• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.35-43
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• 1995

To obtain high quality of $Ta_{2}O_{5}$ film, two dielectric layers of $Si_{3}N_{4}$ and $Ta_{2}O_{5}$ were subsequently formed on Si wafer. Silicon nitride films were thermally grown in 10 Torr ammonia ambient by R.F induced heating system. The thickness of thermally grown $Si_{3}N_{4}$ film was able to be controlled in the range of tens $\AA$ due to the self-limited growth property. $Ta_{2}O_{5}$ film of 200$\AA$ thickness was then deposited on the as-grown $Si_{3}N_{4}$ film about 25$\AA$ thickness by sputtering method and annealed at $900^{\circ}C$in $O_{2}$ ambient for 1hr. Stoichiometry film was prepared by the annealing in oxygen ambient. Despite the high temperature anneal process, silicon oxide layer was not grown at the interface of the layered films because of the oxidation barrier effect of Si$_{3}$N$_{4}$ film. The fabricated $Ta_{2}O_{5}$/$Si_{3}N_{4}$ film showed low leakage current less than several nA and high dielectric breakdown strength.

• Journal of Sensor Science and Technology
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• v.14 no.1
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• pp.52-55
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• 2005

Ni oxide thin films with thermal sensitivity superior to Pt and Ni thin films were formed through annealing treatment after Ni thin films were deposited by a r.f. magnetron sputtering method. Resistivity values of Ni oxide thin films were in the range of $10.5{\mu}{\Omega}cm$ to $2.84{\times}10^{4}{\mu}{\Omega}cm$ according to the degree of Ni oxidation. Also temperature coefficient of resistance(TCR) values of Ni oxide thin films depended on the degree of Ni oxidation from 2,188 ppm/$^{\circ}C$ to 5,630 ppm/$^{\circ}C$ in the temperature range of $0{\sim}150^{\circ}C$. Because of the high linear TCR and resistivity characteristics, Ni oxide thin films exhibit much higher sensitivity to flow and temperature changes than pure Ni thin films and Pt thin films.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.56-56
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• 2003

최근 정보통신 분야의 급격한 발달로 인하여 무선통신에 사용되는 주파수 영역 또한 계속 높아짐에 따라 대역통과 필터 소자의 삽입 손실, 소비 전력, 크기, MMIC화에 대한 많은 연구가 진행되고 있다 압전 현상을 이용한 박막형 공진기가 이러한 요구를 충족시키고, 현재의 SAW filter를 대체할 소자로 떠오르고 있다. 본 실험에서는 단결정 미세 구조를 만들 수 있고, 압전 효과 또한 우수하며, Surface Micromachining보다 비교적 제조 공정이 간단하고 선택적 에칭이 가능한 Bulk Micromachining을 이용하여 Si$_3$N$_4$ Membrane을 이용한 중심주파수 5.2GHz인 두께 진동모드 Film Bulk Acoustic Wave Resonator(FBAR)를 제작하고 공진기의 고주파 특성을 평가하였다. Membrane구조 형성을 위해 Backside면인 Si$_3$N$_4$, Si은 RIE(Reactive Ion Etching)와 선택적 에칭용액인 KOH로 각각 에칭하여 Membrane을 갖는 구조로 중심주파수 5.2GHz인 두께 진동모드 FBAR를 설계 및 제조하였다. 체적 탄성파 공진 현상은 r.f Magnetron Sputtering법으로 증착한 AIN 압전박막과 Mo전극으로부터 발생 가능하였다. 본 연구에서는 0.9$\mu\textrm{m}$-Si$_3$N$_4$ Membrane을 이용해 FBAR를 제작/평가하고, RIE을 통해 Membrane을 제거해 가면서 공진기의 특성 즉, Quality factor와 유효전기기계결합계수(K$_{eff}$) 및 S parameter특성을 비교 측정해 보았다. 측정해본 결과 Membrane Free일때가 훨씬더 공진 특성이 우수함을 볼 수 있다

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1352-1353
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• 2008

In this study, aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET(polyethylen terephthalate) substrate by r.f. magnetron sputtering method. PET substrate was surface-treated in an atmospheric pressure DBD(dielectric barrier discharge) plasma to increase deposition rate and to improve electrical propesties. Morphological changes by DBD plasma were obsered using contact angle measurement. The contact angle of water on PET was reduced from 62$^{\circ}$ to 42$^{\circ}$ by DBD plasma surface treatment. The plasma treatment also increased deposition rate and electrical propesties. The electrical resistivity as low as $4.97{\times}10^{-3}[{\Omega}-cm]$ and the deposition rate of 234[${\AA}$-m/min] were obtained in ZnO:Al film with surface treatment time of 5min, and 20min., respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.460-463
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• 2000

The current-voltage characteristics of the sandwich system at different annealing temperatures and different bias voltages have been studied. In order to prepare the Al/V$O_X$/Al sandwich devices structure, thin films of vanadium oxide(V$O_X$) was deposited by r.f. magnetron sputtering from $V_2$$O_5$ target in 10% gas mixture of argon and oxygen, and annealed during lhour at different temperatures in vacuum. Crystall structure, surface morphology, and thickness of films were characterized through XRD, SEM and I-V characteristics were measured by electrometer. The films prepared below 20$0^{\circ}C$ were amorphous, and those prepared above 300 $^{\circ}C$were polycrystalline. At low fields electron injected to conduction band of vanadium oxide and formed space charge, current was limited by trap. Conduction mechanism at mid fields due to Schottky emission, while at high fields it changed to Fowler-Nordheim tunneling effects.

• Journal of the Korean Ceramic Society
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• v.37 no.8
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• pp.731-738
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• 2000

KLN(K3Li2Nb5O15) has attracted a great deal of attention for their potential usefulness in piezoelectric, electro-optic, nonlinear optic, and pyroelectirc devices. Especially, the KLN single crystal has been studied in the field of optics and electronics. However it is hard to produce good quality single crystals due to the crack propagation during crystal growing. One of the solutions of this problem is prepartion of thin film. But the intensive study has not been conducted so far. In this study, after the KLN thin film were prepared by R.F. magnetron Sputtering method on SiO2/Si substrate, the post-annealing methods of RTA(rapid thermal annealin) and IPA(insitu post annealing) were employed. The deposition condition of KLN thin film was RF power(100 W), Working pressure(100 mtorr). The commonness of both RAT and IPA was that the higher were deposition and post annealing temperature, the higher was the intensity of XRD but the less surface roughness. The difference of post-annealing methods affected XRD phase and surface condition very much. And in IPA process, the influence of O2 had much effect on the formation of KLN phase.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.12-12
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• 2000

This paper investigated the effect of the film deposition rate for $CrN_x$ microstructure and mechanical properties. For these purpose, pure Cr an stoichiometric CrN films were deposited with various target power density on Si hardened M2 tool steel. The variation of ni trogen concentration in $CrN_x$ f analyzed by AES and deposition rate was calculated by measuring of thickness using ${\alpha}-step$ profilometer. The microstructure was analyzed by X-Ray Diffract and Scanning Electron Microscopy(SEM), and mechanical properties were evalua residual stress, microhardness and adhesion tests. Deposition rate of Cr and CrN increased as an almost linear function of target power density from $0.25\mu\textrm{m}/min$ and $0.15\mu\textrm{m}/min$ to $0.43\mu\textrm{m}/min$. Residual stresses of Cr and CrN films were from tensi Ie to compressive stress with an increase of deposi tion rate a compressive stresses were increased as more augmentation of deposition r maximum hardness value of $2300kg/\textrm{mm}^2$ and the best adhesion strength correspond HF 1 were obtained for CrN film synthesized at the highest target densitY($13.2W/\textrm{mm}^2$) owing to high residual compressive stress and increasing mobility.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1440-1441
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• 2006

In this study, we synthesized CNTs(carbon nanotubes) on the glass substrate by microwave plasma enhanced chemical vapor deposition (MPECVD), Effect of bias voltage on the grown behavior and morphology of CNTs were investigated. Recently, it has been proposed that aligned CNTs can also be achieved by the application of electric bias to the substrate during growth, the first time reported the bias effect such that the nanotube alignment occurred only when a positive bias was applied to the substrate whereas no aligned growth occurred under a negative bias and no tube growth was observed without bias. On the country, several researchers reported some different observations that aligned nanotubes could also be grown under negative substrate biases. This discrepancy as for the effect of positive and negative bias may indicate that the bias effect is not fully understood yet. The glass and Si wafers were first deposited with TiN buffer layer by r.f sputtering method, and then Ni catalyst same method, The thickness of TiN and Ni layer were 200 nm and 60 nm, respectively. The main process parameters include the substrate bias (0 to - 300 V), and deposition pressure (8 to 20 torr).

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.228-230
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• 1994

A Spotter ion Plating(SIP) system with a r. f. coil electrode and the Facing Target Sputter(FTS) source was designed for high-quality thin film formation. The rf discharge was combined with DC facing target sputtering in order to enhance ionization degree of a sputtered atoms. The discharge voltage-discharge characteristics curves of a FTS source could be characterized by the fern of $I{\propto}V^n$ with n in the range of $8{\sim}12$. The energy of ions incident on the substrate depended on the sheath potential of DC biased substrate. The mean impact ion energy increased with negative bias voltage and rf power. The adhesive force of the TiN film formed was in the range of $30{\sim}50N$, and markedly influenced by substrate bias voltage.

• Journal of the Korean institute of surface engineering
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• v.32 no.1
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• pp.61-66
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• 1999

The Spin-dependent tunneling magnetoresistance (TMR) effect was observed in $NiFe/Al_2O_3$/Co thin films. The samples were prepared by magnetron sputtering in a system with a base pressure of $3\times10^{-6}$Torr. the insulating $Al_2O_3$layer was prepared by r.f. plasma oxydation method of a metallic Al layer. The ferromagnetic and insulating layers were deposited through metallic masks to produce the cross pattern form. The junction has an active area of $0.3\times0.3\textrm{mm}^2$ and the $Al_2O_3$layer is deposited through a circular mask with a diameter of 1mm. It is very important that insulating layer is formed very thinly and uniformly in tunneling junction. The ferromagnetic layer was fabricated in optimum conditions and the surface of that was very flat, which was observed by AFM. Tunneling junction was confirmed through nonlinear I-V curve. $NiFe/Al_2O_3$/Co junction was observed for magnetization behavior and magnetoresistance property and magnetoresistance property is dependent on magnetization behavior and magnetoresistance property and magnetoresistance property is dependent on magnetization behavior of t재 ferromagnetic layer. The maximum magnetoresistance ratio was about 6.5%.