• Journal of Sensor Science and Technology
• /
• v.27 no.5
• /
• pp.300-305
• /
• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of Sensor Science and Technology
• /
• v.21 no.2
• /
• pp.121-126
• /
• 2012

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is $200{\mu}m$ and $190{\mu}m$, respectively. The gap between sensing elements is only $10{\mu}m$. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with $10{\mu}m$ alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.4
• /
• pp.49-55
• /
• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.9-17
• /
• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.30 no.3
• /
• pp.236-243
• /
• 2010

Fiber Bragg grating(FBG) sensor arrays can be used to monitor the mechanical behavior of the large composite structures such as wind turbine rotor blades and aircrafts. However, brittle FBG sensors, especially multiplexed FBG sensors are easily damaged when they are installed in the flexible structures. As a protection of brittle FBG sensors, epoxy packaged FBG sensors have been presented in this paper. Finite element analysis and experiments were performed to evaluate the effects of adhesives, packaging materials and the bonding layer thickness on the strain transmission. Two types of epoxy were used for packaging FBG sensors and the sensor probes were attached with various bonding layer thickness. It was observed that thin bonding layer with high elastic modulus ratio of the adhesive to packaging provided good strain transmission. However, the strain transmission was significantly decreased when elastic modulus of the adhesive was much lower than the packaged FBG sensor probe's one.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.14 no.1
• /
• pp.15-22
• /
• 2008

The excitement over radio frequency identification (RFID) technology has gained momentum in the last five years, with a diversification in the range of applications. Besides academic research into radio frequency identification (RFID) has proliferated over the last few years, however there is much to be desired on Packaging industry. In this paper, we present a literature reviews of researches of RFID system on Packaging, especially focused on RFID system standardization into packaging. There is not any packaging standard or guidance about tag locations, classification with the materials and so on. Therefore it hampers reduction of the distribution costs on political and corporate sides, and lack consistency of applying RFID system. The main focus of this review paper is to establish a constituency about legislating RFID system standard on packaging. It is hoped that the review will be a good resource for future research in order to applly RFID system to Packaging industry effectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.2
• /
• pp.65-69
• /
• 1998

본 연구는 전하 결합 영양소자에서 감지회로의 특성을 향상시키기 위하여 N형 MOSFET과 Polysilcon 저항에 의한 전압 분배 회로를 가진 감지회로를 설계하였다. 감지회 로에 흐르는 전류는 전압분배회로를 N형 MOSFET으로 설계하였을때가 Polysilicon 저항으 로 설계한 경우보다 감도 특성도 좋은 것으로 나타났다. 이는 전압분배회로를 Polysilicon으 로 설계한 경우보다 N형 MOSFET으로 설계하였을 때 동작 주파수가 높을수록 전압이득 특성이 우수하기 때문이다. 감지회로에 흐르는 전류는 전압분배회로를 N형 MOSFET으로 설계하였을 때 2mA 정도를 나타내고 polysilcon으로 설계하였을 때 4mAwjd도로 나타났다.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.1
• /
• pp.17-21
• /
• 2019

In this paper, a high precision straightness measurement system has been developed at low cost using a visible laser and CMOS image sensor. CMOS image sensor detected optical image and the variation of straightness was calculated by image processing. We have observed that the error of the developed straightness measurement system was 0.9% when a distance of 3m between laser and image sensor. And it can be applied to 3D printer and any other areas.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.51-56
• /
• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.3
• /
• pp.57-65
• /
• 2003

In this study, we carry out reliability tests and investigate the failure mechanisms of the anodically bonded wafer level vacuum packaging (WLVP) MEMS gyroscope sensor. There are three failure mechanisms of WLVP: leakage, permeation and out-gassing. The leakage is caused by small dimension of the leak channel through the bonding interface and internal defects. The larger bonding width and the use of single crystalline silicon can reduce the leak rate. Silicon and glass wafer itself generates a large amount of outgassing including $H_2O$, $C_3H_5$, $CO_2$, and organic gases. Epi-poly wafer generates 10 times larger amount of outgassing than SOI wafer. The sandblasting process in the glass increases outgassing substantially. Outgassing can be minimized by pre-baking of the wafer in the vacuum oven before bonding process. An optimum pre-baking temperature of the wafers would be between $400^{\circ}C$ and $500^{\circ}C$.