• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.100-105
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• 2020

Recently, as display and semiconductor devices have been miniaturized and highly integrated, there is a demand for optimization of the structural characteristics of the thin film accordingly. The sputtering device has the advantage of stably obtaining a desired thin film depending on the material selected for the target. However, due to the structural characteristics of the sputtering equipment, the structural characteristics of the film may be different depending on the incidence angle of the sputtering target material to the substrate. In this study, the characteristics of the thin film material according to the scattering angle of the target material and the incidence position of the substrate were studied to find the optimization design rule of the sputtering equipment. To this end, a Si thin film of 1 ㎛ or less was deposited on the Si(100) substrate, and then the microstructure, reflectance, surface roughness, and thin film crystallinity of the thin film formed for each substrate location were investigated. As a result of the study, it was found that as the sputter scattering angle increased and the substrate incident angle decreased, the gap energy along with the surface structure of the thin film increased from 1.47 eV to 1.63 eV, gradually changing to a non-conductive tendency.

• 전기학회논문지
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• 제57권4호
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• pp.692-699
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• 2008

Semiconductor research and development(R&D) fabs are very different than production fabs in many ways such as the scales of production, job priority, production methods, and performance measures. Efficient operations of R&D fabs are very important to the development of new product, process stability, high yield, and ultimately company competitiveness. This paper proposes the fab-wide scheduling method for operational optimization of the R&D fabs. Most scheduling systems of semiconductor fabs have only focused on maximizing throughput of each separated areas without considering WIP(works in process) flows of entire fab. In this paper, we proposes the a fab-wide scheduling system which schedules all lots to entire fab equipment at once. We develop the MIP(mixed integer programing) model which allocates the lots to production equipment considering many constraints of all processes and the CP(constraint programming) model which determines the sequences of the lots in the production equipment. The proposed FAB-wide scheduling model is applied to the newly constructed R&D fab. As a result, we have accomplished the system based automated job reservation, decrease of the hot lot delay, increase of the queue time satisfaction, the high throughput by maximizing the batch sizes, decrease of the WIP TAT(Turn Around Time).

• 한국전산구조공학회논문집
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• 제17권3호
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• pp.241-249
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• 2004

자동반송 시스템인 천장용 호이스트 이송장치는 천장을 반송공간으로 반도체 웨이퍼를 운반하는 장치이며, 분진이나 소음 및 진동에 대단히 민감하다. 구동부와 레일의 접촉에 의해서 발생되는 마찰, 분진 소음 등의 문제를 최소화시키고 구동부와 이재부의 자중에 따른 구조물 자체의 안정성 검토를 수행하기 위해서 레일의 구조해석 및 최적설계가 필요하다. 본 연구에서는 구동부의 자중에 의한 레일의 기울기를 관심영역으로 설정하고, 변위 및 기울기를 최소화시키기 위해서 위상최적화, 근사 최적화 기법을 도입하여 최적화를 수행하였다. 구조해석은 ANSYS를 이용하였고, 3D 모델링은 Pro/Engineer를 이용하였다. 최적화 알고리즘은 수렴성이 높은 순차 이차 계획법인 PLBA(Pshenichny-Lim-Belegundu-Arora) 알고리즘을 사용하였다.

• 반도체디스플레이기술학회지
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• 제14권2호
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• pp.47-52
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• 2015

In this paper, the performance of uncoated- and Titanium nitride aluminium TiAlN-PVD coated- carbide twist drills were investigated when drilling aluminium alloy, Al 6061. This research focuses on the optimization of drilling parameters using the Taguchi technique to obtain minimum surface roughness and thrust force. A number of drilling experiments were conducted using the L9 orthogonal array on a CNC vertical machining center. The experiments were performed on Al 6061 material l blocks using uncoated and coated HSS twist drills under dry cutting conditions. Analysis of variance(ANOVA) was employed to determine the most significant control factors. The main objective is to find the important factors and combination of factors influence the machining process to achieve low surface roughness and low cutting thrust force. From the analysis of the Taguchi method indicates that among the all-significant parameters, feed rate are more significant influence on surface roughness and cutting thrust than spindle speed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.304-307
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• 2003

Replacement of aluminum by copper for interconnections in the semiconductor industry has raised a number of important issues. The integration of copper interconnection can be carried out by CMP(chemical mechanical polishing) is used to planarize the surface topography. In this experiments, we evaluated the optimization of several conditions for chemical additives during Cu CMP process. It was presented that the main cause of grown particle size is tartaric acid. The particle size was in inverse propotion to a quantity of bead and the time of milling process. The slurry stabilizer and oxidizer have been shown to have very good effect by addition in later milling process.

• 반도체디스플레이기술학회지
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• 제16권1호
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• pp.59-64
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• 2017

The general manufacturing problem can be described as the achievement of a predefined product quality with given equipment, cost and time constraints. Unfortunately, for some quality characteristics of a product such as surface roughness it is hard to ensure that these requirements will be met. Stainless steels STS 304 is frequently used as shaft materials in small fiber reinforced polymer(FRP) fishing boats. In this work, the dry turning parameters of STS 304 are optimized by using Taguchi method. The experiments were conducted at three different cutting speeds with three different feed and three different depth of cut. The cutting parameters are optimized using signal to noise ratio and the analysis of variance. The effects of cutting speed and feed on surface roughness was analyzed. The results revealed that the spindle speed is the more significant parameter influencing the surface roughness.

• 반도체디스플레이기술학회지
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• 제18권3호
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• pp.127-132
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• 2019

This paper presents an overview of automotive communication technologies, including related technology developments. We describe the latency of Audio Video Bridge (AVB) network as well as purpose the optimized design of the Ethernet network system for automotive. Our design plays a significant role in reducing the delay between components. The proposed approach on realistic test cases showed that there was a delay reduction, approximately 49.4%. It is expected that the optimization method for the actual automotive environment can greatly shorten the time period in the design and development process. The results obtained from the experiments on the delay time present in each function are reliable because average values are obtained through repeated actual tests for several months. It will greatly benefit the industry since analyzing the latency between each function in a short period of time is very important.

• 반도체디스플레이기술학회지
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• 제7권1호
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• 반도체디스플레이기술학회지
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• 제14권4호
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• pp.78-83
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• 2015

The method of electrical discharge machining (EDM), one of the processing methods based on non-traditional manufacturing procedures, is gaining increased popularity, since it does not require cutting tools and allows machining involving hard, brittle, thin and complex geometry. Modern ED machinery is capable of machining geometrically complex or hard material components, that are precise and difficult-to-machine such as heat treated tool steels, composites, super alloys, ceramics, etc. This paper reports the results of an experimental investigation by Taguchi method carried out to study the effects of machining parameters on material surface roughness in electric discharge machining of SM45C. The work material was ED machined with graphite and copper electrodes by varying the pulsed current, voltage and pulse time. Investigations indicate that the surface roughness is strongly depend on pulsed current.

• 반도체디스플레이기술학회지
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• 제18권2호
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• pp.17-22
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• 2019

The method of electrical discharge machining (EDM), one of the processing methods based on non-traditional manufacturing procedures, is gaining increased popularity, since it does not require cutting tools and allows machining involving hard, brittle, thin and complex geometry. This present investigation details the determination of optimum process parameter to attain the better machining performance in EDM of AISI 4340 steel with graphite as a tool electrode. The experimental combinations are planned and analyzed by Taguchi's design of experiments approach. To predict the optimal condition, the experiments are conducted by using Taguchi's L27 orthogonal array. The influence of process variables such as discharge current, pulse on and pulse off time, voltage and spark speed were investigated to control the various desired performance measures such as surface roughness. Analysis of Variance (ANOVA) has to be performed to know the magnitude of each factor. Investigations indicate that the surface roughness is strongly depend on pulsed current.