• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.837-838
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• 2009

In this work, pyromellitic dianhydride (PMDA) was used as a cathode interfacial layer in the organic light emitting diodes (OLEDs) and its thickness was optimized. Various electrical and optical characterizations of the OLEDs having various thicknesses of the PMDA cathode interfacial layer revealed that the best OLED performance could be achieved by using 0.5 nm-thick PMDA layer compared to the control device without any interfacial layer.

• Polymer(Korea)
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• v.39 no.2
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• pp.275-280
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• 2015

Two series of copolyimides (Co-PIs) were prepared by reacting 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 1,2,4,5-benzentetra carboxylic dianhydride (pyromellitic dianhydride) (PMDA), as dianhydrides based on 4,4'-biphthalic anhydride (BPA) and 2,2'-bis(trifluoromethyl)benzidine (TFB) by using thermal- and chemical imidizations. Co-PIs films with different dianhydride monomer compositions were compared in terms of their thermal properties and optical transparencies. The addition of PMDA was more effective than the addition of 6FDA for improving the thermal properties. Meanwhile, 6FDA is more effective in optical transparencies.

• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.217-222
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• 2006

Polyimides have been investigated extensively and used widely over the past three decades because of their high performance properties such as excellent thermal, mechanical, and electrical properties. Polyimides are difficult to be processed because of the aromatic moieties, imide group, and insoluble nature in most organic solvents. The soluble polyimides were synthesized from 2,2,-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAPAF) and 3,3,-diamino-4,4-dihydroxybyphenyl (HAB) as aromatic diamines and 4,4-(hexafluoroisopropylidene)diphthalic dianhydride (6FDA), pyromellitic dianhydride (PMDA), 4,4-oxydiphthalic dianhydride (OPDA), 3,3,4,4-benzophenone tetracarboxylic dianhydride (BTDA) and 3,3,4,4-diphenylsulfone tetracarboxylic dianhydride (DSDA) as aromatic dianhydrides. The polyimides were characterized by NMR, FR-IR, TGA and the dielectric constant of the obtained polyimides was calculated from storage of electro-capacity. A novel photosensitive polyimide was synthesized by the reaction of polyimide, containing hydroxyl group and methacryloyl chloride using triethylamine. The good micro-pattern was obtained with photosensitive polyimide from the photolithographic technique.

• Rapid Communication in Photoscience
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• v.1 no.2
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• pp.27-29
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• 2012

Noble diamine monomers containing thiophene moiety were prepared, such as 2,5'''-diamino-2, 2':5', 2'':5'', 2'''-quaterthiophene (4TDA) and 2, 5'''''-diamino-3'', 4'''-dihexyl-2,2':5', 2'':5'', 2''':5''', 2'''':5'''', 2'''''-sexithiophene (6TDA). Then, these monomers were utilized to prepare polyimides with 3,6-diphenylpromellitic dianhydride (DPPMDA), 3,6-di(4'-trifluoro-methylphenyl) pyromellitic dianhydride (6FPMDA) or 3,6-di(3',5'-bis (trifluoromethyl)phenyl) pyromellitic dianhydride (12FPMDA) via a conventional two-step process. The polyimides were characterized by FT-IR, TGA and DSC, and then subjected CV, UV-vis and PL measurements. The polyimides containing thiophene moiety exhibited high glass transition temperatures ($280{\sim}310^{\circ}C$) and excellent thermal stability (> $420^{\circ}C$) in air as well as green emission (535~586 nm).

• Fibers and Polymers
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• v.5 no.2
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• pp.83-88
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• 2004

In order to assess the potential of the hydroxy-containing polyamic acid (PHAA) synthesized from 3,3'-dihydroxy benzidine and pyromellitic dianhydride for a fire-safe polymer, the cyclization pathway of PHAA has been investigated using a model compound prepared from 2-aminophenol and phthalic anhydride. The reaction was monitored. by $^1{H-nuclear}$ magnetic resonance. N-(2-hydroxyphenyl) phthalamic acid is converted to N-(2-hydroxyphenyl) phthalimide at ca. 175$^{\circ}C$, showing endothermic reaction. The imide structure is rearranged to the benzoxazole structure over ca. $400^{\circ}C$. These results are similar with that of PHAA. According to pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS) data, water and carbon dioxide are released during the cyclization and rearrangement reaction. One DMAc molecule is complexed with one carboxyl acid group in PHAA, which accelerates the imidization process to release more easily the flame retardant, water.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.50-55
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• 2016

Aromatic diamines containing hexafluoroisopropylidene and ester moiety were synthesized from 4,4'-hexafluoroisopropylidene diphenol and nitrobenzoyl chloride. The reaction of aromatic diamines with hexafluoroisopropylidene phthalicdianhydride (6FDA) or pyromellitic dianhydride (PMDA) gave four kinds of poly(amic acid)s. Their inherent viscosities ranged from 0.196 to 0.346 dL/g. Poly(amic acid)s were converted to polyimides by thermal imidization. The glass transition temperatures ($T_g$) of polyimides were between 241 and $289^{\circ}C$. The 5% weight loss temperatures were recorded in the range of $430{\sim}492^{\circ}C$. The tensile strength of polyimide films were measured as 29.84~64.38 MPa.

• Journal of the Korean Chemical Society
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• v.31 no.6
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• pp.590-600
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• 1987

Silicone-containing polyamide-imides were prepared from bis(p-chlorocarbonylphenyl)diphenylsilane (BCCDPS), pyromellitic dianhydride(PMDA) and diamines. The thermal characteristics of the above polymers had been carefully studied using a thermogravimetric analyzer. The thermal stability of polymer was decreased with increasing contents of bis(p-carbonylphenyl)diphenylsilane units(BCDPS). The effect of diamine on thermal stability of polymer led benzidine > m-phenylenediamine> 4,4'-diaminodiphenyl ether > 4,4'-diaminodiphenyl sulfone. The activation energy of degradation of polymer obtained by Friedman method increased as the contents of BCDPS in the polymer decreased. The degradation temperature of polymers generally increased as the activation energy increased. The solubility of polymer increased as the content of BCDPS increased except polymers prepared with benzidine.

• Textile Coloration and Finishing
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• v.8 no.2
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• pp.43-48
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• 1996

Condensation type aromatic polyimides were synthesized in DMF solvent by two step low temperature solution polymerization. By employing monomers as p-phenylene 3diamine and 3 kinds of dianhydrides such as pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride and trimellitic anhydride chloride, poly(amic acid) precursors were sythesized. These reactions were exothermic and very fast. When synthesized poly(amic acid)s were dissolved in DMF solvent and stood long time, the polymers were hydrolyzed and their degradation reactions were accelerated as the solution concentrations were dilute. Also, when water is added there-to the degradation rates were accelerated 8faster. In addition, in a very dilute solution state, the reduction viscosity is greatly increased to show properties of conventional polyelectrolytes. This also showed properties sensitive to the concentration change as carboxyl groups per unit segment are increased.

• Polymer(Korea)
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• v.36 no.3
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• pp.275-280
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• 2012

Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride (BPDA) and $p$-phenylenediamine ($p$-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4-component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Journal of the Korean Ceramic Society
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• v.39 no.11
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• pp.1063-1068
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• 2002

Polyimide/silica(PI/silica) hybrid materials having physical or chemical bonds between the PI and silica network were prepared using sol-gel process through hydrolysis and polycondensation of tetraethoxysilane with the polyamic Acid(PAA) or end-capped PAA solution. PAA solution was synthesized by ring opening reaction of pyromellitic dianhydride and oxydianiline monomers in dimethyl acetamide solution. End-capped PAA solution was synthesized by the addition of 3-aminopropyltriethoxysilane in PAA solution. PI/silica hybrid samples were characterized by infrared spectroscopy, differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, and tensile tester. It has been demonstrated that the properties of hybrid samples were affected by the silica content and the bond type between PI and silica.