• Restorative Dentistry and Endodontics
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• v.38 no.1
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• pp.43-47
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• 2013

Objectives: The aim of this study was to determine an appropriate application duration of sodium ascorbate (SA) antioxidant gel in reducing microleakage of bonded composite restoration in intracoronally-bleached teeth. Materials and Methods: Eighty endodontically-treated human incisors were randomly divided into eight groups: control, no bleaching; IB and DB, immediate and delayed bonding after bleaching, respectively; S10m, S60m, S24h, S3d and S7d, bleaching + SA gel for 10 min, 60 min, 24 hr, 3 day and 7 day, respectively. For bleaching, a mixture of 30% hydrogen peroxide and sodium perborate was applied for 7 day. All access cavities were restored using One-Step adhesive (Bisco Inc.) and then Aelite LS Packable composite (Bisco Inc.). The bonded specimens were subjected to 500 thermal cycles, immersed in 1% methylene blue for 8 hr, and longitudinally sectioned. Microleakage was assessed with a 0 - 4 scoring system and analyzed using nonparametric statistical methods (${\alpha}$ = 0.05). Results: Group IB showed a significantly higher microleakage than the control group (p = 0.006) and group DB a statistically similar score to the control group (p > 0.999). Although groups S10m, S60m, and S24h exhibited significantly higher scores than group DB (p < 0.05), the microleakage in groups S3d and S7d was statistically similar to that in group DB (p = 0.771, p > 0.999). Conclusions: Application of SA gel for 3 day after nonvital bleaching was effective in reducing microleakage of composite restoration in intracoronally-bleached teeth.

• Journal of the Korean Chemical Society
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• v.64 no.1
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• pp.30-37
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• 2020

The purpose of this study was to identify the problems faced by students in sub-microscopic representation of acid-base reactions. Herein, we selected 30 students of 12^th grade science classes, who had studied various acid-base models. In order to investigate the sub-microscopic representation ability of the students, we developed nine items related to various contexts, such as one type of solute and solvent, two types of solutes and solvent, cases with water as solvent or with nonaqueous solvents. For all items, we consistently observed lack of concept of chemical change. In context of aqueous and nonaqueous solutions, the frequency of lack of concept of chemical bonding was high if ammonia was the solute or solvent. Moreover, the frequency of lack of concept related to the degree of electrolytic dissociation was high. Therefore, chemistry teachers should understand that students' ability to sub-microscopic representation of acid-base reactions can be enhanced by analyzing the difficulties faced by the students in solving diverse acid-base problems.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.289.2-289.2
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• 2016

In-Ga-Zn-O(IGZO) receive great attention as a channel material for thin film transistors(TFTs) as next-generation display panel backplanes due to its superior electrical and physical properties such as a high mobility, low off-current, high sub-threshold slope, flexibility, and optical transparency. For the purpose of fabricating high performance IGZO TFTs, a thermal recovery process above a temperature of $300^{\circ}C$ is required for recovery or rearrangement of the ionic bonding structure. However diffused metal atoms from source/drain(S/D) electrodes increase the channel conductivity through the oxidation of diffused atoms and reduction of $In_2O_3$ during the thermal recovery process. Threshold voltage ($V_{TH}$) shift, one of the electrical instability, restricts actual applications of IGZO TFTs. Therefore, additional investigation of the electrical stability of IGZO TFTs is required. In this paper, we demonstrate the effect of Ti diffusion and modulation of interface traps by carrying out an annealing process on IGZO. In order to investigate the effect of diffused Ti atoms from the S/D electrode, we use secondary ion mass spectroscopy (SIMS), X-ray photoelectron spectroscopy, HSC chemistry simulation, and electrical measurements. By thermal annealing process, we demonstrate VTH shift as a function of the channel length and the gate stress. Furthermore, we enhance the electrical stability of the IGZO TFTs through a second thermal annealing process performed at temperature $50^{\circ}C$ lower than the first annealing step to diffuse Ti atoms in the lateral direction with minimal effects on the channel conductivity.

• Restorative Dentistry and Endodontics
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• v.29 no.1
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• pp.13-22
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• 2004

본 연구는 치수강 상아질 부위 및 상아질 접착제 종류에 따른 결합 강도를 측정하고 이들 사이의 상관관계를 구명하고자 시행되었다 45개의 대구치를 포매 후, 대조군에서는 교합면 법랑질 제거 후 ＃600 SiC paper까지 순차연마하여 상아질을 노출시켰고, 실험군에서는 치수강 개방 후 1시간동안 NaOCl에 보관 후 axial wall과 pulpal floor를 노출시켰다. 노출된 상아질 면에 상아질 접착제를 적용한 후 Z-100을 충전한 다음 40초간 광중합하였다. 사용된 상아질 접착제는 Scotchbond Multi-Purpose와 Single Bond, Clearfil SE Bond였다. $37^{\circ}C$ 증류수에 24시간 보관 후, 저속 diamond saw를 이용하여 0.7mm 두께로 수직절단하고 고속 diamond point(#104)로 단면적 $1{mm}^2$가 되도록 시편을 제작하고, Universal testing machine에서 미세인장 결합강도를 측정하였다. 1. 모든 상아질 접착제의 미세인장강도는 대조군, axial wall군, pulpal floor군 순으로 감소하는 경향을 보였다. 2. 대조군에서 SM과 BB는 SE에 비해 유의성 있게 높은 결합강도를 나타내었다(p<0.05). 3. SM과 SB는 대조군에 비해 axial wall군과 pulpal floor군에서 유의성있게 낮은 결합강도를 보였으나, SE에서는 pulpal floor군만이 유의성 있게 낮은 결합강도를 보였다(p<0.05). 4. Axial wall군과 pulpal floor군에서는 상아질 접착제의 종류에 따른 유의차를 보이지 않았다. 5. 전자현미경 소견에서는 대조군에 비해 axial wall군과 pulpal floor군이 더 부드러운 접착 계면을 나타내었다. 혼성층의 두께는 결합강도의 감소와는 관련이 없었다.

• Bulletin of the Korean Chemical Society
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• v.23 no.2
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• pp.215-220
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• 2002

The structures of 1-fluorosilatrane and the silatranyl cation were calculated by Hartree-Fock (HF), Mofller-Plesset second order (MP2), and various density functional theory (DFT) methods using many different basis sets, demonstrating that the Si-N bonds in two species are quite different. The N${\rightarrow}$Si bond distance of 1-fluorosilatrane from the hybrid DFT calculations $({\sim}2.32{\AA})$ using the Perdew-Wang correlation functional agrees with the gas phase experimental value $(2.324{\AA})$, while other functionals yield larger distances. The MP2 bond distance (2.287${\AA}$ with 6-311$G^{\ast}$) is shorter, and the HF one (2.544 ${\AA}$ with 6-311$G^{\ast}$) larger than those of DFT calculations. The MP2 bond distance is in good agreement with experiment indicating that the electron correlations are crucial for the correct description of the N${\rightarrow}$Si interaction. The silatranyl cation is a stable local minimum on the potential energy surface in all methods employed suggesting that the cation could be a reaction intermediate. The Si-N bond length for the cation is about 1.87 ${\AA}$ for all calculations tested implying that the Si-N bond is mainly conventional. Bonding characteristics of the Si-N bond in two species derived from the natural bond orbital analysis support the above argument based on calculated bond lengths.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.49-56
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• 2007

Effects of post-baking treatment conditions on the interfacial adhesion between electroless plated Ni and polyimide film were evaluated using $180^{\circ}C$ peel test. Measured peel strength values monotonically decrease from $38.6{\pm}1.1g/mm\;to\;26.8{\pm}2.2g/mm$ for the variations of post-baking treatment temperatures from $80^{\circ}C\;to\;180^{\circ}C$, respectively. Wet chemical treatment on the polyimide surface produces carboxyl and amide functional groups on the surface which is closely related to the change in interfacial adhesion between electroless Ni and polyimide films. It is speculated that interfacial adhesion seems to be controlled by carbonyl oxygen bonding near cohesive failure region during post-baking treatment.

• Korean Journal of Crystallography
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• v.11 no.1
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• pp.22-27
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• 2000

The structure of cis-(malonato)[(4R,5R)-4,5-bis(aminomethyl)-2-isopropyl-1,3-dioxolane]platinum(II) with a potent anticancer activity has been determined by the X-ray crystallographic method. Crystal data are as follows: Pt(C/sub 11/H/sub 20/N₂O/sub 6/), M/sub 4/=471.38, monoclinic, P2₁, a=7.112(1), b=33.615(3), c=7.135(1)Å, β=116.80(1)°, V=1522.6(3)Å, and Z=4. The two independent molecules with very similar structures are approximately related by pseudo two-fold screw axis symmetry, which makes the monolinic cell look like the orthorhombic cell with one molecule in the asymmetric unit and space group C222₁. The crystal packing mode is similar to that of the analogue with the dimethyl substituents instead of the isopropyl group. The Pt atom is coordinate to two O and two N atoms in a square planar structure. The six-membered chelate ring in the leaving ligand assumes a conformation intermediate between the half chair and the boat forms. The seven-membered ring in the carrier ligand assumes a twist-chair conformation and the oxolane ring assumes an envelope conformation. Crystal packing consists of the extensive hydrogen-bonding network in the two-dimensional molecular layers and weak van der Waals interactions between these layers.

• The Journal of Korean Academy of Prosthodontics
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• v.45 no.4
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• pp.407-418
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• 2007

Purpose: The objective of this study was to evaluate the effects of hydrofluoric acid concentration & etching time on the shear bond strength between IPS Empress 2 ceramic and resin cement. Material and methods: Thirty three rectangular shape ceramic specimens($20{\times}12{\times}5mm$ size, IPS Empress 2 core materials) were used for this study. The ceramic specimens divided into ten experimental groups with three specimens in each group and were etched with hydrofluoric acid(4%, 9%) according to different etching times(30s, 60s, 90s, 120s, 180s). Etched surfaces of ceramic specimens were bonded with resin cement(Rely X Unicorn) using acrylic glass tube. All cemented specimens were tested under shear loading until fracture on universal testing machine at a crosshead speed of 0.5mm/min and the maximum load at fracture(kg) was recorded. Collected shear bond strength data were analyzed with one way ANOVA and Duncan tests. All etched ceramic surfaces were examined morphologically using SEM(scanning electron microscopy). Results: Shear bond strength of etching group$(35.89{\sim}68.01MPa)$ had four to seven times greater than no-etching group$(9.53{\pm}2.29MPa)$. The ceramic specimen etched with 4% hydrofluoric acid for 60s showed the maximum shear bond strength$(68.01{\pm}11.78MPa)$. Ceramic surface etched with 4% hydrofluoric acid for 60s showed most retentive surface texture. Conclusion: It is considered that 60s etching with 4% hydrofluoric acid is optimal etching methods for IPS Empress 2 ceramic bonding.

• Journal of Dental Rehabilitation and Applied Science
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• v.21 no.1
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• pp.69-81
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• 2005

The objective of this study was to evaluate the toothbrush abrasion characteristics of class V restorations. Thirty extracted human premolars, which were collected from oral surgery clinics were used. We mounted five teeth in a metal ring mold of 50 mm in diameter and 15 mm in height using chemically cured acrylic resin. Class V cavities were prepared in lingual cervical root surfaces and restored using one of following restorative materials : Dentin Conditioner/Fuji II LC (Group FL), All Bond II/Z-250 (Group ZT), One-up Bond F/Palfigue Estelite (Group PE), F2000 Primer/Adhesive (Group FT), and Prime & Bond 2.1/Dyract AP (Group DR). They were stored under distilled water at $37^{\circ}C$ for seven days. The toothbrush abrasion test was conducted using a wear testing machine of pin-on disk type under a load of 1.5 N for 100,000 cycles. We have examined the bonded interfaces, the changes of surface roughness and color of abraded surfaces. From this experiment, the following results were obtained. 1. The change of surface roughness showed high degree: RMGIC>compomer>composite resin (p<0.05). 2. Because of the protrusion and missing of filler particles, SEM observation of abraded surfaces of RMGIC and compomers revealed the increase of surface roughness due to the selective removal of matrix resin. 3. The color change by toothbrush abrasion was affected in large part by the change of $L^*$ and $b^*$ of resin composites (p<0.05). 4. The color change by toothbrush abrasion was so small to detect by human eyes. 5. SEM observation of abraded surfaces revealed the interface bonding was the best in the FT group.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.