• Journal of the Korea Concrete Institute
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• v.29 no.2
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• pp.217-223
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• 2017

This research was planned to evaluate the structural performance of post tensioned(PT) concrete member subjected to fire. Prime objective was to suggest some techniques to evaluate the performance of post tensioned concrete beam and slab exposed to high temperature through experiment. To accomplish this objective, the following two scopes have been proceeded to verify the strength reducing ratio of strands and find out the difference of resisting force at the PT concrete members exposed to high temperature through the fire test. The properties of prestressing steel(tendon) in PT concrete beam and slab under variable temperatures were reviewed. The test of this study was shown that stress relaxation occurred at high temperature, and some restoration of tensional force appeared as it got cooling down. The residual tension of the post tensioned beams at 4 hours after reaching the target temperature were 70% at $400^{\circ}C$, 10% at $600^{\circ}C$ and 2% at $800^{\circ}C$. The post tensioned slabs were 94% at $400^{\circ}C$, 84.5% at $600^{\circ}C$ and 62% at $800^{\circ}C$. The reason why the residual tension loss of the post tensioned slab was relatively small was considered to be that the slab was exposed just one side to high temperature and the strength of the strand was restored larger than that of beam. Also, it was confirmed that the post tensioned member inevitably experienced the loss of strength by fire damage, and restoration design of the member should be required to compensate for the value as much as lost strength.

• Journal of radiological science and technology
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• v.26 no.2
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• pp.57-61
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• 2003

The purpose of this study is to compare both 1.5T and 4.7T in Praietal White matter material Phantom using the same methodology at both field strengths. Data at both field strengths are compared in terms of $T_2$ relaxation times, line widths and SNRs MR imaging and $^1H$ MR spectroscopy were performed on GE 1.5T SIGNA system and Broker Biospec 4.7T/30 MRI/MRS system. After phantom axial scan $^1H$ MRS was obtained from T2 weighted image by 3-dimensional localization technique(PRESS : Point RE solved spectroscopy Sequence) this phantom is composed of an aqueous solution 36.7 mmol/L of NAA, 25.0 mmol/L of Cr, 6.3 mmol/L of choline chloride, 30.0 mmol/L or Glu, and 22.5 mmol/L of MI(adjusted to a pH of 7,15 in a phosphate buffet). Data processed using software developed inhouse. At 1.5T, T2 relaxation times for Cho, Cr, and NAA were $0.41{\pm}0.07,\;0.26{\pm}0.04,\;0.46{\pm}0.07$ while at 4.7T they were $0.17{\pm}0.03,\;0.14{\pm}0.05,\;0.20{\pm}0.03$ respectively. At 1.5T, line widths for water, Cho, Cr and NAA were $2.9{\pm}0.7,\;1.6{\pm}0.7,\;1.7{\pm}0.8,\;2.2{\pm}0.02Hz$ while at 4.7T they were $5.2{\pm}1.1,\;4.6{\pm}1.9,\;4.01{\pm}1.8,\;4.8{\pm}1.9Hz$ respectively. It can be seen that $T_2$ relaxation times were significantly shorter at 4.7 compared to 1.5T and that the line widths were also broader. The average SNRs for NAA for subjects at short and long TEs were $23.5{\pm}11.3$ at TE=20 msec ; $15.4{\pm}7.7$ at TE=272 msec at 1.5T and $40{\pm}8.3$ and $17{\pm}3.5$ respectively at 4.7T higher field strength is superior because of improved sensitivity and chemical shift dispersion. However these improvements are partially offset by increased line widths and decrease $T_2$ relaxation times, which act to reduce both sensitivity and resolution. In our experiments with the equipment available to us, 4.7T proton spectra at short TEs exhibit moderately improved sensitivity compared to 1.5T.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.32 no.5A
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• pp.317-325
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• 2012

In this study, to evaluate the shrinkage behavior of ultra high performance fiber reinforced concrete (UHPFRC) under restrained condition, restrained shrinkage test was performed according to ring-test mostly used at home and abroad. Ring-test was performed with the various thicknesses and radii of inner steel ring to give different degree of restraint. Free shrinkage and tensile tests were carried out simultaneously to estimate the degree of restraint, stress relaxation, and shrinkage cracking potential. Test results indicated that the average steel strain and residual tensile stress were reduced as the thicker inner steel ring was used, whereas degree of restraint was increased. The steel strain, residual tensile stress and degree of restraint were hardly affected by the size of radius of inner ring. In the case of all ring specimens, shrinkage crack did not occur because the residual tensile stress was lower than the tensile strength. About 39~65% of the elastic shrinkage stress was relaxed by the sustained interface pressure, and the maximum relaxed stress was increased as the thicker inner ring was applied. Finally, the degree of restraint with age was predicted by performing non-linear regression analysis, and it was in good agreement with the test results.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• Journal of the Korean Society for Precision Engineering
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• v.3 no.1
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• pp.40-49
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• 1986

Crack, craze and void are common defects which may be found in the bulk of polymeric materials such as either themoplastics or thermosets. The healing phenomena, autohesion, of these defects are known to be a intrinsic material property of various polymeric materials. However, only a few experimental and theoretical investigations on crack, void and craze healing phenomena for various polymeric materials have been reported up to date [1, 2, 3]. This may be partly due to the complications of healing processes and lacking of appropriate theoretical developments. Recently, some investigators have been urged to study the healing phenomena of various polymenic materials since the significance of the use of polymer based alloys or composites has been raised in terms of specific strength and energy saving. In the earlier published reports [1, 2, 3, 4], the crack and void healing velocity, healing toughness and some other healing mechanical and physical properties were measured experimentally and compared with predicted values by utilizing a simple model such as the reptation model under some resonable assumptions. It seems, however, that the general acceptance of the proposed modeling analyses is yet open question. The crack healing processes seem to be complicate and highly dependent on the state of virgin material in terms of mechanical and physical properties. Furthermore, it is also strongly dependent on the histories of crack, craze and void development including fracture suface morphology, the shape of void and the degree of disentanglement of fibril in the craze. The rate of crack healing may be a function of environmental factors such as healing temperature, time and pressure which gives different contact configurations between two separated surfaces. It seems to be reasonable to assume that the crack healing processes may be divided in several distinguished steps like stress relaxation with molecular chain arrangement, surface contact (wetting), inter- diffusion process and com;oete healing (to obtain the original strength). In this context, it is likely that we no longer have to accept the limitation of cumulative damage theories and fatigue life if it is probable to remove the defects such as crack, craze and void and to restore the original strength of polymers or polymer based compowites by suitable choice of healing histories and methods. In this paper, we wish to present a very simple and intuitive theoretical model for the prediction of healed fracture toughness of cracked or defective polymeric components. The central idea of this investigation, thus, may be the modeling of behavior of chain molecules under healing conditions including the effects of chain scission on the healing processes. The validity of this proposed model will be studied by making comparisons between theoretically predicted values and experimentally determined results in near future and will be reported elsewhere.

• Journal of Korean Tunnelling and Underground Space Association
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• v.19 no.4
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• pp.651-668
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• 2017

For initial stability of the tunnel, the primary support, Shotcrete and rockbolt shall be placed in the most appropriate time. This is because the role of such support plays a vital role in long-term and short-term tunnel stability. In this study, the rock bolt is an important supporting system that receives the external pressure generated by the stress relaxation during tunnel excavation as axial force and transmits it to the shotcrete on the tunnel excavation surface. Until now, most of the materials of rock bolts have been used in the field, but there have been many problems such as uncertain quality of Chinese materials entering the market, poor packing due to falling down of rock bolts when filled with mortar, and corrosion due to water. Therefore, in this study, we have developed a high strength steel pipe rock bolt using Autobeam material to solve and improve various problems of existing rock bolts. In order to evaluate the performance of the developed bolt, field tests were carried out and the existing mortar filler in order to improve the performance of the rock bolt, the design and construction criteria were studied and the results were included in this paper.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean GEO-environmental Society
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• v.17 no.11
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• pp.45-53
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• 2016

A precast panel wall system resists against the horizontal earth pressure by increasing the shear strength of ground by reinforcement connected to the panel. The application of precast panel wall system is growing to lately minimize the earth work and environmental damage caused by large cut slope and to use the limited land effectively. The ground adhered panel wall system is the construction method that has the panel engraved with natural rock shape to improve the landscape. This system is developed to complete Top-Down method, and it is possible to have vertical cut, and to adhere to in-situ ground, improve construction ability by minimizing the ground relaxation and exclusion the trench and backfill process. In this study the field tests were performed to verify the construction ability about the vertical cut and complete Top-Down process and the construction behavior of ground adhered panel wall system was analyzed by large scale loading test and measurement results during loading test.

• Computational Structural Engineering
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• v.9 no.1
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• pp.151-159
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• 1996

A finite element formulation based on the CFT(Compression Field Theory) concept such as the effect of compression softening in cracked concrete, and macroscopic and rotating crack models etc. was presented for the nonlinear behaviour of structural concrete. In this category, tangential or secant material stiffnesses for cracked concrete were also defined and discussed in view of the iterative solution schemes for nonlinear equations. Considering the computational efficiency and the ability of modelling the post-ultimate behaviour as major concerns, the incremental displacement solution algorithm involving initial material stiffnesses and the relaxation procedure for fast convergence was adopted and formulated in a type of 8-noded quadrilateral isoparametric elements. The analysis program NASCOM(Nonlinear Analysis of structrual Concrete by FEM : Monotonic Loading) developed baed on the CFT constitutive relationships and the incremetal solution strategy described enables the predictions of strength and deformation capacities in a full range. crack patterns and their corresponding widths, and yield extents of reinforcement. As the verfication purpose of NASCOM, the prediction of Cervenka's panel test results including the load resistance and the deformation history was made. A limited number of predictions indicate a good correlation in a general sense.