• 한국전자현미경학회:학술대회논문집
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• 2004.05a
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• pp.55-56
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• 2004

• 한국전자현미경학회:학술대회논문집
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• 2001.11a
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• pp.18-22
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• 2001

A technique to characterize specific site of materials using a combination of a dedicated focused ion beam system(FIB), and Intermediate-voltage scanning transmission electron microscope(STEM) or transmission electron microscope(TEM) equipped with a scanning electron microscope(SEM) unit has been developed. The FIB system is used for preparation of electron transparent thin samples, while STEM or TEM is used for localization of a specific site to be milled in the FIB system. An FIB-STEM(TEM) compatible sample holder has been developed to facilitate thin sample preparation with high positional accuracy Positional accuracy of $0.1{\mu}m$ or better can be achieved by the technique. In addition, an FIB micro-sampling technique has been developed to extract a small sample directly from a bulk sample in a FIB system These newly developed techniques were applied for the analysis of specific failure in Si devices and also for characterization of a specific precipitate In a metal sample.

• Applied Microscopy
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• v.46 no.2
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• pp.71-75
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• 2016

The scanning electron microscope (SEM) offers two-dimensional (2D) micrographs of three-dimensional (3D) objects due to its inherent operating mechanisms. To overcome this limitation, other devices have been used for quantitative morphological analysis. Many efforts have been made on the applications of software-based approaches to 3D reconstruction and measurements by SEM. Based on the acquisition of two stereo images, a multi-view technique consists of two parts: (i) geometric calibration and (ii) image matching. Quantitative morphological parameters such as height and depth could be nondestructively measured by SEM combined with special software programs. It is also possible to obtain conventional surface parameters such as roughness and volume of biomedical specimens through 3D SEM surface reconstruction. There is growing evidence that conventional 2D SEM without special electron detectors can be transformed to 3D SEM for quantitative measurements in biomedical research.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.153-158
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• 2007

The present study covers numerical analysis of a thermionic scanning electron microscope(SEM) column. The SEM column contains an electron optical system in which electrons are emitted and moved to form a focused beam, and this generates secondary electrons from the specimen surfaces, eventually making an image. The electron optical system mainly consists of a thermionic electron gun as the beam source, the lens system, the electron control unit, and the vacuum unit. For a systematic design of the electron optical system, the beam trajectories are investigated through numerical analyses by tracing the ray path of the electron beams, and the quality of resulting image is evaluated from the analysis results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.522-525
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• 2004

ITO thin films $({\sim}150\;nm)$ are deposited on glass substrates by different deposition condition. The sheet resistance of ITO thin films measured by using a four probe station. The microstructure of these films is determined using a X-ray diffractometer (XRD) and a scanning electron microscope (SEM) and a atomic force microscope (AFM). The sheet resistance of ITO thin films compared $s_{11}$ values by using a near field scanning microwave microscope.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1042-1045
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• 2004

ITO thin films ($\sim150nm$) are deposited on glass substrates by different deposition condition. The sheet resistance of ITO thin films measured by using a four probe station. The microstructure of these films is determined using a X-ray diffractometer (XRD) and a scanning electron microscope (SEM) and a atomic force microscope (AEM). The sheet resistance of ITO thin films compared $s_11$ values by using a near field scanning microwave microscope.

• Nuclear Engineering and Technology
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• v.44 no.5
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• pp.491-500
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• 2012

The dissimilar metal joints welded between Ni-based alloy, Alloy 690 and low alloy steel, A533 Gr. B with Alloy 152 filler metal were characterized by using optical microscope, scanning electron microscope, transmission electron microscope, secondary ion mass spectrometry and 3-dimensional atom probe tomography. It was found that in the weld root region, the weld was divided into several regions including unmixed zone in Ni-base alloy, fusion boundary, and heat-affected zone in the low alloy steel. The result of nanostructural and nanochemical analyses in this study showed the non-homogeneous distribution of elements with higher Fe but lower Mn, Ni and Cr in A533 Gr. B compared with Alloy 152, and the precipitation of carbides near the fusion boundary.

• Journal of the Korean Chemical Society
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• v.55 no.6
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• pp.1074-1077
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• 2011

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.12 s.255
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• pp.1557-1563
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• 2006

A scanning electron microscope (SEM) is well known as a measurement and analysis equipment in nano technology, being widely used as a crucial one in measuring objects or analyzing chemical components. It is equipped with an electron optical system that consists of an electron beam source, electromagnetic lenses, and a detector. The present work concerns numerical analysis for the electron optical system so as to facilitate design of each component. Through the numerical analysis, we investigate trajectories of electron beams emitted from a nano-scale field emission tip, and compare the result with that of experimental observations. Effects of various components such as electromagnetic lenses and an aperture are also discussed.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1282-1287
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• 2007

The nature of the signal collected by an SEM(Scanning Electron Microscope) in order to form images are all dependent on the detector used to collect them, and the quality of an acquired images is strongly influenced by detector performance. Therefore, the development of detector with high performance is very important for improving on the resolution of SEM. This paper presents the manufacture of secondary electron detector and the optimal position of electron detector through numerical analysis in SEM.