• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.53-59
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• 2011

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

• 반도체디스플레이기술학회지
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• 제9권2호
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• pp.91-96
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• 2010

In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we consider the roll-to-plate type imprinting process. In the process a glass mold, which is placed upon the 2nd generation TFT-LCD glass sized substrate(370${\yen}$470 mm), is rolled by a rubber roller to achieve a uniform residual layer. The pressure distribution on the glass mold by rolling of the rubber roller is crucial information to analyze mold deformation, transferred pattern quality, uniformity of residual layer and so forth. In this paper the quantitative pressure distribution induced by rolling of the rubber roller was calculated with finite element analysis under the assumption of Neo-Hookean hyperelastic constitutive relation. Additionally the numerical results were verified by the experiments.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 B
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• pp.1199-1201
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• 2002

Today, the ceramic transformer becomes widely used for the TFT LCD backlight inverter system thanks to its high efficiency and small size. In this paper, a high efficient inverter system for cold cathode flourescent lamp (CCFL) including PLL controller for tuning the PWM frequency to the frequency that the efficiency of the inverter system becomes maximum is proposed. The control IC implementing this feature will be released by Interpion Co. Ltd. in May 2002.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.33-41
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• 2011

Due to the recent quantum leaps forward in bio-, nano-, and information-technologies (BT, NT and IT), the precisionization and miniaturization of mechanical and electrical components are in high demand. In particular, the ITrelated equipments that take a great part in our domestic industry are in the area requiring high precision technologies. As a consequence, the researches on the development vibration isolation systems that diminish external disturbance or internal vibration are highly required. Among the components comprising the vibration isolation system, air spring has become on a focal point for the researchers due to its merits. This air spring is able to support heavy loads, keep a low natural frequency despite of having a lower value of stiffness, and control the performance of vibration isolation. However, sometimes the sole use of air spring is in demand due to some economic reasons. Under this circumstance, the damping effect of sole air spring may not enough to reduce sufficient amount of vibration. In this study, the air spring mount system connecting with an external chamber is proposed to increase or control the damping effect. To investigate its damping mechanism, the thermal and dynamic behaviors of the system is examined through a theoretical modeling approach in this part of research. In this approach, thermomechanical and Helmholtz resonator type models are to be employed for the air spring/external chambers and connecting tube system, respectively. The frequency response functions (FRFs) derived from the modeling effort are evaluated with physical parametric values and the effects of connecting tube length on these FRFs are identified through computer simulations.

• 대한기계학회논문집A
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• 제26권1호
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• pp.121-130
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• 2002

Clean stockers are being used by semiconductor and TFT-LCD manufacturers to store and buffer work in process. Since an important function of a stocker is to keep the contained material clean. The only way to keep the stored product clean is to provide constant clean airflow the product and through stocker, The airflow across the product prevent contamination from settling on the product. Up to now, stocker typically have been configured to receive their laminar airflow from fan filter units that are located on the side of the stocker This type of stocker may have such problems as complexity of structure, increment of temperature, mechanical vibration, initial investment and running cost. In this study, In order to solve the above mentioned problems, new air control system in stocker is proposed, which is to control open ratios of exits that are located on the side of the stocker without fan filter units. Open ratios of exits need to be optimized for the same quantities of airflow in each exit. In this study, static pressure regain was used for the analysis of the open ratios of exits theoretically and Blue Ridge Numerics FEM software, CFDesign, was used fur simulating airflow in stocker. As a result, Open ratios of exits important to provide constant clean airflow can be obtained by the analysis of static pressure regain and was verified by simulation results. Therefore, new air control system in stocker can be used by the semiconductor and TFT-LCD manufacturers.

• 한국산업융합학회 논문집
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• 제12권2호
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• pp.99-105
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• 2009

Among a few items with world wide competitiveness are the semiconductor and the LCD. Grinding/polishing is the most significant process in manufacturing semiconductor wafers and LCD panels, the most critical quality of which is the precision rate of the machined surfaces. It is well known that the control of the vibrations is the major factor in maintaining superb machined surfaces. In this paper the dynamic properties of a grinding machine have been investigated through the frequency analysis test and the computer simulation to deduce ideas of design modifications for improved stability. The alterations have been applied to the simulation model, which is supposed to have identical dynamic property with the original structure, to identify the effects and to finally achieve the satisfactory level of stability. The result shows that the machine can have much improved stability with relatively simple design changes, and also can improve the surface quality of the products.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.43-49
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• 2011

In this study, the dynamic characteristics of an air spring connected with an external chamber through a flexible tube are examined. The uncoupled dynamic parameters of the air spring are identified through experiments, followed by the suggestion of a model-based approach to obtain the remaining coupled dynamic parameters using the various frequency response functions derived in PART I paper [1]. To improve or control the damping characteristics of the air spring, this vibration isolation air spring system is physically established in laboratory scale. And we attempt to identify various parameters used to describe to air spring system by both theoretically [1] and experimentally, which is performed in this report. The damping parameter of the tube system is identified through experiments on the system incorporated with the air cylinder, and a nonlinear regression procedure is employed to find solutions. The resulting value is used to expect the frequency response function of dynamic pressure in the top chamber (air spring) with respect to that in the bottom chamber (external chamber). Comparison with the experimental data supports the validity of the present estimation procedures. Also, the dynamic mechanism of the damping effects particularly in a low frequency range is investigated through this experimental endeavor.

• ETRI Journal
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• 제35권4호
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• pp.571-577
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• 2013

The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

• Journal of Advanced Marine Engineering and Technology
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• 제37권4호
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• pp.384-390
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• 2013

최근 반도체, LCD, 첨단전자산업 관련 분야의 급팽창으로 고압 액화가스 사용이 증가함에 따라 극저온 용기 및 저장탱크도 대형화되는 추세이다. 저장탱크 내의 잔존량을 측정하기 위해 기존에는 아날로그식 액면계와 압력계를 이용하고 있으나 이는 측정이 불편하고 정밀도가 부정확하여 정확한 양을 측정하기가 어렵다. 이에 본 연구에서는 차압센서를 이용하여 극저온 액화가스 저장탱크의 압력과 액면 높이를 측정하고 유선통신기능으로 PC 모니터링이 가능하도록 하며, 모바일 프린터를 연결하여 특정데이터가 출력 가능하도록 디지털식 액면측정장치를 설계한다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.111-114
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• 2008

We studied the influence of nanocrystalline silicon (nc-Si) thin film thickness on top gate nc-Si thin film transistor (TFT) fabricated at $180^{\circ}C$. The nc-Si thickness affects the characteristics of nc-Si TFT due to the nc-Si growth similar to a columnar. As the thickness of nc-Si increases from 40 nm to 200 nm, the grain size was increased from 20 nm to 40 nm. Having a large grain size, the thick nc-Si TFT surpasses the thin nc-Si TFT in terms of electrical characteristics such as field effect mobility. The channel resistance was decreased due to growth of the grain. We obtained the experimental results that the field effect mobility of the fabricated devices of which nc-Si thickness is 60, 90 and 130 nm are 26, 77 and $119\;cm^2/Vsec$, respectively. The leakage current, however, is increased from $7.2{\times}10^{-10}$ to $1.9{\times}10^{-8}\;A$ at $V_{GS}=-4.4\;V$ when the nc-Si thickness increases. It is originated from the decrease of the channel resistance.