• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2010.05a
• /
• pp.277-280
• /
• 2010

Network based on the OSI 7 Layer communication protocol is implemented, and the Internet TCP / IP Layer Based on the vulnerability is discovered and attacked. In this paper, using the programs on the network Layer Scanning conducted by the Layer-by each subsequent vulnerability analysis. Layer by Scanning each vulnerability analysis program to analyze the differences will be studied. Scanning for the studies in the program reflects the characteristics of the Scanning Features of way, and security countermeasures by each Layer is presented. The results of this study was to analyze its vulnerability to hackers and security for defense policy as the data is utilized to enhance the security of the network will contribute.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.42 no.4
• /
• pp.785-790
• /
• 2017

Network scanning tools typically use port scans to steal information from network terminals and identify vulnerabilities. In particular, Shodan and Censys use a network scanning tool to gather a wide range of terminal information, store it in their database and provide it to the users. In order to prevent such information gathering, it is required to know the scanning methods of Shodan and Censys. However, the scanning model used by Shodan and Censys is not known exactly. Therefore, this paper estimates scanning models of Shodan and Censys and analyzes the performance of each models.

• 제어로봇시스템학회:학술대회논문집
• /
• 1988.10a
• /
• pp.338-342
• /
• 1988

Recently, in sequence control systems, high flexibility and maintenance of control software are required. This is because product life cycles become shorter and control specification must be changed frequently. The authors extend the concept of Safe Petri Net to develop the design and analysis tool for sequence control systems taking the safeness and notation of input/output functions into consideration. Extended Safe Petri Net (S-Net) is proposed as such a new graph model and real time scanning algorithm based on S-Net is developed.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.18 no.3
• /
• pp.248-254
• /
• 2009

The worn crater wear geometry of coated tools after machining has been configured by using Confocal Laser Scanning Microscopy(CLSM) and the Wavelet-based filtering technique. The CLSM can be well suited to construct the three-dimensional crater wear on the rake surfaces of coated tips. However, The raw heightness data of HEI(height encoded image) acquired by CLSM must be filtered due to the electronic and imaging noise occurring in constructing the crater image. So the Wavelet-based filtering algorithm is necessary to denoise the shape features in a micro scales so as to realize accurate crater wear topography analysis. The crater wear patterns filtered enable us to predict the crater wear shape in order to study the tool wear evolution. The study shows that the technique by combining the CLSM and Wavelet-based filtering is an excellent one to obtain the geometries of worn tool rake surfaces over a wide range of surface resolution in a micro scale.

• Applied Microscopy
• /
• v.24 no.3
• /
• pp.87-93
• /
• 1994

In order to elucidate the machinability of lead brass, orthogonal machining experiment was conducted in SEM(Scanning Electron Microscope) equipped with a micro-machining device at a cutting speed of $7{\mu}m/s$ for brass containing 0.2 to 3wt% Pb. The microfactors (i.e., shear angle, contact length between chip and tool) were determined by in-situ observations. Machinability of brass containing lead is discussed in terms of the microfactors and the cutting resistant force tested by lathe cutting. The dynamic behavior of the chip formation of lead brass during the machining process was examined: The chips of lead brass form as a shear angle type. The shear angle increases with the content of lead in (6:4) brass. The pronounced effect of lead on the contact length between chip and tool was observed above 1% Pb. The cutting resistant force tested by lathe decreases remarkably with the lead content in brass. The observed microfactors are in close relation to the tested resistant force in macromachining.

• Applied Microscopy
• /
• v.46 no.3
• /
• pp.164-166
• /
• 2016

Electron channeling contrast imaging (ECCI) is a powerful analyzing tool for identifying lattice defects like dislocations and twin boundaries. By using diffraction-based scanning electron microscopy technique, it enables microstructure analysis, which is comparable to that obtained by transmission electron microscopy that is mostly used in defect analysis. In this report, the optimal conditions for investigating crystal defects are suggested. We could obtain the best ECCI images when both acceleration voltage and probe current are high (30 kV and 20 nA). Also, shortening the working distance (6 mm) enhances the quality of defect imaging.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.6
• /
• pp.153-158
• /
• 2007

The present study covers numerical analysis of a thermionic scanning electron microscope(SEM) column. The SEM column contains an electron optical system in which electrons are emitted and moved to form a focused beam, and this generates secondary electrons from the specimen surfaces, eventually making an image. The electron optical system mainly consists of a thermionic electron gun as the beam source, the lens system, the electron control unit, and the vacuum unit. For a systematic design of the electron optical system, the beam trajectories are investigated through numerical analyses by tracing the ray path of the electron beams, and the quality of resulting image is evaluated from the analysis results.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.7
• /
• pp.217-225
• /
• 2000

Scanning Acoustic Microscope (SAM) is used as an important nondestructive test tool in semiconductor reliability evaluation and failure analysis. However, inspections of chip attach adhesive interface fer thin chip has proven difficulty as the reflected signals from the chip top and bottom are superimposed. In this paper, in order to overcome this difficulty, a new signal processing method based on the deconvolution technique combined with the wavelet transform is proposed. The wavelet transform complements a disability of deconvolution technique of which performance largely decreases when the waveform of target signal is not identical to that of reference signal. Performances of the proposed method are demonstrated by through computer simulations using model signal and experiments for the fabricated semiconductor samples, and satisfactory results are obtained.

• Journal of Biomedical Engineering Research
• /
• v.31 no.6
• /
• pp.456-463
• /
• 2010

In the present study, we proposed a new subspace scanning algorithm to enhance the spatial resolution of electroencephalography (EEG) and magnetoencephalography(MEG) source localization. Subspace scanning algorithms, represented by the multiple signal classification (MUSIC) algorithm and the first principal vector (FINE) algorithm, have been widely used to localize asynchronous multiple dipolar sources in human cerebral cortex. The conventional MUSIC algorithm used principal component analysis (PCA) to extract the noise vector subspace, thereby having difficulty in discriminating two or more closely-spaced cortical sources. The FINE algorithm addressed the problem by using only a part of the noise vector subspace, but there was no golden rule to determine the number of noise vectors. In the present work, we estimated a non-orthogonal signal vector set using independent component analysis (ICA) instead of using PCA and performed the source scanning process in the signal vector subspace, not in the noise vector subspace. Realistic 2D and 3D computer simulations, which compared the spatial resolutions of various algorithms under different noise levels, showed that the proposed ICA-MUSIC algorithm has the highest spatial resolution, suggesting that it can be a useful tool for practical EEG/MEG source localization.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1998.10a
• /
• pp.60-65
• /
• 1998

Recently, It is gradually raised necessity that thickness of thin film is measured accuracy and managed in industrial circles and medical world. Ultrasonic Signal processing method is likely to become a very powerful method for NDE method of detection of microdefects and thickness measurement of thin film below the limit of Ultrasonic distance resolution in the opaque materials, provides useful information that cannot be obtained by a conventional measuring system. In the present research, considering a thin film below the limit of Ultrasonic distance resolution sandwiched between three substances as acoustical analysis model, demonstrated the usefulness of ultrasonic Signal processing technique using information of ultrasonic frequency for NDE of measurements of thin film thickness, sound velocity, and step height, regardless of interference phenomenon