• 제목/요약/키워드: residual layer

검색결과 659건 처리시간 0.025초

광도만에 있어서 물질수송과정의 수치예측

  • 이인철;류청로
    • 한국해양공학회:학술대회논문집
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    • 한국해양공학회 2000년도 추계학술대회 논문집
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    • pp.159-164
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    • 2000
  • In order to clarify the seasonal variation of residual current and material transportation process in Hiroshima Bay, JAPAN, the real-time simulation of residual current and particle tracking by using Euler-Lagrange model were carried out. The calculated tidal current and water temperature and salinity showed good agreement with the observed ones. The residual currents showed the southward flow pattern at the upper layer, and the northward flow pattern at the lower layer. The flow structure of residual current in Hiroshima Bay is an estuarine circulation affected by density flow and wind driven current. The residual current plays an improtant role of material transportation in th bay.

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Reduction of the residual stresses during the additive manufacturing of a thermo-viscoelastic growing cylinder under non-uniform volumetric heating by electric induction

  • Fekry, Montaser
    • Structural Engineering and Mechanics
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    • 제82권2호
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    • pp.259-270
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    • 2022
  • The paper investigates the residual stresses arising in a thermoviscoelastic cylinder as a result of layer-by-layer deposition of material on its lateral surface. Internal stresses are caused by incompatible deformations that accumulate in the assembly as a result of joining parts with different temperatures. For the analysis of internal stresses, an analytical solution to the axisymmetric quasi-static problem of thermoelasticity for a growing cylinder is constructed. It is shown that the distribution of residual stresses depends on the scenario of the surfacing process. In this case, the supply of additional heat to the growing body can significantly reduce the unevenness of temperature fields and reduce the intensity of residual stresses. The most effective is uneven heating, which can be realized, by the action of an alternating current with a tunable excitation frequency. The temperature and residual stresses fields on the growing surface is analyzed numerically for Titanium and Copper materials.

단속하드터닝에서 잔류응력과 가공변질층의 고찰 (Residual sterss and damaged layer in an intermittent hard turning)

  • 전준용
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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    • pp.270-276
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    • 2000
  • Hard turning has the potential to replace grinding process and to achieve significant reduction in production time and cost. The main applications for hard turning is finishing process, namely grinding process. Therefore, it must be able to satisfy high surface integrity of the workpiece. This paper discusses surface quality in terms of residual stress and damaged layer with respect to cutting parameters in an intermittent hard turning. Damaged layer experiment is carried out orthogonal array. From that is based on the orthogonal array. From the response table, cutting parameters are analyzed from the view point of the damaged layer and residual stress. From this experimental results, even though in the intermittent hard turning, surface integrity turns out be good enough for replacing grinding process.

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초기변형 최소화를 위한 광변조 압전 다층박막 액추에이터의 설계, 제작 및 실험 (Design Fabrication and Test of Piezoelectric Multi-Layer Cantilever Microactuators for Optical Signal Modulation)

  • 김명진;조영호
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제49권9호
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    • pp.495-501
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    • 2000
  • This paper presents a method to minimize the initial deflection of a multi-layer piezoelectric microactuator without loosing its piezoelectric deflection performance required for light modulating micromirror devices. The multi-layer piezoelectric actuator composed of PZT silicon nitride and platinum layers deflects or buckles due to the gradient of residual stress. Based on the structural analysis results and relationship between process conditions and mechanical properties we have modified the fabrication process and the thickness of thin film layers to reduce the initial residual stress deflection without decreasing its piezoelectric deflection performance. The modified designs fabricated by surface-micromachining process achieved the 77% reduction of the initial deflection compared with that of the conventional method based on the measured micromechanical material properties is applicable to the design refinement of multi-layer MEMS devices and micromechanical structures.

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스케일러블 비디오 부호화에서 선택적 계층간 차분 신호 부호화 및 공간적 향상 계층에서의 모드 결정 (Selective Inter-layer Residual Prediction Coding and Fast Mode Decision for Spatial Enhancement Layers in Scalable Video Coding)

  • 이범식;함상진;박창섭;박근수;김문철
    • 방송공학회논문지
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    • 제12권6호
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    • pp.596-610
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    • 2007
  • 본 논문에서는 스케일러블 비디오 부호화기의 복잡도 감소를 위해, 공간 계층간 잔차 신호 부호화를 선택적으로 수행하고 그 정보를 바탕으로 향상 계층에서 모드를 고속으로 결정하는 방법에 대해 소개한다. 계층간 잔차 신호 부호화는 스케일러블 비디오 부호화에서 공간 계층간 상관도를 이용하여 계층간의 두 잔차 신호에 대한 차 신호를 부호화하는 방법으로서 부호화 효율을 증대 할 수 있는 장점이 있으나 향상 계층의 모든 화면간 모드에 대해 율-왜곡 비용을 계산하기 때문에 부호화기의 복잡도를 크게 증가시키는 주요 요인이 된다. 제안 알고리듬은 하위 계층으로부터 업샘플된 잔차 신호와, 하위 계층의 움직임 벡터, 참조 화면 정보를 이용하여 향상 계층에서 얻은 잔차 신호의 SAD값을 통해 정수 변환 계수의 특징을 미리 판별하여 계층간 잔차 신호 부호화를 선택적으로 수행하는 방법이다. 제안 알고리듬에서는 계층간 잔차 영상의 차 신호에 대한 SAD값에 양자화 계수와 시간 계위에 따라 문턱치 값을 적응적으로 적용시키면서 SAD가 적응적으로 설정된 문턱치 보다 작을때는 잔차 블록에 대한 정수변환 계수가 매우 작다고 판단하여 그 블록에 대해서는 선택적으로 계층간 잔차 부호화를 수행하고 역시 공간적 향상 계층에서 $16{\times}16$블록에 대해서만 율-왜곡 최적화를 수행한다. 따라서 계층간 차분 신호에 대한 SAD값만으로 정수변환계수의 특성을 양자화 계수와 시간 계위에 따라 분류하여 고속의 부호화를 달성함으로써 SVC 부호화기의 복잡도 및 부호화 시간을 크게 감소 시켰다. 제안 알고리듬을 적용하면 다양한 특성을 갖는 영상에 대하여 부호화 시간을 원래의 SVC 참조 소프트웨어 대비 평균 51.5%의 부호화 속도를 향상하였음에도 이에 따른 PSNR의 감소는 평균 0.03dB, 비트율의 증가는 0.64%로 무시할 수 있을 정도로 작았다.

UV 나노임프린트 리소그래피 공정에서 레지스트 도포의 최적화를 통한 잔류층 두께의 최소화 (The Minimization of Residual Layer Thickness by using optimized dispensing method in UVnanoimprint Lithography Process)

  • 김기돈;정준호;심영석;이응숙;김지현;조영근;홍성철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.633-636
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    • 2005
  • Imprint lithography is a promising method for high-resolution and high-throughput lithography using low-cost equipment. As with other nanoimprint methods, ultraviolet-nanoimprint lithography (UV-NIL) resolution appears to be limited only by template resolution, and offers a significant cost of ownership reduction when compared to other next generation lithography (NGL) methods such as EUVL and 157 nm lithography. The purpose of this paper is to suggest optimum values of control parameters of Imprio 100 manufactured by Molecular Imprint, Inc., which is the first commercially available UV-NIL tool, for sound nanoimprint. UV-NIL experiments were performed on Imprio 100 to find dispensing recipe for avoiding air entrapment. Dispensing recipe related to residual layer thickness and uniformity was optimized and 40 nm thick residual layer was achieved.

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EPS(Elementwise Patterned Stamp)를 이용한 UV 나노임프린트 공정에서 웨이퍼 변형에 따른 잔류층 분석 (Analysis of Nonniformity of Residual Layer Thickness on UV-Nanoimprint Using an EPS(Elementwise Patterned Stamp))

  • 김기돈;심영석;손현기;이응숙;이상찬;방영매;정준호
    • 대한기계학회논문집A
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    • 제29권9호
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    • pp.1169-1174
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    • 2005
  • Imprint lithography is a promising method for high-resolution and high-throughput lithography using low-cost equipment. In particular, ultraviolet-nanoimprint lithography (UV-NIL) is applicable to large area imprint easily. We have proposed a new UV-NIL process using an elementwise patterned stamp (EPS), which consists of a number of elements, each of which is separated by channel. Experiments on UV-NIL are performed on an EVG620-NIL using the EPS with 3mm channel width. The replication of uniform sub 70 nm lines using the EPS is demonstrated. We investigate the nonuniformity of residual layer caused by wafer deformation in experiment with varying wafer thickness. Severely deformed wafer works as an obstacle in spreading of dropped resin, which causes nonuniformity of thickness of residual layer. Numerical simulations are conducted to analyze aforementioned phenomenon. Wafer deformation in the process is simulated by using a simplified model, which is a good agreement with experiments.

A Study on the Uniformity Improvement of Residual Layer of a Large Area Nanoimprint Lithography

  • Kim, Kug-Weon;Noorani, Rafigul I.;Kim, Nam-Woong
    • 반도체디스플레이기술학회지
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    • 제9권4호
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    • pp.19-23
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    • 2010
  • Nanoimprint lithography (NIL) is one of the most versatile and promising technology for micro/nano-patterning due to its simplicity, high throughput and low cost. Recently, one of the major trends of NIL is large-area patterning. Especially, the research of the application of NIL to TFT-LCD field has been increasing. Technical difficulties to keep the uniformity of the residual layer, however, become severer as the imprinting area increases. In this paper we performed a numerical study for a large area NIL (the $2^nd$ generation TFT-LCD glass substrate ($370{\times}470$ mm)) by using finite element method. First, a simple model considering the surrounding wall was established in order to simulate effectively and reduce the computing time. Then, the volume of fluid (VOF) and grid deformation method were utilized to calculate the free surfaces of the resist flow based on an Eulerian grid system. From the simulation, the velocity fields and the imprinting pressure during the filling process in the NIL were analyzed, and the effect of the surrounding wall and the uniformity of residual layer were investigated.

Surface elasticity and residual stress effect on the elastic field of a nanoscale elastic layer

  • Intarit, P.;Senjuntichai, T.;Rungamornrat, J.;Rajapakse, R.K.N.D.
    • Interaction and multiscale mechanics
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    • 제4권2호
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    • pp.85-105
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    • 2011
  • The influence of surface elasticity and surface residual stress on the elastic field of an isotropic nanoscale elastic layer of finite thickness bonded to a rigid material base is considered by employing the Gurtin-Murdoch continuum theory of elastic material surfaces. The fundamental solutions corresponding to buried vertical and horizontal line loads are obtained by using Fourier integral transform techniques. Selected numerical results are presented for the cases of a finite elastic layer and a semi-infinite elastic medium to portray the influence of surface elasticity and residual surface stress on the bulk stress field. It is found that the bulk stress field depends significantly on both surface elastic constants and residual surface stress. The consideration of out-of-plane terms of the surface stress yields significantly different solutions compared to previous studies. The solutions presented in this study can be used to examine a variety of practical problems involving nanoscale/soft material systems and to develop boundary integral equations methods for such systems.

The Epoxy-metal Interphase and Its Incidence on Practical Adhesion

  • Roche, Alain Andre;Aufray, Maelenn
    • 접착 및 계면
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    • 제4권2호
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    • pp.1-9
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    • 2003
  • Epoxy-amine liquid prepolymers are extensively applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. Overall performances of such systems depend on the created interphase between the organic layer and the substrate. When epoxy-amine liquid mixtures are applied onto more or less hydrated metallic oxide layer, concomitant amine chemical sorption and hydroxide dissolution appear lending to the chelate formation. As soon as the chelate concentration is higher than the solubility product, these species crystallize as sharp needles. Moreover, intrinsic and thermal residual stresses are developed within painted or bonded systems. When residual stresses are higher than the organic layer/substrate adhesion, buckling, blistering, debonding may occur leading to a catastrophic drop of system performances. Practical adhesion can be evaluated with either ultimate parameters (Fmax or Dmax) or the critical strain energy release rate, using the three point flexure test (ISO 14679-1997). We observe that, for the same system, the ultimate load decreases while residual stresses increase when the liquid/solid time increases. Ultimate loads and residual stresses depend on the metallic surface treatment. For these systems, the critical strain energy release rate which takes into account the residual stress profile and the Young's modulus gradient remains quite constant whatever the metallic surface treatment was. These variations will be discussed and correlate to the formation mechanisms of the interphase.

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