• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.393-394
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• 2008

This paper presents a new method to extract the substrate resistance by fitting current-dependent base resistance of parasitic BJT without a complex RF extraction method. The extracted substrate resistance values using the new method match well with those using the RF one, verifying the accuracy of the proposed DC technique.

• 대한기계학회논문집B
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• 제26권5호
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• pp.716-723
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• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.96-101
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• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• 전기의세계
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• 제23권6호
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• pp.49-55
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• 1974

Amorphous semiconductor from As 30 Te 48 Ge 10 Si 12 was prepared, and studied electron microscopy, X-ray analysis and resistivity measurement. It's resistivity is 1.56*10$^{6}$ .ohm.-cm when small ampule is used for preparing sample it is found that no phase separation has occurced by electron microscopy, and that phase transition temperature is 232.deg. C by differential Thermal Analysis. The specimen showed threshold switching that the low resistance state occur at critical electric field and the resistance recover at low applied field. Critical electric field of the switching is 10$^{5}$ V/cm at room temperature. Threshold voltage secreace exponentially with increasing ambient temperature and at that each voltage resistance of the switching device increase exponentially. According to the series resistance and applied vottage current slope on the V-I curve is varied. When applied voltage is decreased after switching, the resistance of the switching device is increased. By this result the origin of the switching is the Joule's heating.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.152-155
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• 1996

Platinum thin films were deposited on $Al_2$O$_3$substrate by DC magnetron sputtering for RTD(Resistance Thermometer Devices) temperature sensors. We made Pt resistance pattern on $Al_2$O$_3$substrate by lift-off method and fabricated Pt-RTD temperature sensors by using W-wire, silver epoxy and SOG(spin-on-glass). In the temperature range of 25~40$0^{\circ}C$, we investigated TCR(temperature coefficient of resistance) and resistance ratio of Pt-RTD temperature sensors. TCR values were increased with increasing the annealing temperature, time and the thickness of Pt thin films. Resistance values were varied lineally within the range of measurement temperature. At annealing temperature of 100$0^{\circ}C$, annealing time of 240min and thin film thickness of 1${\mu}{\textrm}{m}$, we obtained Pt-RDT TCR value of 3825ppm/$^{\circ}C$ closed to the Pt bulk value.

• 대한기계학회논문집
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• 제18권11호
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• pp.2967-2972
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• 1994

The multiple character of the contact interaction and the collective behavior of elementary microcontacts play a significant role in all the processes occurring in the surface layers, including the failure due to friction and wear. The array of metal spheres compressed between flat plates has been used for simulation of the contact behavior of multiple contact of solids under normal loading. An experimental design has been made providing regular array of the spheres at the same size with different spatial order. Measurement of electrial contact resistance has been made using the equipment providing the adequate accuracy in the range of micro Ohms. The data on electrical contact resistance have been compared with theoretical predictions using the multiple contact model of constriction resistance. The effect of single spots number and array on conductivity of contact has been evaluated.

• 전력전자학회논문지
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• 제24권2호
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• pp.92-98
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• 2019

Accurate estimation of motor parameters is required in some motor control applications. For example, the value of stator resistance is required for stator flux-oriented control mostly used in doubly fed induction generator systems. Stator resistance is not a constant value and continuously changes due to the rise in temperature during motor operation. Estimation errors degrade the control performance. Hence, this study proposes a simple stator resistance estimation method. In this scheme, the differential components of voltage and current values are used to eliminate the dead-time effect, and Kalman filter algorithm is applied to reduce the error according to measurement noise. Simulation and experimental results obtained with a permanent magnet motor show the validity of the proposed algorithm.

• 소성∙가공
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• 제28권2호
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• pp.77-82
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• 2019

Corrosion occurs well on surface of roll formed and Zn alloy subsequently electro-deposited on steel bolt under wet condition. In this study, variations in corrosion resistance were investigated through the measurement of polarization curves on steel bolts which were roll formed and subsequently coated with various types of coating methods. According to the measured polarization curve, Ni-P electroless deposits on roll formed steel increased the resistance to corrosion. The corrosion resistance of Zn alloy powder coated steel bolt was found to be better than that of Zn-Ni electro-deposited sample.

• 조명전기설비학회논문지
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• 제23권12호
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• pp.146-153
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• 2009

최근 대형 건축물들은 접지그리드를 기반으로 한 공통접지방식을 채택하고 있다. 이러한 접지시스템의 성능평가는 접지저항만으로 불충분하므로 접지임피던스의 측정이 요구된다. 대형 접지시스템의 접지임피던스에 대한 측정 방법은 IEEE standard 81.2에 기술되었으나 세부적인 평가방법들은 제시되지 못한 상태이다. 본 논문은 15[m]$\times$15[m] 접지그리드에 대하여 수정된 전위강하법에 기반한 접지임피던스의 정확한 측정방법과 보조전극의 위치에 따른 도전유도 및 전자유도에 의한 측정오차를 기술한다. 그 결과 도전유도에 의한 오차는 보조전극의 거리가 늘어날수록 감소하였다. 전자유도에 의한 오차를 배제하기 위해서 전위측정선은 전류측정선과 90도를 이루어야 한다. 전위측정선과 전류측정선이 예각 또는 둔각을 이루었을 때 전자유도전압은 각각 + 또는 -를 나타내었다. 일반적으로 전자유도에 의한 오차는 예각에 비해서 둔각의 경로가 작게 나타났다.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.