• Title/Summary/Keyword: school bonding

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Evaluation of Weld Defects in Stainless Steel 316L Pipe Using Guided Wave (스테인레스 316L강의 배관용접결함에 대한 유도초음파 특성 평가)

  • Lee, Jin-Kyung;Lee, Joon-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.1
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    • pp.46-51
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    • 2015
  • Stainless steel is a popular structural materials for liquid-hydrogen storage containers and piping components for transporting high-temperature fluids because of its superior material properties such as high strength and high corrosion resistance at elevated temperatures. In general, tungsten inert gas (TIG) arc welding is used for bonding stainless steel. However, it is often reported that the thermal fatigue cracks or initial defects in stainless steel after welding decreases the reliability of the material. The objective of this paper is to clarify the characteristics of ultrasonic guided wave propagation in relation to a change in the initial crack length in the welding zone of stainless steel. For this purpose, three specimens with different artificial defects of 5 mm, 10 mm, and 20 mm in stainless steel welds were prepared. By considering the thickness of s stainless steel pipe, special attention was given to both the L(0,1) mode and L(0,2) mode in this study. It was clearly found that the L(0,2) mode was more sensitive to defects than the L(0,1) mode. Based on the results of the L(0,1) and L(0,2) mode analyses, the magnitude ratio of the two modes was more effective than studying each mode when evaluating defects near the welded zone of stainless steel because of its linear relationship with the length of the artificial defect.

Bond Strength of Wafer Stack Including Inorganic and Organic Thin Films (무기 및 유기 박막을 포함하는 웨이퍼 적층 구조의 본딩 결합력)

  • Kwon, Yongchai;Seok, Jongwon
    • Korean Chemical Engineering Research
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    • v.46 no.3
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    • pp.619-625
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    • 2008
  • The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

ASSOCIATION BETWEEN THE PERCEIVED PARENTING AND PROBLEM BEHAVIORS IN KOREAN MALE ADOLESCENTS (청소년에서 자녀가 지각한 부모 양육태도와 문제 행동의 연관성 - 서울시내 남자 고등학생을 대상으로 -)

  • Kim, Do-Hoon;Moon, Yoo-Sun
    • Journal of the Korean Academy of Child and Adolescent Psychiatry
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    • v.12 no.2
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    • pp.237-244
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    • 2001
  • Objectives:Dysfunctional parent-child relationships have been associated with various mental and conduct disorders in adolescence and mental problems in adulthood as well. Most studies have done in clinical settings and little is known about the relationship between parenting and adolescent problem behaviors in community settings. This study is done to compare the perceived parenting and problem behaviors between problem behavior group and those of non-problem behavior group in male adolescents. Methods:The subjects of this study were 147 male high school students in Seoul, who do not have any known mental or conduct disorders and live with their real parents. Parental Bonding Instrument and Youth Self Report were administered to evaluate the perceived parenting and problem behaviors of adolescents. Results:There were significantly higher scores of mother overprotection in problem behavior group when comparing to non-problem behavior group. There was a significant association between mother overprotection and problem behavior when adjusting the number of family members, mother's job, parents' education level, grades, and religion. Conclusion:The parenting such as mother overprotection can be helpful to predict the problem behaviors in male adolescents, and appropriate parenting may prevent various problem behaviors in male adolescents.

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Effects that Faith Factor of Social Bonds Have on Cyber Bullying Phenomenon (사회유대의 신념요인이 사이버 불링 가해 현상에 미치는 영향)

  • Lee, Young-Sik
    • The Journal of the Korea Contents Association
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    • v.16 no.1
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    • pp.256-262
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    • 2016
  • A cyber crime has been evolving, as other crimes have. Beyond physical damages such as financial crimes in the cyber world, it has evolved into psychological forms like cyber-bullying. In today's crimes, measures that consider psychological effects of crimes are highly regarded in that fear of crime is considered as well as visible crimes. Accordingly, cyber bullying, which causes psychological damages, needs to be treated very importantly. Because the characteristics of cyber crime is caused by different circumstances from the real world, measures should be taken in different aspects. Rather than physical damages, which can be found in the conventional crimes, cyber crimes cause psychological damages, so the effect that has on inflicting should be specified. Especially, in the environment that virtual reality is ubiquitous through smart phones, it is very difficult to establish measures by considering all the causes of general cyber crimes. Therefore, this study estimated what affects cyber bullying by focusing on personalized faith factor among social bond theory, which can control cyber crimes. As a result, self-controling faith was verified to have a negative effect on cyber bullying, so faith is a very important factor in personalized environment. Thus, it is suggested that the characteristics of cyber space and education of humanism, which can affect individuals' faith should be emphasized.

A Study on the Bond Strength of BCB-bonded Wafers (BCB 수지로 본딩한 웨이퍼의 본딩 결합력에 관한 연구)

  • Kwon, Yongchai;Seok, Jongwon;Lu, Jian-Qiang;Cale, Timothy;Gutmann, Ronald
    • Korean Chemical Engineering Research
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    • v.45 no.5
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    • pp.479-486
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    • 2007
  • Four point bending is used to study the dependences of bond strength of benzocyclobutene(BCB) bonded wafers and BCB thickness, the use of an adhesion promoter, and the materials being bonded. The bond strength depends linearly on BCB thickness, due to the thickness-dependent contribution of the plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The bond strength increases by about a factor of two with an adhesion promoter for both $2.6{\mu}m$ and $0.4{\mu}m$ thick BCB, because of the formation of covalent bonds between adhesion promoter and the surface of the bonded materials. The bond strength at the interface between a silicon wafer with deposited oxide and BCB is about a factor of three higher than that at the interface between a glass wafer and BCB. This difference in bond strength is attributed to the difference in Si-O bond density at the interfaces. At the interfaces between plasma enhanced chemical vapor deposited (PECVD) oxide coated silicon wafers and BCB, and between thermally grown oxide on silicon wafers and BCB, 12~13 and $15{\sim}16bonds/nm^2$ need to be broken. This corresponds to the observed bond energies, $G_0s$, of 18 and $22J/m^2$, respectively. Maximum 7~8 Si-O $bonds/nm^2$ are needed to explain the $5J/m^2$ at the interfaces between glass wafers and BCB.

A Study on the Status of Working Environment of Some Rubber and Chemical Products Manufacturing Industries in Busan (고무와 화학제품 제조업 산업장의 작업환경실태에 관한 조사연구)

  • Kim, J.Y.;Lee, C.U.;Pae, K.T.;Kim, J.H.;Kim, J.O.;Kim, D.K.;Kim, Y.W.;Chun, C.H.
    • Journal of Preventive Medicine and Public Health
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    • v.14 no.1
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    • pp.97-110
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    • 1981
  • This study was conducted in order to investigate the status of harmful working environ ment on twelve rubber and ten chemical products manufacturing industries in Busan area over a period of five months from lune 1 to October 31, 1980. The summarized results were as follows: 1. The highest and lowest mean values of harmful environmental elements in workroom of rubber products manufacturing industries were noted in twisting (98.7dB) and coating department (77.3dB) to noise, molding ($6.43mg/m^3$) and forming ($1.33mg/m^3$) to dust, bonding (toluene 463.7ppm, xylene 457.8ppm and benzene 111.8ppm, respectively) and splicing (toluene 90.0ppm, xylene 83.3ppm and benzene 6.7ppm, respectively) to organic solvents, respectively. Also in chemical products manufacturing, they were noted in grinding (95.1dB) and shining department (76.8dB) to noise, packing ($4.30mg/m^3$) and staining ($3.20mg/m^3$) to dust, shining (393.3ppm and 375.0ppm, respectively) and varnishing(125.5ppm and 121.7ppm, respectively) to toluene and xylene, and scattering (51.8ppm) and mixing (23.9ppm) to benzene, respectively. 2. The mean values of harmful elements in workroom of rubber products manufacturing were 86.3dB to noise, $4.16mg/m^3$ to dust, 258.2ppm to toluene, 230.3ppm to xylene, and 5 4.0ppm to benzene, respectively. Also in chemical products manufacturing, they were 85.2dB to noise, $3.69mg/m^3$ to dust, 227.9ppm to toluene, 213.2ppm to xylene, and 36.3ppm to benzene, respectively. 3. Number of workers exposed to harmful working environment, over TLV, of a total 10,195 workers in rubber products manufacturing were 1,002(9.8%) to noise, 212 (2.1%) to dust, 1,581(15.5%) to toluene, 1,509(14,8%) to xylene, and 1,524(15.0%) to benzene, respectively. Number of workers exposed to harmful working environment, over TLV, of a 1,913 workers in chemical products manufacturing were 112(5.9%) to noise, 132(6.9%) to each organic solvent, respectively. 4. The values of noise and dust of rubber and chemical products manufacturing in 1980 were lower then those in 1977, but the value of organic solvent in 1980 was similar with that in 1977.

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Efficacy of Aloclair$^{TM}$ for Treatment of Intraoral Ulcer Caused by Orthodontic Appliance (교정장치에 의해 유발된 구내궤양 치료에 대한 Polyvinylpyrrolidone-sodium hyaluronate (Aloclair$^{TM}$)의 임상적 효과)

  • Lee, Ju-Hee;Lee, Sang-Min;Park, In-Young
    • Journal of Dental Rehabilitation and Applied Science
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    • v.28 no.2
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    • pp.109-118
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    • 2012
  • This experimental study was undertaken to evaluate the efficacy of polyvinylpyrrolidone-sodium hyaluronate(Aloclair$^{TM}$) in decreasing pain in orthodontic procedures. A total of 60 patients who were use Aloclair$^{TM}$ ordered to were included. These patients were categorized by 3 cases; 1. Patients who were bonded with their first brackets. 2. Patients who were in pain with additional appliance such as anchorage devices. 3. Patients who got ulcer caused by appliances. We collected information about pain and assessed it using visual analogue scale. According to questionnaire, it took 3.5 min. for pain to subside and pair relief durated for 2.7 hours. Most patients in the study reported rapid pain relief and found Aloclair$^{TM}$ easy and pleasant to use than wax. Accordingly Aloclair$^{TM}$ provided raid relief of resting and provoked ulcer pain.

Preparation of Nanostructures Using Layer-by-Layer Assembly and Applications (층상자기조립법을 이용한 나노구조체의 제조와 응용)

  • Cho, Jin-Han
    • Journal of the Korean Vacuum Society
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    • v.19 no.2
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    • pp.81-90
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    • 2010
  • We introduce a novel and versatile approach for preparing self-assembled nanoporous multilayered films with antireflective properties. Protonated polystyrene-block-poly (4-vinylpyrine) (PS-b-P4VP) and anionic polystyrene-block-poly (acrylic acid) (PS-b-PAA) block copolymer micelles (BCM) were used as building blocks for the layer-by-layer assembly of BCM multilayer films. BCM film growth is governed by electrostatic and hydrogen-bonding interactions between the oppositely BCMs. Both film porosity and film thickness are dependent upon the charge density of the micelles, with the porosity of the film controlled by the solution pH and the molecular weight (Mw) of the constituents. PS7K-b-P4VP28K/PS2K-b-PAA8K films prepared at pH 4 (for PS7K-b-P4VP28K) and pH 6 (for PS2K-b-PAA8K) are highly nanoporous and antireflective. In contrast, PS7K-b-P4VP28K/PS2K-b-PAA8K films assembled at pH 4/4 show a relatively dense surface morphology due to the decreased charge density of PS2K-b-PAA8K. Films formed from BCMs with increased PS block and decreased hydrophilic block (P4VP or PAA) size (e.g., PS36K-b-P4VP12K/PS16K-b-PAA4K at pH 4/4) were also nanoporous. Furthermore, we demonstrate that the nanostructured electrochemical sensors based on patterning methods show the electrochemical activities. Anionic poly(styrene sulfonate) (PSS) layers were selectively and uniformly deposited onto the catalase (CAT)-coated surface using the micro-contact printing method. The pH-induced charge reversal of catalase can provide the selective deposition of consecutive PE multilayers onto patterned PSS layers by causing the electrostatic repulsion between next PE layer and catalase. Based on this patterning method, the hybrid patterned multilayers composed of platinum nanoparticles (PtNP) and catalase were prepared and then their electrochemical properties were investigated from sensing $H_2O_2$ and NO gas. This study was based on the papers reported by our group. (J. Am. Chem. Soc. 128, 9935 (2006); Adv. Mater. 19, 4364 (2007); Electro. Mater. Lett. 3, 163 (2007)).

MICROTENSILE BOND STRENGTH OF SELF-ETCHING AND SELF-ADHESIVE RESIN CEMENTS TO DENTIN AND INDIRECT COMPOSITE RESIN (간접 복합레진 합착 시 자가부식형과 자가접착형 레진시멘트의 상아질에 대한 미세인장 결합강도)

  • Park, Jae-Gu;Cho, Young-Gon;Kim, Il-Sin
    • Restorative Dentistry and Endodontics
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    • v.35 no.2
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    • pp.106-115
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    • 2010
  • The purpose of this study was to evaluate the microtensile bond strength (${\mu}TBS$), failure modes and bonding interfaces of self-etching and three self-adhesive resin cements to dentin and indirect composite resin. Cylindrical composite blocks (Tescera, Bisco Inc.) were luted with resin cements (PA: Panavia F 2.0, Kuraray Medical Inc., RE: RelyX Unicem Clicker, 3M ESPE., MA: Maxem, Kerr Co., BI: BisCem, Bisco Inc.) on the prepared occlusal dentin surfaces of 20 extracted molars. After storage in distilled water for 24 h, $1.0\;mm\;{\times}\;1.0\;mm$ composite-dentin beams were prepared. ${\mu}TBS$ was tested at a cross-head speed of 0.5 mm/min. Data were analyzed with one-way ANOVA and Tukey's HSD test. Dentin sides of all fractured specimens and interfaces of resin cements-dentin or resin cements-composite were examined at FESEM (Field Emission-Scanning Electron Microscope). In conclusion, PA and RE showed higher bond strength and closer adaptation than MA and BI when indirect composite blocks were luted to dentin using a self-etching and three self-adhesive resin cements.

A Study on the Mixed Organic Solvent Dose and Subjective Symptoms of Direct and Indirect Bonding workers in Shoes Manufacturing Industrial (신발제조업체의 접착제 사용에 따른 직접·간접폭로 근로자들의 복합유기용제 폭로량과 자각증상 비교)

  • Byun, Jeong-Sik;Kim, Jeong-Yun;Cho, Young-Chae;Kim, Dong-Hyun
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.5 no.1
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    • pp.48-58
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    • 1995
  • This study was performed to find out the exposure level of mixed organic solvents, excretion of urinary hippuricacid and subjective symptoms according to the exposure of organic solvents of female workers who works on 5 shoes manufacturing industries in Taejon City from 24, september to 20, october 1993. The studied groups were divided into 3 groups that were consist of direct exposure group(48 workers), indirect exposure group(49 workers) and non-exposure group(68 workers) to the organic solvents. The exposure levels of toluene of direct exposure group which $89.86{\pm}56.20ppm$ had higher than that of indirect exposure group which had $40.23{\pm}47.21ppm$. In the exposure level of mixed organic solvent(R-value), direct exposure group was $2.84{\pm}1.53$ and exceeded approximatly 3 times the R-value. Whereas, indirect exposure group was not exceeded the R-value as $0.80{\pm}0.61$. In the excretion level of urinary hippuric acid, direct exposure group was $1.78{\pm}1.25g/l$, indirect exposure group was $1.22{\pm}0.93g/l$ and non-exposure group was $0.51{\pm}0.18g/l$ respectively. Therefore both direct exposure group and indirect exposure group were significantly higher than non-exposure group(P<0.01). In the correlation between toluene levels and urinary hippuric acid level, the direct exposure group had positive correlation(R=0.8309, P<0.01), also indirect exposure group had positive correlation(R=0.5859, P<0.05) and also in the correlation between the R value of mixed organic solvents and the urinary hippuric acid levels, the direct exposure group had positive correlation(R=0.4492, P<0.05), and indirect exposure group had ositive correlation(R=0.7911, P<0.01). In the complain rates of the worker's subjective symptoms at work, both direct exposure group and indirect exposure group were higher than non-exposure group(P<0.05, P<0.01). But the sujective symptoms of "floating sensation" of direct exposure group had significantly higher than indirect exposure group. In the percent of subjective symptoms complaints during the worker's daily life, both direct exposure group and indirect exposure group had generally more statistical significance than nonexposure group(P<0.01), direct exposure group had not statistical significant difference from indirect exposure group. As the results mentioned above, it has been analysed that the indirect at the adjacent manufaturing process are exposed to the considerable amount of solvent. Therefore, I think that there should be the betterment of surrounding through the complete working environment management to the occurrence source of the organic solvent, the changes of health management system to the indirect-exposed workers, and the systematic management of the special medical examination and the like.

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