• Title/Summary/Keyword: rapid thermal processing

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Characteristics of Silicon Oxide Films Grown by Rapid Thermal Oxidation (급속일산화법에 의한 실리콘 산화막의 특성)

  • 이귀연;양두영;이재용
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.28A no.12
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    • pp.59-64
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    • 1991
  • Thin (25-103$\AA$) SiO$_2$ films are grown using the rapid thermal oxidation processing at temperatures of 105$0^{\circ}C$-115$0^{\circ}C$ for 5-30 sec, in order to investigate the characteristics of ultra thin oxide. For measuring the thickness of oxide TEM, ellipsometry, and C-V method which is taken in the condition of small surface band bending are used and compared. When neglecting the small deviation affected by both interface state and moisture charge effect, those three methods described above give similar results. In order to examine the effect of rapid thermal annealing, part of samples are annealed in N$_2$ ambient. MOS capacitors are fabricated and the characteristics of I-V and C-V are measured. Measurements show that the activation energy of initial thickness of oxide grown during the ramp-up time is of 1.125eV and the activation energy of the oxidation rate is of 0.98eV. As oxidation temperature is increased, dielectric breakdown field E$_{BD}$ is decreased due to the increase of fixed charge density N$_f$ However, E$_{BD}$ is shown to be decreased as increasing the thickness of oxide. The increase of N$_f$ in the early stage of thermal annealing results in the decrease of E$_{BD}$.

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Optimizing of Diffusion Condition in Spin on Doping for c-Si Solar Cell (스핀 도핑을 이용한 단결정 실리콘 태양전지 확산 공정 최적화)

  • Yeo, In Hwan;Park, Ju Eok;Kim, Jun Hee;Cho, Hae Sung;Lim, Donggun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.5
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    • pp.410-414
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    • 2013
  • Rapid thermal processing (RTP) abruptly decreases the time required to perform solar cell processes. RTP were used to form emitter of crystalline silicon solar cells. The emitter sheet resistance is studied as a function of time and temperature. The objective of this study is reduction of doping process time with same performance. Emitter difRapid thermal dfusion was carried out by using a spin on doping and a RTP. iffusion was performed in the temperature range of $700{\sim}750^{\circ}C$ for 1m 30s~15 m. Thermal budgets yielded a $50{\Omega}/sq$ emitter using a P509 source. To reduce process time and get high efficiency, rapid thermal diffusion by IR lamp was employed in air atmosphere at $700^{\circ}C$ for 15 m.

Bang-Bang plus PID Temperature Control Scheme for Rapid Thermal Processing (급속 열처리 공정을 위한 Bang-Bang/PID 온도제어기법)

  • Song, Tae-Seung;Lyu, Joon
    • Journal of IKEEE
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    • v.3 no.1 s.4
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    • pp.109-117
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    • 1999
  • This paper describes the quick and precise control of the wafer temperature essential in rapid thermal processing(RTP). The bang-bang plus PID controller structure is introduced to satisfy rapid ramp-up rate and reduce overshoot and steady state error. The controller employs the PID action when the magnitude of the error between reference signal and the output temperature signal is smaller than some prescribed value. To find PID gains, the plant(autoregressive) model is first identified and Kappa-Tau tuning rule is used. The developed controller is applied to experimental RTP apparatus, and performances are evaluated.

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Laser Rapid Prototyping by Melting Brass Powder (황동 분말의 용융에 의한 레이저 급속 조형법)

  • 최우천;최우영;송대준;이건상
    • Laser Solutions
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    • v.3 no.1
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    • pp.21-28
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    • 2000
  • Selective Laser Sintering (SLS) can produce three-dimensional objects directly from a CAD solid model without part-specific tooling. In this study, a simple rapid prototyping through selective laser sintering on brass powder is investigated using a Nd-YAG laser. Experiments are conducted to produce single lines on a powder-packed bed for various process parameters. Also, temperature distribution in the powder bed and the thickness of a melted line are predicted by finite element analysis. In the numerical analysis, the thermal conductivity of the brass powder which is obtained as a function of state and temperature is used.

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Thermo-mechanical Simulation of Boron Steel Cylinders during Heating and Rapid Cooling (원통형 보론강을 사용한 가열-급냉공정에서의 열변형 해석)

  • Suh, C.H.;Kwon, T.H.;Kang, K.P.;Choi, H.Y.;Kim, Y.S.;Kim, Y.S.
    • Transactions of Materials Processing
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    • v.23 no.8
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    • pp.475-481
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    • 2014
  • Water quenching is one method of cooling after hot forming, which is presently being used for the manufacturing of automobile parts. The formed parts at room temperature are heated and then cooled rapidly in a water bath to produce high strength. The formed parts may undergo excessive thermal distortion during the water quench. In order to predict the distortion during water quenching, a coupled thermo-mechanical simulation is needed. In the current study, the simulation of heating and cooling of boron steel cylinders was performed. The material properties for the simulation were calculated from JMatPro, and the convective heat transfer coefficient was obtained from experimental tests. The results show that the thermal distortion and the residual stresses are well predicted by the coupled simulation.

Co-firing Optimization of Crystalline Silicon Solar Cell Using Rapid Thermal Process (급속 열처리 공정을 이용한 결정질 실리콘 태양전지의 전극 소결 최적화)

  • Oh, Byoung-Jin;Yeo, In-Hwan;Lim, Dong-Gun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.3
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    • pp.236-240
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    • 2012
  • Limiting thermal exposure time using rapid thermal processing(RTP) has emerged as promising simplified process for manufacturing of solar cell in a continuous way. This paper reports the simplification of co-firing using RTP. Actual temperature profile for co-firing after screen printing is a key issue for high-quality metal-semiconductor contact. The plateau time during the firing process were varied at $450^{\circ}C$ for 10~16 sec. Glass frit in Ag paste etch anti-reflection layer with plateau time. Glass frit in Ag paste is important for the Ag/Si contact formation and performances of crystalline Si solar cell. We achieved 17.14% efficiency with optimum conditions.

Nonlinear Optimal Control of an Input-Constrained and Enclosed Thermal Processing System

  • Gwak, Kwan-Woong;Masada, Glenn Y.
    • International Journal of Control, Automation, and Systems
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    • v.6 no.2
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    • pp.160-170
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    • 2008
  • Temperature control of an enclosed thermal system which has many applications including Rapid Thermal Processing (RTP) of semiconductor wafers showed an input-constraint violation for nonlinear controllers due to inherent strong coupling between the elements [1]. In this paper, a constrained nonlinear optimal control design is developed, which accommodates input constraints using the linear algebraic equivalence of the nonlinear controllers, for the temperature control of an enclosed thermal process. First, it will be shown that design of nonlinear controllers is equivalent to solving a set of linear algebraic equations-the linear algebraic equivalence of nonlinear controllers (LAENC). Then an input-constrained nonlinear optimal controller is designed based on that LAENC using the constrained linear least squares method. Through numerical simulations, it is demonstrated that the proposed controller achieves the equivalent performances to the classical nonlinear controllers with less total energy consumption. Moreover, it generates the practical control solution, in other words, control solutions do not violate the input-constraints.

Ferroelectric Properties of $(Pb_{0.9}Ca_{0.1})TiO_3$ Thin Films by Sol-Gel Processing (졸-겔법에 의한 $(Pb_{0.9}Ca_{0.1})TiO_3$ 박막의 강유전 특성)

  • Kim, Haeng-Koo;Chung, Su-Tae;Lee, Jong-Hyun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.2
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    • pp.138-145
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    • 1998
  • The $(Pb_{0.9}Ca_{0.1})TiO_3$[PCT] thin films have been deposited by sol-gel processing on Si-wafer and ITO glass substrates. The creak-free films have been obtained by rapid thermal annealing at $700^{\circ}C$ for 10 minute and characterized by XRD, SEM and electrical measurements. Their tetragonality c/a was 1.041 and grain size was $0.15{\sim}0.2{\mu}m$. When the electrode system of sample was Au/PCT/ITO(MFM) and film thickness was $0.8{\mu}m$, dielectric constant, dielectric loss and Curie temperature were about 149, 0.085 and $449^{\circ}C$ at 10kHz, respectively. Spontaneous polarization $P_s$, remnant polarization $P_r$ and coercive field $E_c$ were about $5.29{\mu}C/cm^2$, $4.15{\mu}C/cm^2$ and 82kV/cm calculated by hysteresis loop.

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Preparation of Ferroelectric PZT Thin Film by Sol-Gel Processing; (III) Effect of Rapid Thermal Annealing on Microstructures and Dielectric Properties (솔-젤법에 의한 강유전성 PZT 박막의 제조;(III) 급속열처리방법이 미세구조 및 유전특성에 미치는 영향)

  • 김병호;박성호;김병호
    • Journal of the Korean Ceramic Society
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    • v.32 no.8
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    • pp.881-892
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    • 1995
  • Sol-Gel derived ferroelectric PZT thin films were fabricated on ITO/Glass substrate. Two kinds of rapid thermal annealing methods, R-I (six times of intermediate and final annealing) and R-II (one final annealing after six times of intermediate annealing) were used for preparation of multi-coated PZT thin films. 2500$\AA$-thick PZT thin films were obtained by the R-I and R-II methods and characterized by microstructure and dielectric properties. In case of using R-II, the microstructure was finer than that of R-I and there was no distinguishable difference in dielectric properties of PZT thin films between the R-I and R-II methods. But dielectric properties were enhanced by increasing perovskite phase fraction with increasing annealing temperature. Measured dielectric constant of PZT thin film annealed at 62$0^{\circ}C$ using the R-I method was 256 at 1kHz. Its remanant polarization (Pr) and coercive field (Ec) were 14.4$\mu$C/$\textrm{cm}^2$ and 64kV/cm, respectively.

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A Study on Rapid Fabrication of Micro Lens Array using 355nm UV Laser Irradiation (355nm UV 레이저를 이용한 마이크로 렌즈 어레이 쾌속 제작에 관한 연구)

  • Je, S.K.;Park, S.H.;Choi, C.K.;Shin, B.S.
    • Transactions of Materials Processing
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    • v.18 no.4
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    • pp.310-316
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    • 2009
  • Micro lens array(MLA) is widely used in information technology(IT) industry fields for various applications such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method having the processes of micro etching, electroplating, micro machining and laser local heating. Laser thermal relaxation method is introduced in marking of microdots on the surface of densified glass. In this paper, we have proposed a new direct fabrication process using UV laser local thermal-expansion(UV-LLTE) and investigated the optimal processing conditions of MLA on the surface of negative photo-resist material. We have also studied the 3D shape of the micro lens obtained by UV laser irradiation and the optimal process conditions. And then, we made chrome mold by electroplating. After that, we made MLA using chrome mold by hot embossing processing. Finally, we have measured the opto-physical properties of micro lens and then have also tested the possibility of MLA applications.