• 제목/요약/키워드: school bonding

검색결과 893건 처리시간 0.027초

Campers' Place Bonding: a Case Study in Worak-san National Park

  • Shin, Won Sop;Kim, Bum Soo
    • 한국산림과학회지
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    • 제94권2호통권159호
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    • pp.90-95
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    • 2005
  • Place bonding, defined as the extent to which a person values or identifies with a particular environment, has focused as a research topic recently. This paper investigates the dimensions of place bonding for Worak-san National Park campers to enhance managers' ability to address deeper landscape meanings. Worak-san National Park campers (n=416) were surveyed during summer and fall of 2004 to collect the data. Confirmatory factor analysis of the data demonstrated that place bonding was composed of four dimensions such as place identity, familiarity, place dependence and place belongingness. The results of this study can provide valuation information for developing management actions to enhance park visitors' quality of recreational experiences.

MEMS 패키징 및 접합 기술의 최근 기술 동향 (Recent Trends of MEMS Packaging and Bonding Technology)

  • 좌성훈;고병호;이행수
    • 마이크로전자및패키징학회지
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    • 제24권4호
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    • pp.9-17
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    • 2017
  • In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

폴리머를 이용한 CIS(CMOS Image Sensor) 디바이스용 웨이퍼 레벨 접합의 warpage와 신뢰성 (A Reliability and warpage of wafer level bonding for CIS device using polymer)

  • 박재현;구영모;김은경;김구성
    • 마이크로전자및패키징학회지
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    • 제16권1호
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    • pp.27-31
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    • 2009
  • 본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

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레진접착제를 도포한 상아질에 대한 합착용 시멘트의 전단결합강도 (SHEAR BOND STRENGTH OF LUTING CEMENTS TO DENTIN TREATED WITH RESIN BONDING AGENTS)

  • 김교철;최부병
    • 대한치과보철학회지
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    • 제36권1호
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    • pp.26-49
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    • 1998
  • The purpose of this study was to confirm the formation of hybrid layer and resin tags in dentin tissue and the possibility of bonding between luting cements used for the prosthesis and the resinous surface coated with resin bonding agents to prevent the dentin hypersensitivity after abutment preparation. Some resin bonding agents, which may have the possibility of bonding with polyacrylic acid as a liquid ingredient of polycarboxylate and glass ionomer cements, were selected. All-Blond desensitizer containing NTG-GMA and BPDM, Scotch-Bond Multipurpose plus containing HEMA, and XR-bond containing organophosphate were selected as a coating agent. Dental cements were zinc phosphate, polycarboxylate, and glass ionomer cement. After the exposed dentin surface of premolars was ethced with 10% phosphoric acid and coated with resin bonding agents, the morphology of treated surfaces and the resin tags and hybrid layers on sectioned surfaces were observed by SEM. Shear bond strength between the resin bonding agents and 3 kinds of cements was measured 24 hours after bonding. On the debonded surfaces of the shear bond strength tested specimens, the cement tags and the bonding sites between the resin materials and cements were examined by SEM. Following conclusions were drawn : 1. Coating of dentin with resin bonding agents had no effect on the shear bond strength of zinc phosphate cement. 2. Both of polycarboxylate and glass ionomer cements showed the increased shear bond strength by the dentinal coating with Scotch-Bond Multipurpose plus containing HEMA. However, in the case of dentinal coating with some agents containing NTG-GMA and BPDM or organophosphate, polycarboxylate cement exhibited the lowered shear bond strength, and glass ionomer cement showed the unchanged shear bond strength. 3. Complete obstructions of dentinal tubules were observed on the dentin coated with All-Bond desensitizer or XR-bond, but distinct shape of the orifices of dentinal tubules was observed consistently on the dentin coated with Scotch-Bond Multipurpose plus. 4. The hybrid layer was thickest on the dentin coated with All-Bond desensitizer, and the length of resin tags was longest on the dentin coated with Scotch-Bond Multipurpose plus. 3. On the debonded specimens which had been bonded with polycarboxylate cement or glass ionomer cement after coating with Scotch-Bond Multipurpose plus, the cement tags and the bonding sites between the resinous surface and the cements could be examined.

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치면열구전색제의 산부식 시간과 접착제 유무에 따른 미세인장결합강도 평가 (Evaluation of Microtensile Bond Strength of Sealant Depending on the Duration of Etching and the Use of Bonding Agent)

  • 심서윤;송호준;양선미;김재환;김선미;최남기
    • 대한소아치과학회지
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    • 제45권3호
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    • pp.299-306
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    • 2018
  • 본 연구의 목적은 산부식 시간과 접착제 적용에 따른 유구치 치면열구전색제의 미세인장 결합강도를 평가하여 비교하는 것이다. 40개의 발거된 건전한 하악 유구치를 선정하여 산부식을 시행하지 않은 군과 산부식을 각각 15, 30, 60초 시행한 군으로 분류하였다. 이를 다시 접착제를 적용하지 않은 군과 적용한 군으로 나누었다. 각 군의 치아에 치면열구 전색제를 도포하여 시편을 제작한 후 미세인장 결합강도를 측정하였다. 산부식을 시행한 15, 30, 60초에 따라 미세인장 결합강도는 유의한 차이가 없었다. 전색제를 적용하기 전에 접착제를 적용한 경우가 산부식만 시행한 경우보다 더 높은 결합강도를 보였으며(p < 0.05), 산부식 시간에 따른 유의한 차이는 없었다. 결론적으로, 유구치의 교합면 법랑질에서 산부식 시간이 15초 이상이면 전색제의 미세인장 결합강도는 유의하게 증가하지 않았으며, 치면열구전색제 도포 전에 접착제를 적용하는 것은 결합강도를 증가시켰다.

Penetration Mechanisms of Ceramic Composite Armor Made of Alumina/GFRP

  • Jung, Woo-Kyun;Lee, Hee-Sub;Jung, Jae-Won;Ahn, Sung-Hoon;Lee, Woo-Il;Kim, Hee-Jae;Kwon, Jeong-Won
    • International Journal of Precision Engineering and Manufacturing
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    • 제8권4호
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    • pp.38-44
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    • 2007
  • Combat vehicles are frequently maneuvered in battlefields when the lives of combatants are being threatened. These vehicles are important elements that influence the consequences of a battle. Their armor must be lightweight and provide excellent protection to ensure successful operations. Ceramic composite armor has recently been developed by many countries to fulfill these requirements. We reviewed previous research to determine an effective armor design, and then fabricated a composite armor structure using $Al_2O_3$ and glass fiber-reinforced polymer. Specimens were manufactured under controlled conditions using different backing plate thicknesses and bonding methods for the ceramic layer and the backing plate. The penetration of an armor-piercing bullet was evaluated from ballistic protection tests. The bonding method between the ceramic layer and the fiber-reinforced polymer influenced the ballistic protection performance. A bonding layer using rubber provided the best protection.

$Carisolv^{TM}$ 에 의한 우식제거후 Microtensile Bonding Strength에 관한 연구 (AN EXPERIMENTAL STUDY ON THE MICROTENSILE BONDING STRENGTH OF DENTIN TREATED BY $CARISOLV^{TM}$)

  • 백병주;권병우;김재곤;전철완
    • 대한소아치과학회지
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    • 제29권3호
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    • pp.389-396
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    • 2002
  • 이 연구의 목적은 전형적인 우식제거(bur)와 기계화학적으로 제거된 상아질($Carisolv^{TM}$)의 microtensile bonding strength를 비교하는 것이다. 다음과 같은 결합 system이 사용되었다; AB: All Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 교합면 우식증을 가지고 있는 42개의 사람 대구치를 6개 그룹으로 나누었다. 각각의 그룹은 다음과 같이 나누었다; $Carisolv^{TM}$를 적용한 그룹 A, B, C와 bur를 사용한 그룹 D, E, F, A와 D 그룹에서는 AB가 상아질 결합제로 사용하였고, 그룹 B, E는 PB를 그룹 C, F는 AQ를 사용하였다. 그 후 와동은 복합레진(Z-100)으로 충전하였다. 각각의 시편을 0.7 mm 두께로 자르고 0.7 mm의 넓이로 다시 잘랐다. Microtensile bonding strength test는 $0.5\;mm/min^{-1}$의 crosshead에서 시행하여 파절면을 scanning electron microscope(JSM-6400, Jeol, Japan)로 관찰하여 다음과 같은 결과를 얻었다. 1. $Carisolv^{TM}$로 우식을 제거했을 때 Microtensile bonding strength는 bur를 사용한 것에 비해서 75.8-80%로 감소하였다(p<0.05). 2. $Carisolv^{TM}$로 우식을 제거했을 때 Microtensile bonding strength가 감소된 정도는 상아질 결합제의 종류에 따라 각 군별로 차이가 없었다(p<0.05). 3. $Carisolv^{TM}$로 우식을 제거했을 때 All bonds는 32.6 MPa, Prime & bond는 30.1 Mpa, AQ bond는 21.2 Mpa이었다. 4. Bur와 $Carisolv^{TM}$로 우식제거시 AQ bond는 All bond와 Prime & bond 2.1보다 유의하게 낮은 결합강도를 가졌다(p<0.01).

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HF 전처리시 Si기판 직접접합의 초기접합에 관한 연구 (A study on pre-bonding of Si wafer direct bonding at HF pre-treatment)

  • 정귀상;강경두
    • 센서학회지
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    • 제9권2호
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    • pp.134-140
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    • 2000
  • Si기판 직접접합기술은 전자소자 및 MEMS에의 응용에 있어 대단히 매력적인 기술이다. 본 논문에서는 Si기판 직접접합에 있어서 HF 전처리 조건에 따른 초기접합에 관하여 서술한다. 접합된 시료들의 특성은 HF 농도, 인가하중과 같이 각각의 접합조건하에서 분석하였으며, 접합력은 인장강도측정법에 의해 평가하였다. 계면상의 결합성분과 표면의 거칠기는 FT-IR과 AFM을 사용하여 평가하였다. HF 전처리 후 Si기판 표면상의 Si-F결합은 DI water에 세정하는 동안 Si-OH로 재배열되며, 결과적으로 hydrophobic 기판은 Si-OH$\cdots$(HOH$\cdots$HOH$\cdots$HOH)$\cdots$OH-S의 수소결합되어 hydrophilic화된다. 초기접합력은 초기접합전의 HF 전처리 조건에 의존한다. (최소 : $2.4kgf/cm^2{\sim}$최대 : $14.9kgf/cm^2$)

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Shear bond strength of composite resin to high performance polymer PEKK according to surface treatments and bonding materials

  • Lee, Ki-Sun;Shin, Myoung-Sik;Lee, Jeong-Yol;Ryu, Jae-Jun;Shin, Sang-Wan
    • The Journal of Advanced Prosthodontics
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    • 제9권5호
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    • pp.350-357
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    • 2017
  • PURPOSE. The object of the present study was to evaluate the shear bonding strength of composite to PEKK by applying several methods of surface treatment associated with various bonding materials. MATERIALS AND METHODS. One hundred and fifty PEKK specimens were assigned randomly to fifteen groups (n = 10) with the combination of three different surface treatments (95% sulfuric acid etching, airborne abrasion with $50{\mu}m$ alumina, and airborne abrasion with $110{\mu}m$ silica-coating alumina) and five different bonding materials (Luxatemp Glaze & Bond, Visio.link, All-Bond Universal, Single Bond Universal, and Monobond Plus with Heliobond). After surface treatment, surface roughness and contact angles were examined. Topography modifications after surface treatment were assessed with scanning electron microscopy. Resin composite was mounted on each specimen and then subjected to shear bond strength (SBS) test. SBS data were analyzed statistically using two-way ANOVA, and post-hoc Tukey's test (P<.05). RESULTS. Regardless of bonding materials, mechanical surface treatment groups yielded significantly higher shear bonding strength values than chemical surface treatment groups. Unlike other adhesives, MDP and silane containing self-etching universal adhesive (Single Bond Universal) showed an effective shear bonding strength regardless of surface treatment method. CONCLUSION. Mechanical surface treatment behaves better in terms of PEKK bonding. In addition, self-etching universal adhesive (Single Bond Universal) can be an alternative bonding material to PEKK irrespective of surface treatment method.

Effect of metal conditioner on bonding of porcelain to cobalt-chromium alloy

  • Minesaki, Yoshito;Murahara, Sadaaki;Kajihara, Yutaro;Takenouchi, Yoshihisa;Tanaka, Takuo;Suzuki, Shiro;Minami, Hiroyuki
    • The Journal of Advanced Prosthodontics
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    • 제8권1호
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    • pp.1-8
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    • 2016
  • PURPOSE. The purpose of this study was to evaluate the efficacy of two different metal conditioners for non-precious metal alloys for the bonding of porcelain to a cobalt-chromium (Co-Cr) alloy. MATERIALS AND METHODS. Disk-shaped specimens ($2.5{\times}10.0mm$) were cast with Co-Cr alloy and used as adherend materials. The bonding surfaces were polished with a 600-grid silicon carbide paper and airborne-particle abraded using $110{\mu}m$ alumina particles. Bonding specimens were fabricated by applying and firing either of the metal conditioners on the airborne-particle abraded surface, followed by firing porcelain into 5 mm in diameter and 3 mm in height. Specimens without metal conditioner were also fabricated. Shear bond strength for each group (n=8) were measured and compared (${\alpha}=.05$). Sectional view of bonding interface was observed by SEM. EDS analysis was performed to determine the chemical elements of metal conditioners and to determine the failure modes after shear test. RESULTS. There were significant differences among three groups, and two metal conditioner-applied groups showed significantly higher values compared to the non-metal conditioner group. The SEM observation of the sectional view at bonding interface revealed loose contact at porcelain-alloy surface for non-metal conditioner group, however, close contact at both alloy-metal conditioner and metal conditioner-porcelain interfaces for both metal conditioner-applied groups. All the specimens showed mixed failures. EDS analysis showed that one metal conditioner was Si-based material, and another was Ti-based material. Si-based metal conditioner showed higher bond strengths compared to the Ti-based metal conditioner, but exhibited more porous failure surface failure. CONCLUSION. Based on the results of this study, it can be stated that the application of metal conditioner is recommended for the bonding of porcelain to cobalt-chromium alloys.