• Title/Summary/Keyword: school bonding

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Anodic bonding Characteristics of MLCA to Si-wafer Using Evaporated Pyrex #7740 Glass Thin-Films for MEMS Applications (파이렉스 #7740 유리박막을 이용한 MEMS용 MLCA와 Si기판의 양극접합 특성)

  • Chung, Gwiy-Sang;Kim, Jae-Min;Yoon, Suk-Jin
    • Journal of Sensor Science and Technology
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    • v.12 no.6
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    • pp.265-272
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    • 2003
  • This paper describes anodic bonding characteristics of MLCA (Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100%, input power $1\;W/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA and Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-0.08 %FS. Moreover, any damages or separation of MLCA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MLCA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

Effects of DC Substrate Bias Power Sources and Reactant Gas Ratio on Synthesis and Tribological Properties of Ternary B-C-N Coatings (기판 바이어스 DC 전원의 종류와 반응가스 분압비가 3성분계 B-C-N 코팅막의 합성과 마찰 특성에 미치는 영향)

  • Jeong, Da-Woon;Kim, Doo-In;Kim, Kwang-Ho
    • Journal of the Korean institute of surface engineering
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    • v.44 no.2
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    • pp.60-67
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    • 2011
  • Ternary B-C-N coatings were deposited on Si(100) wafer substrate from $B_4C$ target by RF magnetron sputtering technique in $Ar+N_2+CH_4$ gas mixture. In this work, the effect of reactant gas ratio, $CH_4/(N_2+CH_4)$ on the composition, kinds and amounts of bonding states comprising B-C-N coatings were investigated using two different bias power sources of continuous and unipolar DCs. In addition, the tribological properties of coatings were studied with the composition and bonding state of coating. It was found that the substrate bias power had an effect on chemical composition, and all of the obtained coatings were nearly amorphous. Main bonding states of coatings were revealed from FTIR analyses to be h-BN, C-C, C-N, and B-C. The amount of C-C bonging mainly increased with increase of the reactant gas ratio. From our studies, both C-C and h-BN bonding states improved the tribological properties but B-C one was found to be harmful on those. The best coating from tribological points of view was found to be $BC_{1.9}N_{2.3}$ composition.

Synthesis of Cysteine Capped Silver Nanoparticles by Electrochemically Active Biofilm and their Antibacterial Activities

  • Khan, Mohammad Mansoob;Kalathil, Shafeer;Lee, Jin-Tae;Cho, Moo-Hwan
    • Bulletin of the Korean Chemical Society
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    • v.33 no.8
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    • pp.2592-2596
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    • 2012
  • Cysteine capped silver nanoparticles (Cys-AgNPs) have been synthesized by employing electrochemically active biofilm (EAB), $AgNO_3$ as precursor and sodium acetate as electron donor in aqueous solution at $30^{\circ}C$. Cys-AgNPs of 5-10 nm were synthesized and characterized by UV-Vis, FT-IR, XRD and TEM. Capping of the silver nanoparticles with cysteine provides stability to nanoparticles by a thiolate bond between the amino acid and the nanoparticle surface and hydrogen bonding among the Cys-AgNPs. In addition, the antibacterial effects of as-synthesized Cys-AgNPs have been tested against two pathogenic bacteria Escherichia coli (O157:H7) and Pseudomonas aeruginosa (PAO1). The results demonstrate that the as-synthesized Cys-AgNPs can proficiently inhibit the growth and multiplication of E. coli and P. aeruginosa.

Relationship among Perception of Parenting Attitude, Behavior Problems and Resilience of School Age Children (학령기 아동이 인지한 부모의 양육태도, 문제행동과 적응유연성과의 관계)

  • Yun, Hyun-Jung;Yoo, Il-Young;Oh, Eui-Geum
    • Child Health Nursing Research
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    • v.17 no.3
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    • pp.174-180
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    • 2011
  • Purpose: This study was conducted to describe the relationship of perception of parenting attitude, behavior problems and resilience of school age children. Methods: Participants were 131 children enrolled in the 4th to 6th grades. Data were collected from November 29 to December 6, 2010 using a self-report questionnaire. The questionnaire included the Parental Bonding Instrument, Korean version of Youth Self-Report, and Resilience. Data were analyzed using SPSS WIN 18.0 program. Results: There were significant differences in resilience according to gender, relationship with peers, academic achievement and school satisfaction. Resilience showed a positive correlation with parental bonding attitude and negative correlation with problem behavior in the children. Conclusion: This result suggests that interventions focusing on parenting attitude to enhance resilience should be developed to help school age children.

Bonding and Physical Characteristics of Diamond-like Carbon Films Prepared by Laser Ablation (레이저 어블레이션에 의해 증착된 비정질 다이아몬드 박막의 결합및 물리적 특성)

  • Park, Hwan-Tae;Hong, Young-Kyu;Kim, Jae-Ki;Kim, Jin-Seung;Park, Chan
    • Journal of the Korean Vacuum Society
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    • v.5 no.1
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    • pp.1-5
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    • 1996
  • Noncrystalline films of diamond-like carbon (DLC) have been prepared by laser ablation technique at room temperature. A Q-switched Nd-YAG laser beam with wavelength of 1064 nm and pulse duration of 10 ns was focused onto a graphite target with power densities of about $10^9 W/\textrm{cm}^2$. The physical properties of the resulting films were analyzed with density, hardness, and resistivity measurements. The surface and bonding structure were investigated by atomic force microscopy (AFM), Raman spectroscopy, electron energy loss spectroscopy (EELS).

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A Study on the Bonding Residual Thermal Stress Analysis of Dissimilar Materials Using Boundary Element Method (경계요소법에 의한 이종재료 접합 잔류열응력의 해석)

  • Yi, Won;Yu, Yeong-Chul;Jeong, Eui-Seob;Yun, In-Sik
    • Journal of the Korean Society for Nondestructive Testing
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    • v.15 no.4
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    • pp.540-548
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    • 1996
  • In general residual stress is measured by X-ray diffraction method but in case of bonding residual thermal stress it is inadequate technique to examine the stress singularity. Therefore Two-dimensional elastic boundary element analyses were carried out to investigate the residual thermal stress and stress singularity of bonding interface in Al/Epoxy. This boundary element results were compared with the strain gauge measurements. The effects of different interface models, sub-element and adherend thickness are presented and discussed. On the basis of the obtained results, interface delamination causing by normal stress is expected and stress singularity is observed more intensively increasing with adherend thickness. It is concluded that the bonding strength of Al/Epoxy interface can be estimated correctly by taking into account the stress singularity at the edge of the interface.

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A STUDY FOR THE BONDING STRENGTH OF COMPOSITE RESIN CORE TO GLASS FIBER POST (Glass Fiber Post와 Composite Resin Core의 전단결합강도)

  • Kim Tae-Hyoung;Shim June-Sung;Lee Keun-Woo
    • The Journal of Korean Academy of Prosthodontics
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    • v.43 no.4
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    • pp.415-425
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    • 2005
  • Statement of problem : Fracture of composite resin core will be occulted by progress of crack. Bonding interface of different materials has large possibility of starting point of crack line. Therefore, the bond strength of glass fiber post to composite resin core is important for prevention of fracture. Purpose: This in vitro study tried to find out how to get the higher strength of glass fiber post to composite resin core through surveying the maximum load that fractures the post and cote complex. Materials and methods: 40 specimens made with glass fiber Posts(Style $post^{(R)}$, Metalor, Swiss) and composite resin core ($Z-100^{(R)}$, 3M, USA) were prepared and loaded to failure with push-out type shear-bond strength test in a universal test machine. The maximum fracture load and fracture mode were investigated in the specimens that were restored with four different surface treatments. With the data. ANOVA test was used to validate the significance between the test groups, and Bonferroni method was used to check if there is any significant statistical difference between each test group. Evely analysis was approved with 95% reliance. Results: On measuring the maximum fracture load of specimens, both the treatments of sandblasted and acid-etched one statistically showed the strength increase rather than the control group (p<0.005). The scanning electric microscope revealed that sand blasting made more micro-retention form not only on the resin matrix but on the glass fiber, and acid-etching contributed to increase in surface retention form, eliminated the inorganic particles in resin matrix. Specimen fracture modes investigation represented that sand blasted groups showed lower bonding failure than no-sand blasted groups. Conclusion: Referring to the values of maximum fracture load of specimens, the bonding strength was increased by sand blasting and acid-etching.

Effect of Ion-beam Pre-treatment on the Interfacial Adhesion of Sputter-deposited Cu film on FR-4 Substrate (이온빔 전처리가 스퍼터 증착된 Cu 박막과 FR-4 기판 사이의 계면접착력에 미치는 영향)

  • Min, Kyoung-Jin;Park, Sung-Cheol;Lee, Ki-Wook;Kim, Jae-Dong;Kim, Do-Geun;Lee, Gun-Hwan;Park, Young-Bae
    • Korean Journal of Metals and Materials
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    • v.47 no.1
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    • pp.26-31
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    • 2009
  • The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

The effects of total-etch, wet-bonding, and light-curing of adhesive on the apical seal of a resin-based root canal filling system (접착제의 접착변수가 레진계 근관충전제의 근단밀폐효과에 미치는 영향)

  • Ryu, Won-Il;Shon, Won-Jun;Baek, Seung-Ho;Lee, In-Han;Cho, Byeong-Hoon
    • Restorative Dentistry and Endodontics
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    • v.36 no.5
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    • pp.385-396
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    • 2011
  • Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

An Experimental Study on the Fracture and Shear Bonding Strength of Resin-modified Glass lonomer Cements (Resin-modified glass ionomer cements의 파절 및 저단결합강도에 관한 실험적 연구)

  • Kim, Jae-Gon;Yang, Cheol-Hee;An, Soo-Hyeon;Rho, Yong-Kwan;Baik, Byeong-Ju
    • Journal of the korean academy of Pediatric Dentistry
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    • v.25 no.1
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    • pp.234-248
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    • 1998
  • The purpose of this study was to compare the fracture and shear bonding strength of resin-modified glass ionomer cements with composite resin and conventional glass ionomer cement Three kinds of restorative materials including a composite resin (Z 100), a conventional glass ionomer cement(Fuji II), and resin- modified glass ionomer cements(Fuji II LC, Vitremer, Dyract and Compoglass) were investigated in this study. For measurement of fracture and shear bonding strength, disk samples of the materials were prepared and cylindrical samples of the materials were bonded the flat enamel and dentin surfaces according to manufactuer's instructions. All specimen were determinated by using an Instron testing machine with a crosshead speed of 1 mm/min. Then, each treated enamel and dentin surface was observed by SEM. The following results were obtained. 1. The bi-axial flexural strength of Z 100 was highest, and Fuji n LC, Vitremer, Dyract and Compoglass were significantly higher than Fuji n (P<0.05). 2. The shear bonding strength of Z 100 on the enamel and dentin surface was higher than other experimental groups except Fuji II LC(P<0.05). Fuji II LC was significantly higher than Fuji II (P<0.05), but in the case of Vitremer, Dyract and Compoglass were similar to Fuji II (P>0.05). 3. The shear bonding strength of Z 100 and Fuji II LC on the enamel surface were highly increased as compared with dentin surface (P<0.05), but in the case of Fuji II, Vitremer, Dyract and Compoglass were not different between enamel and dentin(P>0.05). 4. In the Z 100 and Fuji II LC, obvious etched enamel surface and exposed dentinal tubules according to remove of smear layer and smear plug were observed.

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