• Journal of the Korean Society for Precision Engineering
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• v.12 no.4
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• pp.78-87
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• 1995

Specular reflection appears with metals, plastics, glasses and many other solid objects which are required to be inspected, assembled, moved, or processed automatically. Recongnizing such shiny objects with specular reflections is a hard problem for computer vision, since specular reflections appear, disappear, or change their shapes abruptly, due to tiny movements of the view. Traditionally, such specular reflections are discarded as annoying noise for recongnition purposes. In this paper a technique is represented for obtaining shapes of specular objects. The ring illumin- ation system employes a ring source which is positioned on the axis of the camera. The concept of the proposed method is that if specular objects are illuminated by the ring they show their own dis- tinctive specularity features in surface from which we can infer the shape of the object. A series of experiments are performed to evaluate the performance of this system.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.12
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• pp.1115-1121
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• 2015

Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.9
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• pp.708-713
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• 2010

In this research a ring light was developed so that a partial shadowless shooting for the patient's affected area at the medical treatment room and surgical operation room using high luminance light emitting diode (LED) for which attention is being paid as new lighting parts for medical purpose. LED which was applied to the development used high luminance three color LED for full color for which various color materialization and the adjustment of radiation intensity are possible and we can get white light in order to emphasize the delicate expression for generic tone of shooting object, strong highlight, simple shadow and three dimensional effect at the time of close-up shadowless shooting of the affected area. And at the time of design of ring light, the characteristics of LED and the loss of light at the time of penetrating light diffusion PC were considered so that intensity of illumination for over 150 lx can be obtained. The result of measurement of the intensity of illumination of the ring light that was developed revealed that maximum intensity of illumination of 225.7 lx was obtained, while smoke index was measured to be maximum 78 Ra in the case of Red(50%) Green(100%) and Blue LED(60%). We could confirm that response speed was also very fast as 1.72 ms.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.3 s.192
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• pp.16-22
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• 2007

• Solar Energy
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• v.11 no.1
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• pp.3-15
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• 1991

In this study global radiation and global illumination are directly measured and diffuse radiation and diffuse illumination measured utilizing semi-circular shadow ring. By analyzing measured radiation data, clear and overcast sky are classified according to the sky classification method used in Mantes, France. Measured illumination data are analyzed and 1) Clear sky illumination on a horizontal surface as a function of solar altitude. 2) Overcast sky illumination on a horizontal surface as a function of solar altitude, 3) Monthly variation of illumination. 4) Cumulative percentage of illumination, 5) Daylight intensity as a function of hours in a typical day, 6) Average number hours per day of illumination above 10 and 20klx are presented as a climatic data for daylighting design for Seoul, Korea.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.12
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• pp.56-63
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• 2008

In this study, a side inspection system for circular o-ring, bolt, plastic and gasket using 8 side mirrors has been developed. The system is comprised of a CCD camera, an illumination, the first 8 mirrors and the second 8 mirrors, and moreover the image processing algorithm for detecting three different type samples is developed. The effectiveness of this algorithm was experimentally verified with three different type samples, and the inspection process is completed within max 0.2 second by help of smart camera. It is envisaged that this inspection method for side inspection system of a circular will have a wide application in the future industry.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.33B no.11
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• pp.53-61
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• 1996

In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

• Proceedings of the KSME Conference
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• 2001.06b
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• pp.70-75
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• 2001

In this study, we developed a measuring system utilizing machine vision for measuring the precision of positioning of micro stepping motor. The measuring system equipped with CCD Camera, ring illumination and diffuser measures the repeatability and the hysterisis of a micro stepping motor by means of the pointer attached to the motor directly. With the measuring system, it was possible to measure the precision of the micro stepping motor in the resolution of $50{\mu}m$.