• Proceedings of the IEEK Conference
• /
• 2008.06a
• /
• pp.393-394
• /
• 2008

This paper presents a new method to extract the substrate resistance by fitting current-dependent base resistance of parasitic BJT without a complex RF extraction method. The extracted substrate resistance values using the new method match well with those using the RF one, verifying the accuracy of the proposed DC technique.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.26 no.5
• /
• pp.716-723
• /
• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• Proceedings of the KSME Conference
• /
• 2001.11b
• /
• pp.96-101
• /
• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• 전기의세계
• /
• v.23 no.6
• /
• pp.49-55
• /
• 1974

Amorphous semiconductor from As 30 Te 48 Ge 10 Si 12 was prepared, and studied electron microscopy, X-ray analysis and resistivity measurement. It's resistivity is 1.56*10$^{6}$ .ohm.-cm when small ampule is used for preparing sample it is found that no phase separation has occurced by electron microscopy, and that phase transition temperature is 232.deg. C by differential Thermal Analysis. The specimen showed threshold switching that the low resistance state occur at critical electric field and the resistance recover at low applied field. Critical electric field of the switching is 10$^{5}$ V/cm at room temperature. Threshold voltage secreace exponentially with increasing ambient temperature and at that each voltage resistance of the switching device increase exponentially. According to the series resistance and applied vottage current slope on the V-I curve is varied. When applied voltage is decreased after switching, the resistance of the switching device is increased. By this result the origin of the switching is the Joule's heating.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.11a
• /
• pp.152-155
• /
• 1996

Platinum thin films were deposited on $Al_2$O$_3$substrate by DC magnetron sputtering for RTD(Resistance Thermometer Devices) temperature sensors. We made Pt resistance pattern on $Al_2$O$_3$substrate by lift-off method and fabricated Pt-RTD temperature sensors by using W-wire, silver epoxy and SOG(spin-on-glass). In the temperature range of 25~40$0^{\circ}C$, we investigated TCR(temperature coefficient of resistance) and resistance ratio of Pt-RTD temperature sensors. TCR values were increased with increasing the annealing temperature, time and the thickness of Pt thin films. Resistance values were varied lineally within the range of measurement temperature. At annealing temperature of 100$0^{\circ}C$, annealing time of 240min and thin film thickness of 1${\mu}{\textrm}{m}$, we obtained Pt-RDT TCR value of 3825ppm/$^{\circ}C$ closed to the Pt bulk value.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.11
• /
• pp.2967-2972
• /
• 1994

The multiple character of the contact interaction and the collective behavior of elementary microcontacts play a significant role in all the processes occurring in the surface layers, including the failure due to friction and wear. The array of metal spheres compressed between flat plates has been used for simulation of the contact behavior of multiple contact of solids under normal loading. An experimental design has been made providing regular array of the spheres at the same size with different spatial order. Measurement of electrial contact resistance has been made using the equipment providing the adequate accuracy in the range of micro Ohms. The data on electrical contact resistance have been compared with theoretical predictions using the multiple contact model of constriction resistance. The effect of single spots number and array on conductivity of contact has been evaluated.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.24 no.2
• /
• pp.92-98
• /
• 2019

Accurate estimation of motor parameters is required in some motor control applications. For example, the value of stator resistance is required for stator flux-oriented control mostly used in doubly fed induction generator systems. Stator resistance is not a constant value and continuously changes due to the rise in temperature during motor operation. Estimation errors degrade the control performance. Hence, this study proposes a simple stator resistance estimation method. In this scheme, the differential components of voltage and current values are used to eliminate the dead-time effect, and Kalman filter algorithm is applied to reduce the error according to measurement noise. Simulation and experimental results obtained with a permanent magnet motor show the validity of the proposed algorithm.

• Transactions of Materials Processing
• /
• v.28 no.2
• /
• pp.77-82
• /
• 2019

Corrosion occurs well on surface of roll formed and Zn alloy subsequently electro-deposited on steel bolt under wet condition. In this study, variations in corrosion resistance were investigated through the measurement of polarization curves on steel bolts which were roll formed and subsequently coated with various types of coating methods. According to the measured polarization curve, Ni-P electroless deposits on roll formed steel increased the resistance to corrosion. The corrosion resistance of Zn alloy powder coated steel bolt was found to be better than that of Zn-Ni electro-deposited sample.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.23 no.12
• /
• pp.146-153
• /
• 2009

Recently, the common grounding systems are adapted in most large structures. Since the ground resistance is insufficient to evaluate the performance of grounding systems, it is needed to measure grounding impedance. Even though the methods of measuring grounding impedance of large grounding systems are presented in IEEE standard 81.2, but they have not been described in detail. In this paper, we present the accurate method of measuring grounding impedance based on the revised fall-of-potential method and measurement errors due to earth mutual resistance and ac mutual coupling depending on locating test electrodes at remote earth were examined for the 15[m]$\times$15[m] grounding grid. As a result, the measurement error due to earth mutual resistance is decreased when the distance to auxiliary electrodes increased. To get rid of measurement errors due to mutual coupling, the potential lead should be installed at a right angle to the current lead. When the angle between the potential and the current leads is an acute angle or an obtuse angle, the mutual couple voltage is positive or negative, respectively. Generally, the measurement errors due to mutual coupling with an obtuse angle route are lower than those with an acute angle route.

• Journal of the Semiconductor & Display Technology
• /
• v.21 no.3
• /
• pp.74-79
• /
• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.