• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.3-23
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• 2005

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.59-62
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• 2012

This test method covers a procedure for measuring particle removal characteristic of equipment fan filter unit(EFFU) installed inside of semiconductor process equipments, FPD manufacturing equipments and so on. Since EFFU is a combination of air filter and the assembly of fan, motor and frame, the integrity of these parts is very important for the performance of EFFU. So a conventional particle removal test method for air filters is not suitable for EFFU particle removal performance. This test method defines an evaluation method for EFFU which is installed inside an enclosed space to remove particles that are generated inside process equipment. The particle removal performance of EFFUs is usually depending on the performance of filter media and air flow rate. To understand a performance of an EFFU, the filter media characteristic, air flow rate and the integrity of EFFU parts should be considered simultaneously. This test method is intended to demonstrate the system performance of an EFFU and successfully evaluated EFFU performance characteristics.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.17-22
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• 2006

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.92-96
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• 2004

Scales, accumulated on semiconductor equipment parts during device fabrication processes, often lower equipment lifetime and production yields. Thus, many equipments parts have be cleaned regularly. In this study, an attempt to establish an effective process for the removal of scales on the sidewall of collimators in the chamber of sputter is made. The EDX analysis revealed that the scales are composed of Ti and TiN with the colummar structure. It was found that the heat-treatment at 700 for 1 min. after the oxide removal in the HF solution, and then etching in the HNO3 : H2SO4 : H2O =4:2:4 solution for 5.5 hrs at 67 was the most effective process for the scale removal.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1678-1679
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• 2007

This paper is the electric power system remote control of semiconductor plasma manufacturing equipment using PLC(power line communication). PLC is useful for economical data link but various problems and limitations are caused in using power lines for communications channel Develop of Semiconductor plasma manufactur ing equipment and remote automation technologies of tool develops day after day and standards. Also, Remote electric power control and device module control by GUIRCS(Graphic User Interface Remote Control System) of tool are monitoring in real time.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.121-125
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• 2020

With miniaturization of semiconductor, the manufacturing process become more complex, and undetected small changes in the state of the equipment have unexpectedly changed the process results. Fault detection classification (FDC) system that conducts more active data analysis is feasible to achieve more precise manufacturing process control with advanced machine learning method. However, applying machine learning, especially in supervised learning criteria, requires an arduous data labeling process for the construction of machine learning data. In this paper, we propose a semi-supervised learning to minimize the data labeling work for the data preprocessing. We employed equipment status variable identification (SVID) data and optical emission spectroscopy data (OES) in silicon etch with SF6/O2/Ar gas mixture, and the result shows as high as 95.2% of labeling accuracy with the suggested semi-supervised learning algorithm.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.1376-1383
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• 2001

Modem technology depends on the reliability of extremely high technology equipments. In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of 'exactness' and 'accuracy', because this is used as basic data for the design of building structure and structural dynamics of equipment. This paper deals with the properties of time and frequency domain in order to obtain more improved vibration criteria for high sensitive equipment.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• International Journal of Quality Innovation
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• v.6 no.1
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• pp.58-73
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• 2005

The objective of this study is to evaluate the equipment risk before and after SEMI S2-93A implementation, thus providing a guideline for safety improvement. Semiconductor Plant A located in Taiwan's Hsinchu Science Based Industrial Park with 147 manufacturing machines was used for risk assessment. This study was carried out in three steps. First, a preliminary hazard analysis was conducted. A detailed process safety evaluation was conducted (Hazard and Operability Study, HAZOP); and finally, the equipment risk comparison before and after Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation. The preliminary hazard analysis results showed high risk in 21.77% of the manufacturing machines under risk assessment at Plant A. The largest percentage existed in the Diffusion Department. The machine types specified by the hazardous work site review and inspection according to Article 26 of Labor Inspection Regulation (the machines that use such chemicals as, $SiH_4$, HF, HCL, etc. and that are determined to be highly hazardous through preliminary hazard analysis) were added to the detailed process analysis and evaluation. In the third part of this evaluation, the machines at Plant A used for detailed process safety assessment were divided into two groups based on the manufacturing data before and after 1993. The severity, possibility, and actual accident analysis before and after SEMI S2-93A implementation were compared. The Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation can reduce the severity and possibility of hazard occurrence.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3319-3325
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• 2012

This paper describes the development of the TrackSim, which is a discrete event simulation tool for photolithography equipment of semiconductor industry. The TrackSim is focused on the accurate simulation model of the photolithography equipment and easy-to-use user interfaces. TrackSim provides 3D simulation environment for evaluating, validating, and scheduling the photolithography process. One of the major characteristics of TrackSim is in that it is developed based on Applied Materials' AutoMod, a discrete event simulation software broadly used in semiconductor industry. Accordingly, the photolithography model of TrackSim can be used to perform simulation connected with other simulation models built with AutoMod.