• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.7
• /
• pp.662-666
• /
• 2005

Silicon nitride $(SiN_x)$ film is a promising material for anti-reflection coating and passivation of multicrystalline silicon (me-Si) solar cells. In this work, a plasma-enhanced chemical vapor deposition (PECVD) system with batch-type reactor tube was used to prepare highly robust $SiN_x$ films for screen-printed mc-Si solar cells. The Gas flow ratio, $R=[SiH_4]/[NH_3]$, in a mixture of silane and ammonia was varied in the range of 0.0910.235 while maintaining the total flow rate of the process gases to 4,200 sccm. The refractive index of the $SiN_x$ film deposited with a gas flow ratio of 0.091 was measured to be 2.03 and increased to 2.37 as the gas flow ratio increased to 0.235. The highest efficiency of the cell was $14.99\%$ when the flow rate of $SiH_4$ was 350 sccm (R=0.091). Generally, we observed that the efficiency of the mc-Si solar cell decreased with increasing R. From the analysis of the reflectance and the quantum efficiency of the cell, the decrease in the efficiency was shown to originate mainly from an increase in the surface reflectance for a high flow rate of $SiH_4$ during the deposition of $SiN_x$ films.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.47-47
• /
• 1999

2.45 GHz 마이크로웨이브를 이용하는 electron cyclotron resonance plasma enhanced chemical vapor deposition(ECR-PECVD)방법으로 다이아몬드성 탄소박막(diamond-like carbon, DLC)을 증착하였다. DLC 박막의 산업 응용을 위해서는 높은 경도와 밀착력이 필요하다. 그래서 본 실험에서는 DLC 박막의 산업 응용을 위하여 ECR-PECVD 방법으로 증착된 DLC 박막의 분석결과로부터 DLC 박막의 물성과 증착조건의 관계를 조사하였다. 기판으로는 실리콘 웨이퍼와 실험용 SUS 판을 사용하였다. 아르곤 가스를 주입하여 ECR 마이크로 웨이브 플라즈마와 negative DC bias로 기판을 플라즈마 세척한 후, 수소와 메탄가스를 반응기체로 하여 DLC 박막을 증착하였다. 박막 증착시에 13.56MHz RF 전원 공급장치로 기판에 전원을 공급하였다. DLC 박막 증착의 변수는 반응기체의 호합율, 마이크로웨이브 파워, 프로세스 압력 및 RF 전원공급장치에서 유도되는 negative self DC bias 등이다. 이때 사용된 반응기체의 혼합율(메탄/수소)은 10~50%이고, 수소 가스 흐름율은 100sccm, 메탄은 10~50sccm이다. 마이크로웨이브의 크기는 360~900W, negative self DC bias는 -500~-10 V였다. 그리고 본 실험에서는 높은 증착율을 고려하여 프로세스 압력을 10~30mTorr까지 조절하였다. ER-PECVD 방법으로 증착된 DLC 박막은 SEM으로 단면, $\alpha$-Step으로 두께, Raman 분광계로 탄소 결합구조, FTIR 분광계로 탄소와 수소 결합구조, Micro-Hardness로 경도 그리고 Scratch Tester로 밀착력 등을 분석하였다.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.3
• /
• pp.164-169
• /
• 2014

We investigated the etching characteristics of $HfAlO_3$ thin films in $O_2/Cl_2/Ar$ and $O_2/BCl_3/Ar$ gas, using a high-density plasma (HDP) system. The etch rates of the $HfAlO_3$ thin film obtained were 30.1 nm/min and 36 nm/min in the $O_2/Cl_2/Ar$ (3:4:16 sccm) and $O_2/BCl_3/Ar$ (3:4:16 sccm) gas mixtures, respectively. At the same time, the etch rate was measured as a function of the etching parameter, namely as the process pressure. The chemical states on the surface of the etched $HfAlO_3$ thin films were investigated by X-ray photoelectron spectroscopy. Auger electron spectroscopy was used for elemental analysis on the surface of the etched $HfAlO_3$ thin films. These surface analyses confirm that the surface of the etched $HfAlO_3$ thin film is formed with nonvolatile by-product. Also, Cl-O can protect the sidewall due to additional $O_2$.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.10 no.3
• /
• pp.473-478
• /
• 2006

High quality indium tin oxide (ITO) thin films have been prepared by DC magnetron sputtering technique. By controlling the deposition parameters such as substrate temperature and oxygen flow rate, we were able to minimize the negative ion damage during the deposition. Films pr데ared under such conditions were found to posses an excel]ent electrical resistivity of $1.6\times10^{-4}{\Omega}cm$ and also found to have a optical transmission above 90%. We also observe that, increasing the oxygen now rate above 4 sccm leads to an increase in electrical resistivity of the films while the transmission was found to saturate with the increase in the oxygen gas flow.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.378.1-378.1
• /
• 2014

In this study, we investigated that the resistance switching characteristics of Nb-doped HfO2 films with increasing Nb doping concentration. The Nb-doped HfO2 based ReRAM devices with a TiN/Nb-doped HfO2/Pt/Ti/SiO2 were fabricated on Si substrates. The Nb-doped HfO2 films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16sccm, O2: 24sccm). Microstructure of Nb-doped HfO2 films and atomic concentration were investigated by XRD, TEM, and XPS, respectively. The Nb-doped HfO2 films showed set/reset resistance switching behavior at various Nb doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased in doped HfO2 films. However, the switching properties of Nb-doped HfO2 were changed above the specific doping concentration of Nb. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen and micro-structure of Nb-doped HfO2.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.282.2-282.2
• /
• 2014

Cr의 함량과 주입 가스의 유량 비율을 변화하여 ZnCrO 박막의 구조적 특성에 미치는 영향과 그것이 자기적 특성에 관여하는 상관관계 등에 관하여 조사하였다. ZnCrO 박막을 Pt/Ti/Al2O3 기판 위에 Sputter법으로 증착하였으며, 이 때 양질의 ZnCrO 박막을 제작하기 위하여 산소 분압 변화에 따른 박막의 표면 및 구조적 특성을 관찰하였다. 아르곤과 산소 분압이 1 : 1 (Ar : O2=15 sccm : 15 sccm) 이었을 경우, 가장 매끄러운 표면을 갖고 또한 구조적으로도 안정된 ZnCrO 박막을 얻을 수 있었다. 동일한 조건에서 Cr 함량을 변화시켜 본 결과, Cr 함량이 작아질수록 자기적 특성이 향상되는 것이 관측되었다. 즉, Cr의 함량이 감소할수록 Cr 입자 1개 당 유효 자화도가 증가하는 것이 관측되었는데, 이러한 결과는 Cr 함량 변화에 따는 ZnCrO 박막의 결정 자기이방성 변화에 따른 것이다.

• Korean Journal of Materials Research
• /
• v.9 no.5
• /
• pp.533-537
• /
• 1999

ATO(Sb doped $SnO_2$) thin films whose thicknesses were 600, 1100 and $2100\AA$ were prepared by DC magnetron sputtering method. They showed the lowest resistivity at DC sputtering power 0.24kW and had lower resistivity with increasing thickness. The power dependence of resistivity among ATO thin films was also different with thickness. The increase of carrier concentration in ATO thin films was responsible for the decrease of resistivity with thickness increase. ATO thin films which were prepared at 30sccm oxygen flow rate showed a great change of sheet resistance under 1M HCl solution. The investigation of SAM(Scanning Auger Microprobe) revealed that oxygen atomic percentage on the surface of ATO thin films was changed. The decrease of sheet resistance also occurred when ATO thin films, prepared at 30sccm oxygen flow rate, were exposed to air for a long period of time. For this reason, it was considered that the desorption of oxygen on ATO surface was accelerated by HCl.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.658-661
• /
• 2002

Chemical species during growth of carbon nanotubes (CNTs) in direct current-plasma enhanced chemical vapor deposition were studied in details using $C_3H_4-NH_3$ and $CO-NH_3$ mixtures through optical emission spectroscopy (OES). In the $C_3H_4-NH_3$ system, the relative intensities of CN (388.3 nm) and CH (431.4 nm) decreased and that of $C_2$ (436 nm) increased, leading to $sp^2$-graphization into the CNT structure, leading to improvement of field emission property of CNTs. In the $CO-NH_3$ system, the trend is completely reversed. Attributing to the atomic oxygen for helping the graphitization of carbon, CNTs could be grown under the flow rate of CO (180 sccm)-$NH_3$ (10 sccm). Through these results, we suggest the growth mechanism in our system.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.63 no.11
• /
• pp.1533-1537
• /
• 2014

$WO_3/Ag/WO_3$ multilayer was researched by using RF magnetron sputtering with transparent electrode. Process gas flow ratio with $Ar/O_2$ were selected the optimum conditions at 70sccm/2sccm and $WO_3$ thin film at its conditions was appeared at transmittance about 80% in the visible light region to the average. $WO_3/Ag/WO_3$ multilayer thin films were fabricated from the same process condition which was the same gas flow ratio of Ar and $O_2$ $WO_3/Ag/WO_3$ thin films were appeared transmittance about 93% and sheet resistance about $6.41{\Omega}/{\square}$. From the SEM images, each thin films were appeared when $WO_3$ is 40nm and $O_2$ is 10nm.

• Journal of Sensor Science and Technology
• /
• v.18 no.2
• /
• pp.147-153
• /
• 2009

A thermal flow sensor has been fabricated and characterized, consisting of a center resistive heater surrounded by two upstream and one downstream temperature sensing resistors. The heater and temperature sensing resistors are fabricated from nitrogen-doped(n-type) polycrystalline silicon carbide(poly-SiC) deposited by LPCVD(low pressure chemical vapor deposition) on LPCVD silicon nitride films on a Si substrate. Cavities were etched into the Si substrate from the front side to create suspended silicon nitride membranes carrying the poly-SiC elements. One upstream sensor is located $50{\mu}m$ from the heater and has a sensitivity of $0.73{\Omega}$/sccm with ${\sim}15\;ms$ rise time in a dynamic range of 1000 sccm. N-type poly-SiC has a linear negative temperature coefficient and a TCR(temperature coefficient of resistance) of $-1.24{\times}10^{-3}/^{\circ}C$ from room temperature to $100^{\circ}C$.