• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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• pp.155-159
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• 2005

High speed presses with high resolution in semiconductor lead frame manufacturing process are needed . But high speed operation accompanies mechanical vibration. therefore optimized kinematic structure to minimize vibration is required for a high speed press. And the growing competition in the industry asks a press with low cost, high speed, high resolution, and high pressing force, For this purpose a high speed press was modeled with 3D CAD solid modeling system and dynamic analysis were performed with CAE S/W for multibody dynamic analysis, Through these analyses a motor appropriate to a high speed press was selected and link structure for feeding system of the press was modified to reduce vibration. To perform this analysis working Model which is 2D kinematics and dynamic analysis software was used.

• 반도체디스플레이기술학회지
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• 제22권3호
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

• 통상정보연구
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• 제11권3호
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• pp.145-165
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• 2009

Nowadays, economic growth of China has become an important issue. Due to the demographic position and the market size, China-Korea trade relationship has grown tremendously and significantly. The Chinese relationship with the Korean industry has considerably increased over the years. Various trade competitiveness indices such as TSI, MRCAI, and IITI have been applied to measure the competitive advantage and the complementary of market structure between these two countries. For this purpose, the dataset from the year 2000 to 2008 provided by KITA were used. The MRCAI result show that Korea has specialized in the product of semiconductor, communication equipment, precision machine, automobile, and nonferrous metal. The intra-industry trade level of Korean manufacturing industry is rising in line with the dominance of vertical intra-industry trade(VIIT) trend.

• Journal of Radiation Protection and Research
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• 제40권2호
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• pp.110-117
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• 2015

최근 방사선을 이용한 반도체 검사장비 산업의 증가로 이에 대한 기술 연구 수요 또한 증가하고 있다. 반도체 검사장비는 저에너지 엑스선으로 최저 40 keV에서 최고 120 keV의 에너지 영역을 사용하고 있지만, 국내에서는 저에너지 엑스선이 주는 방사선 손상 연구가 미흡한 상황이다. 따라서 본 연구는 저에너지 엑스선을 이용하여 반도체 소자의 한 종류인 BJT (bipolor junction transistor)가 받는 방사선 손상에 관한 것이다. BJT는 NXP반도체사의 BC817-25(NPN type)를 사용하였으며, 엑스선 발생장치를 사용하여 엑스선을 조사하였다. BJT의 방사선 손상 여부는 엑스선 조사 전과 후에 전류 이득을 10으로 고정하고, 콜렉터 전류에 따른 콜렉터-이미터 전압을 측정하여 변화 정도를 분석하여 확인하였다. 엑스선 발생장치의 관전압은 40 kVp, 60 kVp, 80 kVp, 100 kVp, 120 kVp 등 다섯 가지로, 조사 시간은 60초, 120초, 180초, 360초, 540초 등 다섯 가지로 변수를 두었다. 실험 결과 BJT에서 저에너지 엑스선 즉, 120 keV 이하의 엑스선을 조사하여도 방사선 손상이 발생하는 것을 확인하였고, 특히 80 kVp에서 가장 큰 방사선 손상이 발생되었다. 이는 ELDRS (enhanced low dose rate sensitivity) 현상이 80 kVp을 기준으로 발생되는 것으로 판단된다. 본 연구의 결과는 저에너지 엑스선을 이용한 반도체 검사장비의 효율적인 선량관리와 엑스선 여과기의 연구 및 개발에 기여할 것으로 기대한다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 V
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• pp.2553-2556
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• 2003

In the semiconductor equipment industry, the SECS/GEM protocol has been recognized as the communication standard, but in our 300mm wafer aligner being developed, this capability has not been equipped yet. In this study, we present the realization of SECS-I, SECS-II and HSMS communication protocol between factory host computer and wafer aligner. Its validity is shown in actual test environment.

• 한국기계가공학회지
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• 제12권3호
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• pp.36-40
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• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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• pp.297-300
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• 2007

There have been 3E problems of energy, economy and environment since the earth has its history. Especially, the energy and environment problems have been getting serious after the modern industry revolution. Therefore, the demand of gas as an eco-friendly energy source is getting increased. With the demand of gas, the installation and use of gas boiler is also increased, so human life injury by the waste gas(CO) of boiler goes on increasing every year. It is the content about a life of the exhaust tube which is used at Gas boiler in this paper. We explain also the course to apply the 6SC(6 Step Creativity) of practical TRIZ and evaluate the re solution.

• 반도체디스플레이기술학회지
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• 제4권4호
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• pp.27-31
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• 2005

This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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• pp.163-168
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• 2004

Linear motor can directly apply to the system needed linear mot ions without rotary mot ions. To control a high-speed and high-resolution, the development of the linear motors is recently required in the high-integrated and speed process industry. This paper presents vibration analyses as well as measurement standards of the newly developed linear motors through analyzing the vibration characteristics and thermal behaviors of the advanced products. Vibration experiments are conducted for identifying the hysteresis and vibration level during operation. They are also included in the modal test to analyze the vibration. Analytic data using Finite Element Method (FEM) are compared with the results of the modal. Loss of temperature generated the linear motor leads to a serious deformation within its parts. The thermal behaviors are very important factor in linear motor. The FEM and experiments make it possible to understand these characteristics.

• 한국CDE학회논문집
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• 제19권3호
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• pp.214-223
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• 2014

This paper presents a bottleneck detection framework using simulation approach in a wafer FAB (Fabrication). In a semiconductor manufacturing industry, wafer FAB facility contains various equipment and dozens kinds of wafer products. The wafer FAB has many characteristics, such as re-entrant processing flow, batch tools. The performance of a complex manufacturing system (i.e. semiconductor wafer FAB) is mainly decided by a bottleneck. This paper defines the problem of a bottleneck process and propose a simulation based framework for bottleneck detection. The bottleneck is not the viewpoint of a machine, but the viewpoint of a step with the highest WIP in its upstream buffer and severe fluctuation. In this paper, focus on the classification of bottleneck steps and then verify the steps are not in a starvation state in last, regardless of dispatching rules. By the proposed framework of this paper, the performance of a wafer FAB is improved in on-time delivery and the mean of minimum of cycle time.