• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• v.30 no.1
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• pp.1-6
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• 2017

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has three-dimensional random network, it possesses thermal properties like a typical heat insulator. Recently, there has been increasing interest in controlling the network structure for making new functionality from EP. Indeed, the new modified EP represented as liquid crystalline epoxy (LCE) is spotlighted as an enabling technology for producing novel functionalities, which cannot be obtained from the conventional EPs, by replacing the random network structure to oriented one. In this paper, we review current progress in the field of LCEs and their application for the highly thermal conductive composite materials.

• Steel and Composite Structures
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• v.35 no.3
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• pp.439-447
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• 2020

This paper presents two sets of full three-dimensional thermoelastic finite element analyses of superimposed thermo-mechanically loaded Spar Wingskin Joints made with laminated Graphite Fiber Reinforced Plastic composites. The study emphasizes the influence of residual thermal stresses and material anisotropy on the inter-laminar delamination behavior of the joint structure. The delamination has been pre-embedded at the most likely location, i.e., in resin layer between the top and next ply of the fiber reinforced plastic laminated wingskin and near the spar overlap end. Multi-Point Constraint finite elements have been made use of at the vicinity of the delamination fronts. This helps in simulating the growth of the embedded delamination at both ends. The inter-laminar thermoelastic peel and shear stresses responsible for causing delamination damage due to a combined thermal and a static loading have been evaluated. Strain energy release rate components corresponding to the Mode I (opening), Mode II (sliding) and Mode III (tearing) of delamination are determined using the principle of Virtual Crack Closure Technique. These are seen to be different and non-self-similar at the two fronts of the embedded delamination. Residual stresses developed due to the thermoelastic anisotropy of the laminae are found to strongly influence the delamination onset and propagation characteristics, which have been reflected by the asymmetries in the nature of energy release rate plots and their significant variation along the delamination front.

• Tribology and Lubricants
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• v.33 no.1
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• pp.15-22
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• 2017

Because the running speed of vehicles is increasing and a shorter braking distance is required, high heat-resistant brake pads are needed to satisfy the requirements of customers and car makers. In the near future, hazardous materials such as Cu, Cr, Zn, and Sb will be restricted from use in friction materials. Ceramic composites reinforced by carbon fibers are good candidates for eco-friendly friction materials. In this study, we develop ceramic composite friction materials. The friction materials are composed of carbon fibers, Si, SiC, graphite, and phenol resin and are prepared by hot forming and heat treatment at high temperatures. The density, void ratio, and compressive strength are $1.59-1.66g/cm^3$, 16.6-20, and 70-90 MPa, respectively. Friction and wear tests are performed using a pin-on-plate-type reciprocating friction tester at 25, 100, and $200^{\circ}C$. The counterpart material is a CrMoV steel extracted from a KTX brake disc. Friction coefficient, wear amount, and wear mechanism are measured and examined. We determine that the friction coefficients depend on the temperature and the fluctuation of the friction coefficients is larger at higher temperatures. The amount of wear increases with the surface temperatures of the specimens. The tribological properties of the developed composites are similar to those of a Cu-based sintered friction material. Through this study, it is confirmed that ceramic composite materials can be used as friction materials.

• Restorative Dentistry and Endodontics
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• v.28 no.4
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• pp.348-353
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• 2003

The purpose of present study was to evaluate the polymerization shrinkage stress and amount of linear shrinkage of composites and compomers for posterior restoration. For this purpose, linear polymerization shrinkage and polymerization stress were measured. For linear polymerization shrinklage and polymerization stress measurement, custom made Linometer (R&B, Daejon, Korea) and Stress measuring machine was used (R&B, Daejon, Korea). Compositers and compomers were evaluated: Dyract AP (Dentsply Detrey, Gumbh. German) Z100 (3M Dental Products, St. Paul. USA) Surefil (Dentsply Caulk, Milford, USA) Pyramid (Bisco, Schaumburg, USA) Synergy Compact (Coltene, Altstatten, Switzerland), Heliomolar (Vivadent/Ivoclar, Liechtenstein), and Compoglass (Vivadent Ivoclar/Liechtenstein) were used. 15 measurements were made for each material. Linear polymerization shrinkage or polymerization stress for each material was compared with one way ANOVA with Tukey at 95% levels of confidence. For linear shrinkage: Heliomolar, Surefil

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Composites Research
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• v.33 no.3
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• pp.153-160
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• 2020

In this paper, hexagonal boron nitride (h-BN) particles were added between the sheets of prepreg, and the effect of on many properties of BN-embedded carbon fiber reinforced plastics was investigated. The amount of BN particles which corresponds with 0 to 15 wt% of total resin weight was used as an additive material. The tensile strength and the inter-laminar shear strength of BN-embedded CFRP samples were improved by maximally 13.6%, and 6.7%, respectively. The tendency changes of thermal, electrical conductivities and the morphology of cross-section of CFRPs were also observed. This study suggests the possibility of controlling the characteristics of carbon fiber-BN-epoxy composites to use for aerospace applications.

• Elastomers and Composites
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• v.47 no.4
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• pp.310-317
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• 2012

A jute fiber surface was modified with argon gas in a cylinder type RF plasma generator to enhance the interfacial bond strength and to optimize the plasma treatment condition. The plasma power, gas pressure, and treat time were varied to figure out any effect of those parameters on the morphology and mechanical strength of jute fibers, and the interfacial bond strength for a model composite with polypropylene resin. As the severity of plasma treatment was increased, the surface of jute fibers became rougher. Gas pressure was less effective in roughening of the surface compared with those of treat time and plasma power. Approximately 25% drop in tensile strength of jute fibers was observed for the parameters of treat time and plasma power, while little deterioration was found for gas pressure, with increasing the severity. Based on the interfacial shear strength (IFSS), the optimum plasma treatment condition was determined to be treat time of 30 s, plasma power of 40 W, and gas pressure of 30 mTorr.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1999-2004
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• 2011

This research aims to develop polymer composites which can be used for PEMFC bipolar plate by injection molding process. Considering the moldability and stiffness, we used LCP(Liquid crystal polymer) as base resin. In order to improve electrical conductivity and mechanical properties, we chose carbon black, and both synthetic graphite and expanded graphite. The composites with different recipe are prepared for injection molding of PEMFC bipolar plate and CAE(Computer Aided Engineering) analysis was performed to predict melt flow and fiber orientation We did successfully fabricate the ASTM specimens by injection molding, and measure the electrical conductivity of the samples by using four point probe device. We measured mechanical properties such as flexural strength, flexural modulus and Izod impact strength. Conclusively, the electrical conductivity increased with increasing additive concentration, but both flexural strength and Izod impact strength decreased due to the brittle nature of carbon-based additives.

• Journal of Radiation Industry
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• v.5 no.2
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• pp.137-143
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• 2011

Epoxy resins are widely used as high performance thermosets in many industrial applications, such as coatings, adhesives and composites. Recently, a lot of research has been carried out in order to improve their mechanical properties and thermal stability in various fields. Carbon nanotubes possess high physical and mechanical properties that are considered to be ideal reinforcing materials in composites. CNT-reinforced epoxy system hold the promise of delivering superior composite materials with their high strength, light weight and multi functional features. Therefore, this study used multi-walled carbon nanotubes (MWNT) and gamma rays to improve the mechanical and thermal properties of epoxy. The diglycidyl ether of bisphenol A (DGEBA) as epoxy resins were cured by gamma ray irradiation with well-dispersed MWNTs as a reinforcing agent and triarylsulfonium hexafluoroantimonate (TASHFA) as an initiator. The flexural modulus was measured by UTM (universal testing machine). At this point, the flexural modulus factor exhibits an upper limit at 0.1 wt% MWNT. The thermal properties had improved by increasing the content of MWNT in the result of TGA (thermogravimetric analysis). However, they were decreased with increasing the radiation dose. The change of glass transition temperature by the radiation dose was characterized by DMA (dynamic mechanical analysis).