs were successfully deposited through the fabricated shadow mask.

• 청정기술
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• 제13권3호
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• pp.188-194
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• 2007

급속한 성장에 따른 디스플레이 산업에서의 생산량 증가는 원료 사용의 증가와 배출액의 증가를 야기하고 있으며 이에 따른 폐액 처리양이 증가되어 환경적, 경제적 문제점을 안고 있다. 본 연구에서는 브라운관 소재인 shadow mask의 식각공정 시 사용한 식각용액의 피로도를 감수시키기 위하여 산화반응을 이용하여 신액 사용량과 구액 배출량을 최소화해주는 GRS(Green Recycling System)공정의 수율을 향상시키기 위해 실험실 및 현장적용 실험을 통하여 공정의 최적화를 하기위한 방법을 연구하였다. 공정변수들과 GRS 공정의 수율과의 관계를 규명하였으며 GRS 반응기의 내부구조 개선으로 인해 약 10%의 수율증가를 확인하였으며 공정의 수율 향상과 최적화에 큰 도움이 되었다.

• ETRI Journal
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• 제27권1호
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• pp.89-94
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• 2005

This paper describes a low-loss, compact, 40-channel arrayed waveguide grating (AWG) which utilizes a monolithically integrated spot-size converter (SSC) for lowering the coupling loss between silica waveguides and standard single-mode fibers. The SSC is a simple waveguide structure that is tapered in both the vertical and horizontal directions. The vertically tapered structure was realized using a shadow-mask etching technique. By employing this technique, the fabricated, 40-channel, 100 GHz-spaced AWG with silica waveguides of 1.5% relative index-contrast showed an insertion-loss figure of 2.8 dB without degrading other optical performance.

• Korean Chemical Engineering Research
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• 제48권2호
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• pp.157-163
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• 2010

CRT 용 shadow mask의 생산속도 향상을 위해 첨가제를 투입한 염화제이철 수용액을 개발하였고 이를 shadow mask의 식각속도 향상에 적용하였다. $Fe(ClO_4)_3$ 첨가제를 종래의 식각용액인 염화제이철 수용액에 투입한 결과, shadow mask의 식각속도가 크게 향상되었으며, 이때 첨가제의 농도가 증가할수록 식각속도가 증가함을 알 수 있었다. 또한 첨가제가 투입된 식각용액으로 순수 니켈과 철-니켈 합금(Invar 강)의 식각속도를 비교한 결과, 대부분의 공정조건에서 둘 사이의 식각속도 차이가 작음을 알 수 있었고, 이는 첨가제의 투입에 따라 니켈과 철의 식각속도가 모두 향상된 결과로 해석되었다. 첨가제의 주입에 따라 식각속도가 증가하는 이유는, 첨가제 내의 음이온인 $ClO^{4-}$가 염화제이철 수용액 내의 $Cl^-$에 비해 전자를 이동하는 가교로서의 역할이 우수하여 전자를 더 빠르게 이동시킬 수 있기 때문인 것으로 추정된다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 춘계학술대회 논문집
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• pp.195-198
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• 2002

Residual stress of sheet occurs during cold rolling and it is hard to avoid and inevitable. The residual stress in the sheet cause etching curls when it suffers peroration process. The residual stress through the thickness direction in the sheet is a function of a friction coefficient, total reduction, mil size and initial sheet thickness. To estimate the residual stress and deformation due to etching curl, FEM analysis is performed. A numerical analysis is used a ANSYS 5.6 and an elastic-plastic constitutive equations. rho simulation results indicate a distribution of residual stress.

• 기술혁신학회지
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• 제7권3호
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• pp.641-656
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• 2004

L Company is producing the second sept pin, Shadow Mask which is the chief part of CRT in W, Monitor. Inside of the CRT pan, Shadow Mask leads the electronic beam to express the three primary colors; red, green, blue, and it is the core part to embody the colors. In the etching process, it produces this part with manufacturing by eroding the iron chloride. Even though the iron chloride is harmless to human body. it is necessary to diminish the amount of it on the view of preservation of environment. In addition, by studying the method of the dispossed liquid process, cutting down the manufacturing cost is a necessary task on the aspect of reconsideration of competitive business. This study shows the case that through the six sigma innovation activity, it reforms the following the former processing flow, and it reduces the amount of it by improving the efficiency of the iron chloride. By rationalization of the standard requirement cooperative company, it could cut down the manufacturing cost in the cooperative company, so it could promote the common profits.