• 자원환경지질
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• 제18권3호
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• pp.217-224
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• 1985

Householder변환을 비저항반전 문제에 응용하여 해의 안전성을 조사하였다. 비저항탐사의 데이터를 해석할 때, 정규방정식을 통하여 지하구조모델을 구하는 종래의 비저항반전법은 수치적으로 불안정성을 야기시킬 경우가 간혹 있다. 이에 반하여 관측방정식의 해를 직접 구하는 Householder변환을 이용한 비저항반전법은 종래의 방법보다 수치적으로 더 안정하다. 본 논문에서는 Householder변환을 이용한 비저항반전법이 종래의 방법으로는 안정된 지하구조모델을 구할 수 없을 정도로 잡음이 포함된 이론적인 Schlumberger탐사 데이터의 경우에도 안정된 모델을 구할 수 있음을 보여 주었다.

• 한국지구물리탐사학회:학술대회논문집
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• 한국지구물리탐사학회 2007년도 공동학술대회 논문집
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• pp.245-250
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• 2007

The small loop EM method is a fast and convenient geophysical tool which can give shallow subsurface resistivity distribution. It can be a useful alternative of resistivity method in conductive environment. We applied the multi-frequency small loop EM method for the investigation of a soft ground landfill site which was constructed on a tideland since the resistivity of the survey area is extremely low. 3D resistivity distribution was obtained by merging 1D inversion results and shallow subsurface structure can be interpreted. By comparing the result with the drilling log and measured soil resistivity sampled at 16 drill holes, we can get lot of information such as groundwater level, thickness of landfill, salinity distribution, depth to the basement and etc.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.1105-1107
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• 1999

The purpose of termination for high voltage tests of XLPE power cable is to prevent flashover during the breakdown test of specimen as well as to withstand the specified voltage between its conductor and screen without failure. For easier treatment and simpler construction of testing termination, resistivity grading method using semi-conductive material was employed. Based on the fundamental theory, its failure characteristics by changing the resistivity of semi-conductive material on the insulation surface was investigated. With two layers construction by difference resistivity on their surfaces, much improved result than that of one resistivity was obtained through the experiment for MV cable.

• E2M - 전기 전자와 첨단 소재
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• 제9권7호
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• pp.727-732
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• 1996

In the present paper, the Cu films 4.mu.m thick were deposited by RF magnetron sputtering method on Si wafer. The Cu films deposited at a condition of 100W, 10mtorr exhibited a low electrical resistivity of 2.3.mu..ohm..cm and densed microstructure, poor adhesion. The Cu films grown by 200W, 20mtorr showed a good adhesion property and higher electrical resistivity of 7.mu..ohm..cm because of porous columnar microstructure. Therefore, The Cu films were deposited by double layer deposition method using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adhesion, and reflectance in the CU films [C $U_{4-d}$(low resistivity) / C $U_{d}$(high adhesion) / Si-wafer] on the thickness of d has been investigated. The films formed with this deposition methods had the low electrical resistivity of about 2.6.mu..ohm..cm and high adhesion of about 700g/cm.m.m.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.422-426
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• 2003

Cu thin films of $6000{\AA}$ thickness were deposited by Electron Beam Evaporation(EBE) method on the glass. The resistivity properties and adhesion of Cu thin films were investigated by various annealing and substrate temperature. Cu thin films were annealed in the air and vacuum condition for 10 min after the deposition. The resistivity and adhesion(the force required to separate films from substrates) was measured by 4-point probe and scratch testing. The resistivity of non-annealing Cu thin films was distinguished more substrate temperature loot than substrate temperature R.T, $200^{\circ}C$. In the case of air condition annealing, as heating temperature was increased, the resistivity was decreased. In the case of vacuum condition annealing, the resistivity was increased at heating temperature $200^{\circ}C$. The best resistivity($1.72\;{\mu}{\Omega}{\cdot}cm$) of Cu thin films was obtained by the air condition heating temperature $200^{\circ}C$ at the substrate heating temperature $100^{\circ}C$. As a result of scratch testing, adhesion was increased by annealing. And maximum adhesion had 600 gf.

• 조명전기설비학회논문지
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• 제27권2호
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• pp.95-101
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• 2013

This paper presents the comparison of the earth resistivity obtained from the measurements made with the three-electrode and four-electrode fall-of-potential techniques. The ${\rho}-a$ curve obtained from Wenner four-electrode method in undisturbed earth is in good agreement with the ${\rho}-l$ curve obtained from the three-electrode method based on the fall-of- potential method. However, The ${\rho}-a$ curve in disturbed earth with moisture and freezing is significantly different with the ${\rho}-l$ curve. The ${\rho}-a$ curve is considerably sensitive to the freezing and the moisture present in the earth surface compared to the ${\rho}-l$ curve. Thus to determine the actual earth resistivity, it is necessary to take into account the earth surface conditions when measuring the earth resistivity.

• The Korean Journal of Ceramics
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• 제4권2호
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• pp.122-127
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• 1998

Conductivities of polycrystalline ceria doped with several rare earth oxides were measured by AC admittance and DC four probe method. The conductions were separated into grain and grain boundary contributions using the complex admittance technique as well as grain size dependence of conductivity. The grain size dependence of polycrystalline conductivity, which can be adequately described by the so-called brick layer model, appears to give a more reliable measure of the grain conductivity compared to the complex admittance method. Polycrystalline resistivity(1/conductivity) increases linearly with the reciprocal of grain size. The intercept of resistivity vs. inverse grain size plot gives a measure of the grain resistivity and the slope gives a measure of the grain boundary resistivity. It was also noted that errors involved in the analysis of experimental data may be different between the complex admittance method and the impedance method. A greater resolution of the spectra was found in the complex admittance method, insofar as the present work is concerned, suggesting that the commonly used equivalent circuit may require re-evaluation.

• 전자공학회논문지
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• 제53권4호
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• pp.117-128
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• 2016

대지의 접지 시스템 설치는 안전성과 전기 기기의 올바른 작동을 위해 필수적이며, 대지 파라미터, 특히 토양의 저항률은 대지 접지 시스템 설계에서 결정되어야 한다. 토양의 저항률을 측정하기 위한 가장 흔한 방법은 Wenner의 4전극 방법이 있으며, 이 방법은 1차원의 저항률을 얻기 위하여 가변 전극 간격을 갖는 큰 측정 세트가 요구되어 번거롭고, 시간소모가 많으며 비용이 많이 든다. 전기 저항 단층촬영법은 저비용이며 빠른 측정이 가능하다는 장점 때문에 토양의 저항률 분포를 추정하기 위해 적용될 수 있다. 전기 저항 단층은 관심지역에 놓인 전극에서 얻은 측정데이터를 사용하여 토양 저항률 분포를 특성화한다. 이때 전기 단층 촬영법의 역문제는 비선형성이 강하여 저항률 분포를 추정하기 위하여 Tikhonov 조정 방법을 갖는 반복적 Gauss-Newton 방법을 사용한다. 다양한 시뮬레이션을 수행하여 3차원 토양의 저항률 분포를 추정하는데 전기 저항 단층 촬영법은 유용한 성능을 제공하고 있음을 확인하였다.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2003년도 학술대회논문집
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• pp.373-376
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• 2003

A new method measuring soil resistivity in frequency range of 5-500[KHz] using variable frequency inverter was presented, and soil resistivity was analysed by resistive and reactive components on the basis of magnitude and phase of measured ground impedance. The test lead arrangement was proposed to reduce the inductive coupling in test circuit for measuring the soil resistivity. The frequency dependence of soil resistivity was mainly caused by the inductive current flowing through grounding conductors over the frequency of 70[KHz].

• 지구물리
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• 제2권4호
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• pp.269-276
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• 1999

암석의 코어비저항 값을 올바르게 결정하기 위한 노력의 일환으로 비저항 측정에 있어서 샘플홀더의 영향을 분석하고 시계열자료로부터 암석의 비저항을 대표할 수 있는 비저항 값을 효과적으로 구하는 방안에 관하여 연구하였다. 샘플홀더에 대한 연구로는 기존의 GS식과 2전극식 방법과 함께 코어시료 표면을 전도성 접착제로 처리한 변형 GS식 및 변형 2전극식을 고안하여 각 특성을 비교하였으며 그 중에서 변형 2전극식이 측정자료의 안정성과 측정의 편이성 측면에서 장점이 있는 것으로 확인되었다. 샘플홀더 및 사용 소스 주파수의 차이에 따라 달리 나타나는 시계열자료의 분포특성에 관한 분석 결과는 최대곡률점을 이용하여 암석의 대표비저항을 결정하는 방법이 효과적임을 보이고 있다.