• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2005년도 추계종합학술대회
• /
• pp.233-236
• /
• 2005

Our country compares with advanced nations by supply of super high speed network and information communication infra construction has gone well very. Many people by extension of on-line transaction and various internet services can exchange, or get information easily in this environment. But, virus or poisonous information used to Cyber terror such as hacking was included within such a lot of information and such poisonous information are threatening national security as well as individual's private life. There were always security and speed among a lot of items to consider networks equipment from these circumstance to now when develop and install in trade-off relation. In this paper, we present a high speed VPN Acceleration Board(VPN-AB) that balances both speed and security requirements of high speed network environment. Our VPN-AB supports two VPN protocols, IPsec and SSL. The protocols have a many cryptographic algorithms, DES, 3DES, AES, MD5, and SHA-1, etc.. The acceleration board process data packets into the system with In-line mode. So it is possible that VPN-AB processes inbound and outbound packets by 10Gbps. We use Nitrox-II CN2560 security processor VPN-AB is designed using that supports many hardware security modules and two SPI-4.2 interfaces to design VPN-AB.

• 한국콘텐츠학회:학술대회논문집
• /
• 한국콘텐츠학회 2006년도 추계 종합학술대회 논문집
• /
• pp.575-579
• /
• 2006

지능형 교수 시스템의 주요 구성 요소인 교수 모듈, 학습자 모듈, 전문가 모듈, 인터페이스 모듈 중에서 학습자와 가장 긴밀한 연관이 있으며 학습 시스템의 가장 큰 표현 부분에 해당하는 모듈이 인터페이스 모듈이다. 학습자에게 있어 인터페이스 모듈은 일반 이러닝 시스템뿐만 아니라 지능형 교수 시스템에서도 큰 비중을 차지하는데 아직까지 인터페이스의 개선에 관한 연구는 그리 활발하지 못한 실정이다. 이에 따라 본 연구에서는 이러닝시 학습자와 가장 상호작용이 많은 인터페이스의 개선에 관한 연구를 수행하였다. 본 연구를 위해 기존의 인터페이스의 주요 구성 요소에 대해 살펴보았으며 선행 연구의 문제점을 개선한 멀티미디어 인터페이스를 설계 구현 하였다.

• 한국경영과학회:학술대회논문집
• /
• 대한산업공학회/한국경영과학회 1992년도 춘계공동학술대회 발표논문 및 초록집; 울산대학교, 울산; 01월 02일 May 1992
• /
• pp.436-443
• /
• 1992

Presented in the paper is a systematic approach to constructing a Petri net model of FAS (flexible assembly system). Petri net is widely used in modeling automated manufacturing systems. But, it found to be very difficult for an FA engineer to build a correct model of an FAS with Petri net symbols (ie, place, transition, and token) from the beginning. An automated manufacturing system in general is built from a set of "standard" hardware components. An FAS in particular is usually composed of assembly robots, work tables, conveyor lines, buffer storages, part feeders, etc. In the proposed modeling scheme, each type of standard resources is represented as a standard "module" which is a sub Petri net. Then, the model of a FAS can be conveniently constructed using the predefined modules the same way the FAS itself is built from the standard components. The network representation of a FAS is termed a JR-net (job resource relation net) which is easy to construct. This JR net is then mechanically converted to a formal Petri net (to simulate the behavior of the FAS). The proposed modeling scheme may easily be extended to the modeling of other types of automated manufacturing systems such as FMS and AS/RS.ch as FMS and AS/RS.

• World Technopolis Review
• /
• 제7권1호
• /
• pp.15-43
• /
• 2018

The lack of appropriate performance appraisal and evaluation of incubatees of technology incubation programmes in relation to entrepreneurship development in Nigeria is a major gap that needs to be bridged. This study examined the effect of selected technology incubation programme variables such as training, financing and marketing on entrepreneurship development in Nigeria. A closed-ended questionnaire was used for data collection from the quota-sampled population of the six (6) geo-political zones of Nigeria. Descriptive statistics were used to analyse the data while multiple regression was used to test the hypotheses. The results revealed that technology incubation training has a significant effect on entrepreneurial ability in Nigeria; there is a significant and positive effect of technology incubation financing on entrepreneurial funding portfolio; there is no significant impact of technology incubation marketing programme on entrepreneurial turnover; and technology incubation has no significant impact on entrepreneurial propensity. The study recommended that the National Board for Technology Incubation (NBTI) expand the training modules to capture pre, post and virtual incubatees; to facilitate access to risk funds, cheap capital and encourage establishment of venture capital; to improve on its marketing programme to encompass all marketing needs of incubatees beyond trade-fair participation. However, trade-fairs participation has a significant but limited effect on entrepreneurial turnover, while a technology incubation programme has no significant impact on entrepreneurial propensity, as only six (6) out of the twenty-nine (29) respondents started new venture from the incubation centers which are industrial training students and staff of the incubatees.

• 한국컴퓨터정보학회논문지
• /
• 제5권4호
• /
• pp.13-20
• /
• 2000

전자상거래 활동은 인터넷과 같은 안전하지 않은 공중망을 사용하기 때문에 많은 보안 위협요소들이 존재한다. 따라서, 다양한 형태의 보안 어플리케이션들이 안전한 전자상거래의 구현을 위하여 CAPI(Cryptographic Application Programming Interface)가 사용될 것으로 예상된다. CAPI는 각 수준별 암호 서비스와 다양한 보안 서비스들을 제공한다. CSSM API는 다른 CAPI들에 비하여 모듈성, 단순성, 다양한 Add-in 모듈과 인터페이스에 의한 확장성을 제공한다. 본 논문은 다른 CAPI와 CSSM API의 비교분석과 전자상거래에 다양한 확장성과 멀티플랫폼을 지원하는 CSSM API의 적용 방안을 제안한다. CSSM API CSP 인터페이스의 암호화, 디지털서명 오퍼레이션에 대하여 기술하고, 전자상거래 위협요소에 대응한 보안 서비스의 연관관계로 CSSM API 적용에 따른 안전성 평가를 하였다.

• 상하수도학회지
• /
• 제19권2호
• /
• pp.144-148
• /
• 2005

The industrial development of large scale deep bed filters has been a very important step in the process of drinking water production and more recently in the tertiary treatment of wastewater. The target of deep bed filtration is the retention is the retention of small particles generally smaller than 30 microns at relatively small concentration, generally less than 30 mg/l from natural water (surface water or aquifers) or secondary treated wastewater. The relation between the retention efficiency and the characteristics of the particles has been extensively studied experimentally and through different models of retention. During the last years the development of new technologies (fiber filter, membrane modules) lead to more intensive processes compared to conventional sand filtration. Fiber filters can combine intensification with a decrease in specific energy needed however they cannot be operated under gravity like sand filters. Membrane filters (UF or MF) are much more intensive and efficient than sand filters. The specific energy needed is not so high (about $0.1Kwh/M^3$) but is higher than sand or fiber filter. A Life Cycle Analysis (LCA) has to be made for a complete comparison between these technologies taking in account that the efficiency of particle retention obtained by membrane filters is unique.

• Steel and Composite Structures
• /
• 제39권5호
• /
• pp.599-614
• /
• 2021

This study deals with the Lateral-Torsional Buckling (LTB) of a mono-symmetric tapered I-beam, in which the cross-section is varying longitudinally. To obtain the buckling moment, two concentrated bending moments should be applied at the two ends of the structure. This structure is made of Functionally Graded Material (FGM). The Young's and shear modules change linearly along the longitudinal direction of the beam. It is considered that this tapered beam is laterally restrained continuously, by using torsional springs. Furthermore, two rotational bending springs are employed at the two structural ends. To achieve the buckling moment, Ritz solution method is utilized. The response of critical buckling moment of the beam is obtained by minimizing the total potential energy relation. The lateral and torsional displacement fields of the beam are interpolated by harmonic functions. These functions satisfy the boundary conditions. Two different support conditions are considered in this study. The obtained formulation is validated by solving benchmark problems. Moreover, some numerical studies are implemented to show the accuracy, efficiency and high performance of the proposed formulation.

• 한국학교보건학회지
• /
• 제8권2호
• /
• pp.277-291
• /
• 1995

The study was designed to grasp the mental health of junior college students and identify the relation between mental health and social support. The subjects for this study were 781 sophomores attending T junior college in Taegu. The data were collected through questionnaire during the period from september 10,1993 to september 24, 1993. The results of this can be summarized as follows: In mental health the average mark was 1.94 on the basis of 5 marks. Those whose mark was more than 75% (low) had Depression(8.7%),Obsessive compulsive reaction(5.2%) Anxiety(3.6%). In social support, the average mark was 3.03 on the basis of 4 marks, which showed comparatively high support; relationship with friends was 75.4%, companionship was 75.4%, and mutual understanding was 72.3%. Many students got more than 75% in total marks. In the state of mental health, there was a significant difference depending on sex, total income, the character and the attitude toward his parents. There is also an unusual difference in social support depending on the major subjects, the character, the problem at present and the attitude toward his parents. In mental health, both male and female students got higher marks in Depression, Obsessive compulsive reaction than in any other item. In social support level all students had a high support in the relationship with friends and mutual understanding. Those who are affectionate to and dependent on their parents had a tendency to have better mental health. The simple correlation modules between social support mark and mental health one was -0.5555 and the partial correlation modules of controlling sex, age, growth place was -0.5557. There was little difference between them. In mental health items Interpersonal sensitivity was highest correlated with social support and Somatinization was lowest correlated. There was a significant correlation between mental health and social support: the higher social support were, the better mental health was. In conclusion, the study showed that the relationship between the social support and the mental health level revealed a significant correlation. In social support Expressive support (companionship support, mutual understanding support) showed a higher degree of support than instrumental support(monetary support, demand support). Therefore, in the guidance of students, it is necessary to expand expressive support considering these respects. Further multidimensional study is needed on how to improve the mental health of junior students through the social support.

• 기독교교육논총
• /
• 제74권
• /
• pp.57-80
• /
• 2023

연구 목적 : 본 연구는 급변하는 세상 속에서 지속가능한 발전을 위한 기독교교육의 실천적 가능성을 모색하고자 하는 목적으로 진행되었다. 이를 위하여 1980년대 초부터 유네스코를 중심으로 연구되고 발표되었던 "지속가능발전"(Sustainable Development)이라는 개념과 의미 그리고 실행방향을 규명하고, 그 원리를 활용하여 기독교교육의 지속가능한 발전을 위한 실천적 전략을 제시하고자 하였다. 연구 내용 및 방법 : 본 연구는 유네스코에서 발표한 5개의 주요 보고서들--"우리 공동의 미래"(1987), "의제21"(1992), 유엔ESD 10년"(2002), "글로벌실행프로그램 2015-2019"(2014) 그리고 "지속가능발전2030"(2020)--을 연대순으로 선별하고, 그 안에 제시되고 있는 "지속가능발전(SD)의 개념과 의미에 대한 변천사를 고찰하였다. 동시에 "지속가능발전교육"(ESD)과 관련하여 "지속가능발전목표"(SDGs)의 발생과 변천 그리고 실행방식을 살펴보면서 지속가능발전의 구체적인 실천전략이 갖는 특징들을 분석하여 제시하였다. 결론 및 제언 : 본 연구를 통해 지속가능발전의 개념과 이를 활용한 리더십 개발전략을 바탕으로 하여 기독교교육이 믿음의 다음 세대를 올바르게 세우기 위해 필요한 3가지 함의점을 도출하였다. 먼저 기독교교육의, 지속가능성을 위하여 문화명령에 대한 올바른 성경적 해석을 바탕으로 한 교육의 토대를 점검하고 다음으로 다양한 형태의 지표와 교육모듈을 사용하여 구체적인 교육과정 개발과 수업 설계의 필요성을 제안하고, 마지막으로 다차원적인 접근을 통해 기독교교육의 활성화를 위한 교육리더십 개발을 위한 구체적인 실천사항을 제시한다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.