• 마이크로전자및패키징학회지
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• 제7권4호
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• pp.17-22
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• 2000

In this paper, methods to analyze wire sweep during the semiconductor chip encapsulation have been studied. The wire sweep analysis is used to analyze the deformation of bonding wires that connect the chip to the leadframe during encapsulation. The analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The results from the numerical simulation are closest to the experimental results.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2001년도 추계학술대회(제116회) 및 13회 Workshop 제3회 한ㆍ일 치과보존학회 공동학술대회 초록집
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• pp.576.2-576
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• 2001

The purpose of this study was to evaluate the effect of dentinal sclerosis and tubular orientation on Class V restoration bonded with three dentin bonding agents using confocal laser scanning microscope(CLSM). Class V cavities were prepared from freshly extracted caries-free human teeth. thirty of these cavities were divided into two groups based upon the status of class V cavities: Group 1, cervical abrasive lesions without preparation; Group 2, artificially-prepared wedge-shaped cavities.(omitted)

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 추계학술대회 논문집 학회본부
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• pp.413-415
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• 1996

This paper presents a technique for fabricating an electro-optical microlens for microcolumn e-beam system. The device, named Self-Aligned Microlens (SAM) was realized by mixing surface and bulk micromachining technology. The microbridges were formed on both sides of silicon wafer symmetrically. The alignment error between the electrodes could be controlled within a few micrometers with also reducing the numbers of anodic bonding.

• 대한치과의사협회지
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• 제48권9호
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• pp.680-687
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• 2010

The purpose of this study was to compare post cementation efficacy according to the different adhesive systems and cement delivery methods. A total of 40 extracted human single-rooted premolar teeth were randomly divided in four groups according to the two luting agents of Unicem applicap (3M ESPE, St. Paul, MN, USA) or Variolink II (Ivoclar Vivadent, Liechtenstein) and cement delivery methods of direct cement application or lentulo spiral application. After restoration using glass?fiber posts, the samples were embedded in acrylic resin. Three sections of 2 mm thickness were prepared from each specimen, and the post in each section was subjected to a push-out test. The data were analysed statistically at significant level of 95%. The Unicem had significantly higher push-out bond strength than Variolink and the lentulo spiral application made higher bond strength (p<0.05). Adhesive failure between cement and dentin was predominant in all groups. The Unicem of self-etch system and cement delivery using lentulo spiral showed clinically acceptable and comparable bonding strength for the fiber post.

• Restorative Dentistry and Endodontics
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• 제40권1호
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• pp.23-29
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• 2015

Objectives: The aim of this study was to evaluate the effect of pre-etching on the bond strength of silorane-based composite specific adhesive system to dentin. Materials and Methods: Thirty human molars were randomly divided into 5 groups according to the different bonding strategies. For teeth restored with silorane-based composite (Filtek Silorane, 3M ESPE), the specific self-etching adhesive system (Adhesive System P90, 3M ESPE) was used with and without pre-etching (Pre-etching/Silorane and Silorane groups). Teeth restored with methacrylate based-composite (Filtek Z250, 3M ESPE) were hybridized with the two-step self-etching system (Clearfil SE Bond, Kuraray), with and without pre-etching (Pre-etching/Methacrylate and Methacrylate groups), or three-step adhesive system (Adper Scotchbond Multi-Purpose, 3M ESPE) (Three-step/Methacrylate group) (n = 6). The restored teeth were sectioned into stick-shaped test specimens ($1.0{\times}1.0mm$), and coupled to a universal test machine (0.5 mm/min) to perform microtensile testing. Results: Pre-etching/Methacrylate group presented the highest bond strength values, with significant difference from Silorane and Three-step/Methacrylate groups (p < 0.05). However, it was not significantly different from Pre-etching/Silorane and Methacrylate groups. Conclusions: Pre-etching increased bond strength of silorane-based composite specific adhesive system to dentin.

• 대한소아치과학회지
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• 제37권4호
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• pp.445-452
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• 2010

최근 CPP-ACP의 초기 우식증의 재광화 및 예방 효과에 대한 연구가 많이 진행되고 있다. 그러나, CPP-ACP 적용으로 인한 법랑질 산부식 저항성 증가가 치면열구전색제 접착에 미치는 영향에 대해서는 연구가 부족한 실정이다. 본 연구에서는 CPP-ACP의 치면 도포 여부와 치면열구전색제의 접착 방법의 차이가 법랑질과 치면열구전색제의 결합력에 미치는 영향에 대하여 미세전단결합강도 측정법으로 알아보고자 하였다. 건전한 제3대구치를 사용하여 150개의 시편을 제작하였으며, 다음과 같이 6군으로 나누었다. I군: 인공타액에 2주 보관 후 35% 인산 산부식 II군: 인공타액에 2주 보관 후 35% 인산 산부식 + 접착제 III군: 인공타액에 2주 보관 후 자가 부식 접착제 IV군: CPP-ACP 2주 적용 후 35% 인산 산부식 V군: CPP-ACP 2주 적용 후 35% 인산 산부식 + 접착제 VI군: CPP-ACP 2주 적용 후 자가 부식 접착제 6군의 시편에 치면열구전색제 접착 후 미세전단결합강도를 측정하여 다음과 같은 결과를 얻었다. CPP-ACP 적용은 전통적인 산부식 방법으로 치면열구전색제를 접착하는 경우에는 결합강도와 산부식 양상에 영향을 미치지 않으나, 자가 부식 접착제를 사용한 경우에는 치면열구전색제의 결합강도를 약화시켰다.

• 한국재료학회지
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• 제20권11호
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• pp.606-610
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• 2010

Films consisting of a silicon quantum dot superlattice were fabricated by alternating deposition of silicon rich silicon nitride and $Si_3N_4$ layers using an rf magnetron co-sputtering system. In order to use the silicon quantum dot super lattice structure for third generation multi junction solar cell applications, it is important to control the dot size. Moreover, silicon quantum dots have to be in a regularly spaced array in the dielectric matrix material for in order to allow for effective carrier transport. In this study, therefore, we fabricated silicon quantum dot superlattice films under various conditions and investigated crystallization behavior of the silicon quantum dot super lattice structure. Fourier transform infrared spectroscopy (FTIR) spectra showed an increased intensity of the $840\;cm^{-1}$ peak with increasing annealing temperature due to the increase in the number of Si-N bonds. A more conspicuous characteristic of this process is the increased intensity of the $1100\;cm^{-1}$ peak. This peak was attributed to annealing induced reordering in the films that led to increased Si-$N_4$ bonding. X-ray photoelectron spectroscopy (XPS) analysis showed that peak position was shifted to higher bonding energy as silicon 2p bonding energy changed. This transition is related to the formation of silicon quantum dots. Transmission electron microscopy (TEM) and electron spin resonance (ESR) analysis also confirmed the formation of silicon quantum dots. This study revealed that post annealing at $1100^{\circ}C$ for at least one hour is necessary to precipitate the silicon quantum dots in the $SiN_x$ matrix.

• Restorative Dentistry and Endodontics
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• 제34권6호
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• pp.467-476
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• 2009

본 연구의 목적은 아말감과 복합레진의 수복 과정과 수복 후 상아세관액의 흐름(dentinal fluid flow, DFF)을 측정하기 위함이다. 치근을 절제한 제 3 대구치를 자체 제작한 미세 유체 흐름 측정장치에 연결한 후 1급 와동을 형성하여 아말감과 복합레진 수복을 시행하였다. DFF의 측정은 와동 형성부터 수복 후 30분까지 연속적으로 이루어졌고, 수복 후 3, 7일에 재 측정하였다. 주수 하에 와동 형성 시 DFF는 inward로, 끝난 후에는 outward로 바뀌었다. 아말감 충전 시 DFF는 inward로 바뀌었고 충전 완료 후 미약한 outward DFF를 보였다. 복합레진 수복의 경우, 산 처리 후 수세와 건조 시 각각 inward와 outward DFF를 보였고 primer도포 후 공기 분사는 급격한 outward, 소수성 본딩제를 적용하는 단계에서는 outward 였던 DFF가 감소하여 0에 가까워지거나 약간 inward 흐름을 보였다. 접착제와 복합레진의 광중합은 급격한 inward의 DFF를 일으켰다. 수복 후 30분, 3일, 7일째 수복 재료에 따른 DFF의 감소에 통계적으로 유의한 차이는 없었다 (p>0.05).

• Restorative Dentistry and Endodontics
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• 제36권4호
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• pp.280-289
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• 2011

연구목적: 본 연구의 목적은 다양한 소수성을 지닌 최신 상아질 접착시스템과 저수축 silorane 레진의 미세인장결합강도를 평가하는 것이다. 연구 재료 및 방법: 36개의 갓 발치된 제3대구치를 이용했다. Low-speed diamond saw를 사용하여 교합면에 평행하게 치관을 잘라 middle dentin을 노출시켰다. 치아를 무작위로 9 group으로 나눴다. Silorane self-etch adhesives (SS), SS + phosphoric acid etching (SS + pa), Adper Easy bond (AE), AE + Silorane system bonding (AE + SSb), Clearfil SE bond (CSE), CSE + SSb, All-Bond 2 (AB2), AB2 + SSb, All-Bond 3 (AB3). 접착제를 적용한 후에 Filtek LS (3M ESPE)를 2 mm씩 3회 적층충전하였다. 각 층은 40s씩 광중합하였다. 0.8 mm ${\times}$ 0.8 mm stick을 Micro Tensile Tester로 1 mm/min cross-head speed의 인장력을 가하였다. 파절양상를 관찰하기 위해 광학현미경을 이용하였다. 5가지 접착제의 소수성정도를 결정하기위해 water sorption test하였다. 결과: silorane 레진과 5가지 접착제의 ${\mu}TBS$: SS, 23.2 ${\pm}$ 6.9 MPa; CSE, 19.4 ${\pm}$ 4.4 MPa; AB3, 30.3 ${\pm}$ 4.0 MPa; AB2와 AE, no bond. Additional layering of SSb: CSE + SSb, 26.2 ${\pm}$ 10.3 MPa; AB2 + SSb, 33.9 ${\pm}$ 7.3 MPa; AE + SSb, no bond. 높은 ${\mu}TBS$는 cohesive failure와 관련있었다. SS는 낮은 가장 낮은 water sorption을 보였고 다음으로 AB3, AE, CSE, AB2 순서였다. AE는 가장 높은 용해도를 나타냈고 다음으로 CSE, AB2였다. 결론: 접착제의 소수성이 증가할수록, silorane 레진의 접착강도도 증가하였다. 비전용접착제 위에 silorane adhesive bonding을 layering하는 것은 AB2 + SSb 그룹에서만 결합강도를 유의하게 증가시켰다. AB3는 SS와 유사한 ${\mu}TBS$ & water sorption을 나타냈다. 따라서 AB3는 siloran resin을 접착시키는데 SS를 대체할만한 경쟁력있는 접착제이다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1511_1512
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• 2009

This paper presents a polarization switching antenna integrated with silicon RF MEMS SPDT switches in the form of a package. A low-loss quartz substrate made of SoQ (silicon-on-quartz) bonding is used as a dielectric material of the patch antenna, as well as a packaging lid substrate of RF MEMS switches. The packaging/antenna substrate is bonded with the bottom substrate including feeding lines and RF MEMS switches by BCB adhesive bonding, and RF energy is transmitted from signal lines to antenna by slot coupling. Through this approach, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects, which are all caused from the packaging methods, can be reduced. This structure is expected to be used as a platform for reconfigurable antennas with RF MEMS tunable components. A linear polarization switching antenna operating at 19 GHz is manufactured based on the proposed method, and the fabrication process is carefully described. The s-parameters of the fabricated antenna at each state are measured to evaluate the antenna performance.