• Title/Summary/Keyword: sealing frit

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Vacuum In-Line Sealing by a Halogen Lamp Heating of Frit-Glass Seals for Flat Panel Display

  • Kwon, Sang-Jik;Hong, Kun-Cho;Lee, Jong-Duk;Whang, Ki-Woong;Park, Sun-Woo;Kwon, Yong-Bum
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.147-148
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    • 2000
  • Sealing of two glass plates composing of FED panel was done in a vacuum chamber. Several factors related with a heating process of a frit glass were investigated, including comparisons with a conventional method.

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Effect of TiO2 on the Properties of ZnO-V2O5-P2O5 Low Temperature Sealing Glasses (저온실링용 ZnO-V2O5-P2O5계 봉착재의 물성에 미치는 TiO2 의 영향)

  • Lee, Heon-Seok;Hwang, Jong-Hee;Lim, Tae-Young;Kim, Jin-Ho;Lee, Suk-Hwa;Kim, Il-Won;Kim, Nam-Suk;Kim, Hyung-Sun
    • Korean Journal of Materials Research
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    • v.19 no.11
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    • pp.613-618
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    • 2009
  • We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

P2O5-ZnO-SiO2-R2O Glass Frit Materials for Hermetic Sealing of Dye-Sensitized Solar Cells

  • Lee, Hansol;Lee, Choon Yeob;Hwang, Jae Kwun;Chung, Woon Jin
    • Journal of the Korean Ceramic Society
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    • v.54 no.5
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    • pp.400-405
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    • 2017
  • $P_2O_5-ZnO-SiO_2-R_2O$ glasses were synthesized as a sealing material for large scale dye-sensitized solar cells (DSSC). Compositional effects of $P_2O_5$ and ZnO were examined by varying their contents. Their viscosity and glass stability at sintering temperatures of less than $550^{\circ}C$ were examined by flow button test. Glass transition temperature and structural change upon compositional change were investigated. Chemical stability against electrolyte was also examined by immersing the glasses in the electrolyte for 72 h at $85^{\circ}C$.

Preparation and Characterization of Solder Glass for Electronic IC Package (IC Package 봉착용 결정화 유리의 제조와 특성에 관한 연구)

  • 손명모;감직상;박희찬;이서우;문종수
    • Journal of the Korean Ceramic Society
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    • v.26 no.6
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    • pp.829-835
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    • 1989
  • Devitrifing solder glasses in a specific group of glass ceramic materials are extensively used in hermetically sealing alumina electronics packages. Preferred frit glass compositions of this study consist of 37~40wt% PbO, 35~40wt% ZnO, 18~20wt% B2O3, 1~3wt% SiO2, 0~6wt% TiO2. The coated frit glasses crystallize during firing and form a strong hermetic seal. DTA and X-ray diffraction were used to characterize crystallization of the glass frit. Frit seal containing 2wt% TiO2 has crystallization temperature of 550~57$0^{\circ}C$ with surface nucleation. Frit seal containing 6wt% TiO2 has crystallization temperature of 515~5$25^{\circ}C$ with bulk nucleation, and the main crystalline phase was perovskite lead titanate having minus expansion coefficient. The average activation energy for the crystallization calculated from Ozawa equation was 65$\pm$10kcal/mol.

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Investigation of Glass Substrate Sealing for ECL Application using Laser Welding Technology (레이저 웰딩 기술을 이용한 ECL용 유리 기판 접합에 대한 고찰)

  • Sung, Youl-Moon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.29 no.12
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    • pp.28-32
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    • 2015
  • In this work, we reported fabrication of sealing the glass substrate using laser treatment at low temperature for electrochemical luminescence (ECL) cell. The laser treatment at temperature is using laser diode. The glass substrate sealing by laser treatment tested at 3-10W, 2-5 mm/s for build and tested. The sealing laser treatment method will allow associate coordination between the two glass substrate was enclosed. The effect of laser treatment to sealing the glass substrate was found to have cracks and air gap at best thickness of about 550-600 im for condition 3 W, 3 mm/s. The surface of sealing was roughness which was not influent to electrodes It can reduce the cracks, crevices and air gaps as well, improves the performance viscosity in butter bus bar electrodes. Therefore, it is more effective viscosity between two FTO glasses substrate.

Temperature Distribution According to the Structure of a Conductive Layer during Joule-heating Induced Encapsulation for Fabrication of OLED Devices (OLED 소자 제조를 위한 주울 가열 봉지 공정 시 도전층 구조에 따르는 열분포)

  • Jang, Ingoo;Ro, Jae-Sang
    • Journal of Surface Science and Engineering
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    • v.46 no.4
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    • pp.162-167
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    • 2013
  • Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

Tribological Properties of Clay Bonded SiC (점토 결합 SiC 소결체의 마찰 마모 특성)

  • 한상준;이경희;이재한;김홍기
    • Journal of the Korean Ceramic Society
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    • v.32 no.9
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    • pp.1027-1032
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    • 1995
  • SiC had been widely applied for mechanical sealing as a sealing material. SiC sintering is commonly made of reaction sintering, presureless sintering, and hot isostatic pressing (HIP) sintering. In this investigation, however, clay bonded sintering was used to avoide any complications of the special sintering methods as mentioned above. In order to prevent harmful SiC oxidation in the clay bonded sintering, clay and frit were used to form the SiC oxidation protecting layer and graphite was added to provide high solid lubricity. As a result, the material with 6% clay (clay 5.4% and frit 0.6%) and 2~4% graphite (45 mesh) sintered at 140$0^{\circ}C$ for 3 hours, showed the following physical properties; porosity 6%, static friction coefficient 0.15, kinematic coefficient 0.1,. and specific wear rate 4.8$\times$10-8 $\textrm{mm}^2$kgf-1. On the other hand, the flexural strength was 900kgf/$\textrm{cm}^2$. This tribological characteristic properties were similar to those of the reaction sintered SiC except the flexural strength.

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Laser Processing Technology in Semiconductor and Display Industry (반도체 및 디스플레이 산업에서의 레이저 가공 기술)

  • Cho, Kwang-Woo;Park, Hong-Jin
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.6
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    • pp.32-38
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    • 2010
  • Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

V2O5-P2O5-ZnO-Sb2O3 Glass Frit Materials with BaO and Al2O3 for Large-sized Dye-sensitized Solar Cell Sealing

  • Lee, Han Sol;Cho, Jae Kwon;Hwang, Jae Kwon;Chung, Woon Jin
    • Journal of the Korean Ceramic Society
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    • v.52 no.2
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    • pp.114-118
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    • 2015
  • $V_2O_5-P_2O_5-ZnO-Sb_2O_3$ glasses modified with BaO and $Al_2O_3$ are synthesized as a sealing material for large-scale dye-sensitized solar cells (DSSCs). A compositional study is performed in order to determine the glass that can be sintered below $500^{\circ}C$ with a high chemical stability against the electrolyte. The flow size of the glasses after the heat treatment and the glass stability are increased with the addition of $Al_2O_3$ and BaO, while the glass transition temperature is decreased. After the reaction with the electrolyte at $60^{\circ}C$ for 72 h, the addition of 5 mol% of BaO and 2 mol% of $Al_2O_3$ considerably enhances the chemical stability of the glass. X-ray diffraction (XRD) and scanning electron microscope (SEM) are used to examine the reaction between the electrolyte and glasses. The structural contribution of the additives is also investigated and discussed.