• IE interfaces
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• v.21 no.2
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• pp.229-236
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• 2008

Recently, ubiquitous computing paradigm considers as a tool for making innovation and competitive strength in manufacturing industry like other industries. Particularly, the location-based service that enables us to trace real-time logistics make effective management of schedules for inventory control, facilities and equipments, jobs planning, and facilitate the processes of information management and intelligence, which relate with ERP and SCM in organizations. Our study tries to build the location-based system for products of semiconductors in manufacturing place and suggests the good conditions and effective tracking procedures for positions of products. Our study show that the system is good for the saving of time in tracking products, however, it has to be improved in terms of accuracy. The study verifies the application of RFID technology in manufacturing industry and suggests the improvement of photograph process through RFID. In addition, our research introduces the future operation of FAB in semiconductors' processes that relate with real-time automation and RFID in manufacturing company.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.17-21
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• 2016

EUV (Extreme Ultraviolet) pellicle which protects a mask from contamination became a critical issue for the application of EUV lithography to high-volume manufacturing. However, researches of EUV pellicle are still delayed due to no typical manufacturing methods for large-scale EUV pellicle. In this study, EUV pellicle membrane manufacturing method using not only KOH (potassium hydroxide) wet etching process but also a water bath was suggested for uniform etchant temperature distribution. KOH wet etching rates according to KOH solution concentration and solution temperature were confirmed and proper etch condition was selected. After KOH wet etching condition was set, $5cm{\times}5cm$ SiNx (silicon nitride) pellicle membrane with 80% EUV transmittance was successfully manufactured. Transmittance results showed the feasibility of wet etching method with water bath as a large-scale EUV pellicle manufacturing method.

• Bulletin of the Korean Chemical Society
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• v.34 no.12
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• pp.3755-3761
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• 2013

This study aims to assess the ecological risk of the hazardous air pollutants (HAPs) emitted in the semiconductor manufacturing processes in Korea by using Quantitative Structure Activity Relationship (QSAR, EPA, US, EPI $Suite^{TM}$ 4.1). Owing to the absence of environmental standards of hazardous air pollutants in the semiconductor manufacturing processes in Korea, 18 HAPs in the semiconductor field included in both the US EPA NESHAPs and the hazardous air pollutant list of Ministry of Environment in Korea were selected. As a results 8 chemicals (44.4%) of the selected 18 HAPs were VOCs. Cyanides (cyanides) and ethylene oxides (epoxy resins), and tetrachloro-ethylene (aliphatic compounds, halides) showed long half-lives. Cyanide HAPs especially had the highest half-life with the estimated value of 356.533 days. Nickel compounds (heavy metal compounds) possessed the highest water solubility followed by acetaldehyde (aldehyde compounds), ethylene oxides, and 1,4-dioxanes. The halides, including tetrachloro-ethylenes, carbon tetra-chlorides, benzene (aromatic compounds), and lead (heavy metals), are estimated to take the longest time for biodegradation. Tetrachloroethylene, with the acute toxicity end point of 3.685-7.033 mg/L, was assessed to be the most highly toxic substance among the 18 HAPs. However, considering the absence of the HAPs in the common category of log $K_{ow}{\geq}4$and $BCF{\geq}500$, which indicates the standard of bioconcentration potentials, potentials of the bioconcentration are considered to be low.

• Industrial Engineering and Management Systems
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• v.4 no.1
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• pp.47-53
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• 2005

The efficiency of fabrication (fab) operation is one of the key factors in order for a semiconductor manufacturing company to stay competitive. Optimization of manpower and forecasting manpower needs in a modern fab is an essential part of the future strategic planing and a very important to the operational efficiency. As the semiconductor manufacturing technology has entered the 8-inch wafer era, the complexity of fab operation increases with the increase of wafer size. The wafer handling method has evolved from manual mode in 6-inch wafer fab to semi-automated or fully automated factory in 8-inch and 12-inch wafer fab. The distribution of manpower requirement in each specialty varied as the trend of fab operation goes for downsizing manpower with automation and outsourcing maintenance work. This paper is to study the specialty distribution of manpower from the requirement in a typical 6-inch, 8-inch to 12-inch wafer fab. The human resource planning in today’s fab operation shall consider many factors, which include the stability of technical talents. This empirical study mainly focuses on the human resource planning, the manpower distribution of specialty structure and the forecast model of internal demand/supply in current semiconductor manufacturing company. Considering the market fluctuation with the demand of varied products and the advance in process technology, the study is to design a headcount forecast model based on current manpower planning for direct labour (DL) and indirect labour (IDL) in Taiwan’s fab. The model can be used to forecast the future manpower requirement on each specialty for the strategic planning of human resource to serve the development of the industry.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.14 no.4
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• pp.275-283
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• 2021

In this study, a driver IC for an AC-powered LED that can be manufactured with a low voltage semiconductor process is designed and the performances of the driver IC were simulated. In order to manufacture a driver IC that operates directly at AC 220V, a semiconductor manufacturing process that satisfies a breakdown voltage of 500V or higher is required. A semiconductor manufacturing process for a high-voltage device requires a much higher manufacturing cost than a general semiconductor process for a low-voltage device. Therefore, the LED driver IC is designed in series so that it can be manufactured with semiconductor process technology that implements a low-voltage device. This makes it possible to divide and apply the voltage to each LED block even if the input voltage is high. The LED lighting circuit shows a power factor of 96% at 220V. In the pnp transistor circuit, a very high power factor of 99.7% can be obtained, and it shows a very stable operation regardless of the fluctuation of the input voltage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.44-44
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• 2009

Fault detection is necessary for yield enhancement and cost reduction in semiconductor manufacturing. Sensory data acquired from the semiconductor processing tool is too large to analyze for the purpose of fault detection and classification(FDC). We studied the techniques of fault detection using statistical method. Multiple regression analysis smoothly detected faults and can be easy made a model. For real-time and fast computing time, the huge data was analyzed by each step. We also considered interaction and critical factors in tool parameters and process.

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.31-37
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• 2015

This paper is on the design and manufacturing of vibration tester (shaker) for experiments about effects on the performance of semiconductor chips and Li-ion batteries by vibration. Shaker in the market are quite expensive, it is difficult for basic researchers to contact. In this study, in order to improve this, we designed and manufactured with an entry-level into mass production possible approaches in terms of performance required to a minimum. The shaker system is operated by Matlab and LabView. The target performances are 200Hz frequency and 5% error, and these were satisfied.

• Journal of Korean Institute of Industrial Engineers
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• v.41 no.3
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• pp.267-274
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• 2015

In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

• IE interfaces
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• v.17 no.spc
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• pp.131-140
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• 2004

The purpose of this paper is to develop and show the efficiency of the URL(Unload Request Logic) and LRL(Load Request Logic) of the dispatcher in the Fab(Fabrication) Manufacturing Execution System. These logics are the core procedures which control the material(wafer and glass substrate) flow efficiently in the semiconductor and LCD fab considering inter-bay as well as intra-bay material flow. We use the present and future status information of the system by look-ahead and the information about the future transportation schedule of Automated Guided Vehicles. The simulation results show that the URL and LRL presented in this paper reduce the average lead time, average and maximum WIP level, and the average available AGV waiting time.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1998.04a
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• pp.302-307
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• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.