• 대한전자공학회논문지
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• 제27권5호
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• pp.729-736
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• 1990

Oxide (RTO), nitrided-oxide(NO), and reoxidized-nitrided-oxide(ONO) films were formed by sequential rapid thermal processing. The film composition was investigated by Auger electron spectroscopy(AES). The Si/SiO2 interface and SiO2 surface are nitrided more preferentially than SiO2 bulk. When the NO is reoxidized, [N](atomic concentration of N) in the NO film decreased` especially, the decrease of [N] at the surface is considerable. The weaker the nitridation condition is, the larger the increase of thickness is as the reoxidation proceeds. The elelctrical characteristics of RTO, NO, and ONO films were evaluated by 1-V, high frequency (1 MHz) C-V, and high frequency C-V after constant current stress. The ONO film-which has 8 nm thick initial oxide, nitrided in NH3 at 950\ulcorner for 60 s, reoxidized in O2 at 1100\ulcorner for 60 s-shows good electrical characteristics such as higher electrical breakdown voltage and less variation of flat band voltage under high electric field than RTO, and NO films.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 하계학술대회 논문집 B
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• pp.1106-1109
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• 1993

Ferroelectric thin films of PZT with differnt Zr/Ti ratio were prepared by sol-gel processing and annealed by rapid-thermal-annealing at $500^{\circ}C-700^{\circ}C$ for 10sec-1min. The structure of the annealed films were examined by X-ray diffraction and SEM. Maximum remnant polarization of 10.24 ${\mu}m/cm^2$ and coercive field of 70 KV/cm were obtained from hysteresis curve or the film.

• 한국세라믹학회지
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• 제33권6호
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• pp.665-671
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• 1996

Ferroelectric Pb(Fe1/2Nb1/2)O3 thin films were successfully fabricated on ITO/Glass substrate by sol-gel proces-sing and characterized to determine the dielectric and electric properties. Viscosity of PEN sol measured to investigate rheological properties was 3.25 cP which was proper for coating. The sol also showed Newtonian behavior. RTA(Rapid Thermal Annealing) was used for the annealing of the thin film and 1200~1700$\AA$ thick PEN thin films were fabricated by repeating the intermediate and the final annealing. After the deposition of Pt as top electrode by vacuum evaporation dielectric and electric properties were measured. Dielectric properties of FFN thin film were enhanced by increasing the perovskite phase fraction with increasing the annealing temperature. Measured dielectric constant of 1700$\AA$ PFN thin film annealed at $650^{\circ}C$ was 890 at 1kHz Capacitatnce density and dielectric loss were 47 fF/${\mu}{\textrm}{m}$2 and 0.47 respectively. As a result of measuring Curie temperature PFN thin films had Curie point with a rang of 110~12$0^{\circ}C$ and showed broad dielectric peak at that point. Leakage current of the PFN thin films were increased with increasing the annealing tempera-ture.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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• pp.391-393
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• 2012

CuInGa 전구체를 여러 분위기에서 급속 열처리 공정 (rapid thermal processing; RTP)을 이용하여 셀렌화하여 CuInGaSe 박막을 제작하였다. 공정조건은 각각 진공상태, 아르곤 가스 유동 상압상태, 아르곤 분위기 상압밀폐에서 덮개 유리를 사용한 상태 및 아르곤 밀폐상압에서 추가로 Se을 공급한 상태이었다. 제작된 CuInGaSe의 특성을 ICP 측정을 통하여 분석하였다. 열처리 조건에서 시스템이 밀폐상태에 가까울수록 Se 증기압이 높을수록 CuInGaSe 박막의 Se 함량이 증가하였다. 아르곤 분위기 상압 밀폐상태에서 제작된 CuInGaSe 박막을 이용하여 제작한 태양전지의 효율은 9.6%이었다.

• 열처리공학회지
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• 제7권1호
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• pp.3-10
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• 1994

The structure and mechanical properties of the extruded specimens were investigated in rapid solidified Al-(1, 3, 5) Cr alloys after mechanical alloying. Finer lamellar microstructure could no longer be resolved in the bars obtained by extrusion of the spherical particles after 200 min. of processing time. The structure of extruded bars are highly depended on the processing time of splats. The isothermal annealing of the extruded bars showed that all the alloys had good thermal stability up to $400^{\circ}C$ and did not show the recrystallization phenomena. Severe working of Al-(1, 3, 5) Cr splats produced a very fine grain size and substructural strengthening (high dislocation density and fine grain size). Effects of mechanical alloying on the thermal stability of the extruded bars Al-(1, 3, 5) Cr alloys decreases, with increasing Cr content. But the ultimate tensile Strength in the extruded bars increases with increasing Cr content.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.169-172
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• 2004

The effect of the process parameters on the stable lifetime in rapid thermal firing(RTF) was investigated in order to optimize the process for the Cz-silicon. The process temperature was varied between $700^{\circ}C\;and\;950^{\circ}C$ while the process time was chosen 1 s and 10 s. At below $850^{\circ}C$ the stable lifetime for 10 s is higher than that for 1 s and increases with increasing by the process temperature. However, at over $850^{\circ}C$ the improved stable lifetime is not dependent on the process time and temperature. On the other hand, two high temperature processes in solar cell fabrics are combined with the optimized process and the non-optimized process. The last process determines the stable lifetime. Also, the degraded stable lifetime could be increased by processing in optimized process. The decreased lifetime can increase using the optimized oxidation process, which is a final process in solar cells. Finally, the optimized and non-optimized processes are applied solar cells.

• 반도체디스플레이기술학회지
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• 제17권3호
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• pp.31-35
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• 2018

Tungsten disulfide($WS_2$) thin films were directly deposited by direct-current(DC) sputtering and annealed by rapid thermal processing(RTP) to materialize two-dimensional p-type transition metal dichalcogenide (TMDC) thin films on soda-lime glass substrates without any complicated exfoliation/transfer process. $WS_2$ thin films deposited at various DC sputtering powers from 80 W to 160W were annealed at different temperatures from $400^{\circ}C$ to $550^{\circ}C$ considering the melting temperature of soda-lime glass. The optical microscope results showed the stable surface morphologies of the $WS_2$ thin films without any defects. The X-ray photoelectron spectroscopy (XPS) results and the Hall measurement results showed stable binding energies of W and S and high carrier mobilities of $WS_2$ thin films.

• 한국진공학회지
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• 제12권3호
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• pp.168-173
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• 2003

유리 기판 위에 증착된 비정질 실리콘 박막의 고상 결정화에 대한 새로운 방법을 제시하였다. 비정질 실리콘 박막의 하부에 패턴 된 다양한 크기의 $TiSi_2$ 박막을 전기저항 가열 방식으로 가열함으로서 비정질 실리콘이 고상 결정화 되도록 하였다. 박막히터를 이용한 열처리는 매우 빠른 열처리 공정으로써, 일반적인 로에 의한 열처리에 비해 매우 낮은 thermal budget을 가지므로, 유리기판 위에서도 고온 열처리가 가능하다는 장점을 가진다. 본 연구에서는 500 $\AA$의 비정질 실리콘 박막을 약 $850^{\circ}C$ 이상의 높은 온도에서 수 초 내에 결정화 할 수 있음을 보였으며, 열처리 조건의 변화에 따른 영향과 지역선택성의 장점을 보였다.

• 소성∙가공
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• 제19권3호
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• pp.152-159
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• 2010

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. High-frequency induction is an efficient way to heat mold surface by electromagnetic induction in a non-contact manner, and has been recently applied to the injection molding due to its capability of rapid heating and cooling of mold surface. The present study covers a three-dimensional finite element analysis to investigate heating efficiency and structural safety of the induction heating process of an injection mold. To simulate the induction heating process, an integrated simulation method is proposed by effectively connecting an electromagnetic field analysis, a transient heat transfer analysis and a thermal stress analysis. The estimated temperature changes are compared with experimental measurements for various types of induction coil, from which heating efficiency according to the coil shape is discussed. The resulting thermal stress distributions of the mold plate for various types of induction coils are also evaluated and discussed in terms of the structural safety.

• 제어로봇시스템학회논문지
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• 제6권1호
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• pp.104-111
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• 2000

A fuzzy logic Run-by-Run(RbR) controller and an in -line wafer characteristics prediction scheme for the rapid thermal processing system have been developed for the study of process repeatability. The fuzzy logic RbR controller provides a framework for controlling a process which is subject to disturbances such as shifts and drifts as a normal part of its operation. The fuzzy logic RbR controller combines the advantages of both fuzzy logic and feedback control. It has two components : fuzzy logic diagnostic system and model modification system. At first, a neural network model is constructed with the I/O data collected during the designed experiments. The wafer state after each run is assessed by the fuzzy logic diagnostic system with featuring step. The model modification system updates the existing neural network process model in case of process shift or drift, and then select a new recipe based on the updated model using genetic algorithm. After this procedure, wafer characteristics are predicted from the in-line wafer characteristics prediction model with principal component analysis. The fuzzy logic RbR controller has been applied to the control of Titanium SALICIDE process. After completing all of the above, it follows that: 1) the fuzzy logic RbR controller can compensate the process draft, and 2) the in-line wafer characteristics prediction scheme can reduce the measurement cost and time.