• Tribology and Lubricants
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• v.24 no.2
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• pp.77-81
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• 2008

In this work, ramp loading scratch method was used to evaluate the scratch characteristics of HDD media and ZnO thin films. Commercially available HDD media and ZnO thin films grown on silicon(100) substrate by sol-gel method were used. As for the ZnO films, the effects of annealing temperature after the film deposition process were also investigated. A custom built scratch tester was used to scratch the specimen under a ramp loading condition. The scratch track formed by ramp loading was measured by optical microscope and Atomic Force Microscopy (AFM). The wear depth and width were used to assess the scratch characteristics of the HDD Media and ZnO thin films. The results showed that ZnO film annealed at $800^{\circ}C$ had the best scratch resistance property. Also, the HDD media showed overall better scratch resistance than the ZnO films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.59-59
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• 2009

현재 CMP분야는 광역 평탄화 반도체 소자의 집적화 및 소형화가 진행됨에 따라서 CMP 공정의 중요성은 날로 성장하고 있다. 하지만 이러한 CMP공정은 불가피하게도 scratch, pit, CMP residue와 같은 defect들을 발생시키고 있으며, 점점 선폭이 작아짐에 따라, 이러한 defect들이 반도체 수율에 미치는 영향은 심각해지고 있다. Defect들 중에 특히 scratch는 반도체에 치명적인 circuit failure를 일으키게 된다. 또한 반도체 내구성과 신뢰성을 감소시키게 되고, 누전전류를 증가시키는 등 바람직하지 못한 현상들이 생기게 된다. 본 연구에서는 scratch 와 같은 deflect들을 효율적으로 검출, 분석하고, scratch를 감소시키는데 그 목적이 있다. 본 실험을 위해 8" TEOS wafer와 commercial oxide slurry 및 friction polisher (Poli-500, G&P tech., Korea)를 사용하여 CMP 공정을 진행하였으며, CMP 공정조건은 각각 80rpm/80rpm/1psi(Platen speed/Head speed/Pressure)에서 1분 동안 연마를 한 후 scratch 발생 경향을 살펴보았다. CMP 후 wafer위에 오염되어 있는 slurry residue들을 제거하기 위해 SC-1, HF 세정을 이용하여 최적화된 post-CMP 공정기술을 제안하였다. Scratch 검출 및 분석을 위해 wafer surface analyzer (Surfscan 6200, Tencor, USA)와 optical microscope (LV100D, Nicon, Japan)를 사용하였다. CMP 공정 변수들에 따른 scratch 발생정도를 비교하였으며, scratch 발생 요인들에 따른 scratch 형태 및 발생정도를 살펴보았다. 최적화된 post-CMP 세정 조건은 메가소닉과 함께 SC-1 세정을 실시하여 slurry residue들을 제거한 후, HF 세정을 실시하여 잔여 오염물들을 제거하고 검출이 용이하도록 scratch를 확장시킬 수 있도록 제안하였으며, 100%의 particle removal efficiency (PRE)를 얻을 수 있었다. 실제 CMP 공정후 post-CMP 세정 단계별 scratch 개수를 측정한 결과, SC-1 세정 후 약 220개의 scratch가 검출되었으며, 검출되지 않았던 scratch가 HF 세정 후 확장되어 드러남에 따라 약 500개의 scratch 가 검출되었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.23-23
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• 2011

Chemical-Mechanical Planarization (CMP) 공정이란 화학적 반응 및 기계적인 힘이 복합적으로 작용하여 표면을 평탄화하는 공정이다. 이러한 CMP 공정은 반도체 산업에서 회로의 고집적화와 다층구조를 형성하기 위하여 도입되었으며 반도체 제조를 위한 필수공정으로 그 중요성이 강조되고 있다. 특히 최근에는 Inter-Level Dielectric (ILD)의 형성과 Shallow Trench Isolation (STI) 공정에서실리콘 산화막을 평탄화하기 위한 CMP 공정에 대해 연구가 활발히 이루어지고 있다. 그러나 CMP 공정 후 scratch, pitting corrosion, contamination 등의 Defect가 발생하는 문제점이 존재한다. 이 중에서도 scratch는 기계적, 열적 스트레스에 의해 생성된 패드의 잔해, 슬러리의 잔유물, 응집된 입자 등에 의해 표면에 형성된다. 반도체 공정에서는 다양한 종류의 실리콘 산화막이 사용되고 gks이러한 실리콘 산화막들은 종류에 따라 경도가 다르다. 따라서 실리콘 산화막의 경도에 따른 CMP 공정 및 이로 인한 Scratch 발생에 관한 연구가 필요하다고 할 수 있다. 본 연구에서는 scratch 형성의 거동을 알아보기 위하여 boronphoshposilicate glass (BPSG), plasma enhanced chemical vapor deposition (PECVD) tetraethylorthosilicate (TEOS), high density plasma (HDP) oxide의 3가지 실리콘 산화막의 기계적 성질 및 이에 따른 CMP 공정에 대한 평가를 실시하였다. CMP 공정 후 효율적인 scratch 평가를 위해 브러시를 이용하여 1차 세정을 실시하였으며 습식세정방법(SC-1, DHF)으로 마무리 하였다. Scratch 개수는 Particle counter (Surfscan6200, KLA Tencor, USA)로 측정하였고, 광학현미경을 이용하여 형태를 관찰하였다. Scratch 평가를 위한 CMP 공정은 실험에 사용된 3가지 종류의 실리콘 산화막들의 경도가 서로 다르기 때문에 동등한 실험조건 설정을 위해 동일한 연마량이 관찰되는 조건에서 실시하였다. 실험결과 scratch 종류는 그 형태에 따라 chatter/line/rolling type의 3가지로 분류되었다 BPSG가 다른 종류의 실리콘 산화막에 비해 많은 수에 scratch가 관찰되었으며 line type이 많은 비율을 차지한다는 것을 확인하였다. 또한 CMP 공정에서 압력이 증가함에 따라 chatter type scratch의 길이는 짧아지고 폭이 넓어지는 것을 확인하였다. 본 연구를 통해 실리콘 산화막의 경도에 따른 scratch 형성 원리를 파악하였다.

• International Journal of Advanced Culture Technology
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• v.3 no.2
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• pp.34-41
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• 2015

Bonding strength of a thermal sprayed coating is difficult to measure using a conventional pull-off test method. Scratch test is a potential alternative testing method. An adhesive and a cohesive bond strength of the coating can be measured by the pull-off test while the scratch test performed on the cross-section of the thermal sprayed coating can only demonstrate the cohesive bond strength of the coating. Nevertheless, it is still beneficial to perform the scratch testing on the cross-section of the coating for the sake of comparison thus providing an alternative to the pull-off test. The scratch test method can reduce testing time and cost in the long run due to a significant cost reduction in consumables and energy and time saving from the curing step of the glue used in the pull-off test. This research investigates the possibility of using the scratch test to measure the cohesive bond strength of Mo/NiCrBSi composite coating. The results from the pull-off test and the scratch test indicate that the cohesive bond strengths of the Mo composite coating show similar trend and that the cohesive bond strength are increased when increasing NiCrBSi content.

• Journal of The Korean Association of Information Education
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• v.23 no.3
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• pp.207-217
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• 2019

In order to improve computational thinking, elementary schools have been using 'Scratch' to provide basic programming education. However, the study on evaluation of computational thinking is at an early stage. Therefore, this study evaluated the conceptual level of computational thinking using the scratch code analyzing. For this, Dr. Scratch was used to analyze 179 scratch projects. The results showed that the conceptual level of computational thinking of most elementary students was at the developing level, and that it varied according to gender and production style, showed the lowest level of logic and abstraction, and improved computational thinking during programming. This study is meaningful in that it provides implications for the improvement of teaching methods and self-directed evaluation in learning.

• Tribology and Lubricants
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• v.20 no.2
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• pp.102-108
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• 2004

In this paper, friction and wear behaviors between monocrystalline, defect-free copper and carbon on the atomic scale are investigated by using 2-dimensional molecular dynamics simulation. It is assumed that all interatomic forces are given by Morse potential. The deformation of carbon is assumed to be neglected and vacuum condition is also assumed. Average friction and normal forces for various surface conditions, various scratch speeds and scratch depths are obtained from simulations. Changes of wear behaviors for various scratch speeds and surface conditions are investigated by observing snapshots in scratch process. The effects of surface conditions, scratch speeds, and scratch depths on the friction force, normal force, and friction coefficient are also investigated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.874-877
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• 2000

Pre-coated sheet materials are a cost-effective and environmentally attractive alternative to conventional sheet materials coated after forming. At present but the high scratch sensitivity of coating used for pre-coated metal sheet is a major limitation to use of these materials. Because of high scratch sensitivity, products made by pre-coated metal sheet are not formed by conventional design method. This study has been performed to investigate scratch characteristic of non-vinyl pre-coated metal (PCM) sheet. Using the simple U-bending test equipment, three non-vinyls PCM's were tested. This paper provides the results of bending tests showing the influence of sheet surface texture, tool material and process conditions. It was found that the influence of punch, die clearance and tool material had an effect upon the scratch characteristic.

• Journal of Technologic Dentistry
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• v.40 no.1
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• pp.27-32
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• 2018

Purpose: This study was performed to investigate processability of the dental zirconia block. Most of the CAD/CAM zirconia restorations utilize the partially sintered blocks, which are sintered at a temperature lower than $1100^{\circ}C$. Methods: Partially sintered zirconia samples were prepared $40{\times}30{\times}10mm$ and surface treatment by #2000 sandpaper. Scratch hardness was determined by the procedure of ASTM G171-03 using a scratch hardness tester(KS TECH, Korea) equipped with a real time load detector to measure tangential force during scratching. The scratch rate was 30 mm/min. Results: Scratch hardness(Hs) increases steeply with increase in the loads. The highest Hs was sampl 1.42 GPa and lowest was sample 0.42 GPa. Conclusion : The machinability of partially sintered CAD/CAM zirconia blocks can be optivized by manipulation of Hs.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.139-146
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• 2004

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation scratch test was studied with numerical method by ABAQUS S/W. Brittle materials (Si, Pyrex glass 7740) were used as specimens, and forming conditions to reduce the elastic recovery and pile-up were proposed. The indenter was modeled as a rigid surface. Minimum mesh sizes of specimens are 1-l0nm. Variables of the nanoindentation scratch test analysis are scratching speed, scratching load, tip radius and tip geometry. The nano-indentation scratch tests were performed by using the Berkovich pyramidal diamond indenter. Comparison between the experimental data and numerical result demonstrated that the FEM approach can be a good model of the nanoindentation scratch test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

• The KIPS Transactions:PartD
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• v.15D no.4
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• pp.581-588
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• 2008

Old films or photographs usually have damages from physical or chemical effects, and the damage and digitalization make stain, scratch, scribbling, noise, and digital drop out in frames. Damages include global damage and local damage, and it is well known that local damage restoration is a main factor for improving image quality. Previous researches have focused on impairment localization (esp. for line scratch impairments) and restoration techniques for line scratch, dirt, blob, and intentional scratch. Inpainting is a key technique using partial derivatives to restore damages in images. It does not show good quality for the complex images because it is based on finite order for partial derivatives, and it takes much time complexity. In this paper, we present a modified inpainting scheme, where we use Sobel edge operator's and angle to compute isophotes, and compare our scheme with Bertalmio's scheme. We experiment our scheme with two old Korean films, and Simulation results show that our scheme requires smaller time complexity than Bertalmio's scheme with comparable reconstructed image quality.