• Title/Summary/Keyword: pure copper

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Recovery of Copper Powder from MoO3 Leaching Solution (MoO3 침출공정 폐액으로부터 동분말의 회수기술)

  • Hong, Hyun-Seon;Jung, Hang-Chul;Kim, Geun-Hong;Kong, Man-Sik
    • Journal of Powder Materials
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    • v.16 no.5
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    • pp.351-357
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    • 2009
  • A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO$_3$ leaching process. The first step consisted of replacing noble copper ions with external Fe$^{3+}$ ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 1$\sim$2$\mu$m in size.

보성치과주조용합금의 생체반응에 관한 실험적연구

  • Kim, In-Cheol
    • The Journal of the Korean dental association
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    • v.14 no.5
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    • pp.425-427
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    • 1976
  • The author observed the reaction of gingval tissues which were implanted with gold, Bosung alloy and copper, the constituents of gold alloy. Pure gold and bosung alloy strips produced slight inflammation but copper had sovere inflammation. Dense fibrous fascile were formed around the gold and Bosung alloy strips on 7th day. When gold and Bosung alloy strips were implanted, eptithelial memberane were occured on 14th day, but copper strips produced eplthelial memberane on 21th day.

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Single Walled Carbon Nanotubes-Reinforced Metal Matrix Composite Materials Fabricated by Spark Plasma Sintering (방전플라즈마 소결공정으로 제조된 단일벽탄소나노튜브 강화 금속기지 복합재료)

  • Kwon, Hansang
    • Journal of Power System Engineering
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    • v.21 no.4
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    • pp.94-99
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    • 2017
  • Single walled carbon nanotubes were mixed with various metal powders by mechanical ball milling and sintered by spark plasma sintering processes. Two compositional (0.1 and 1 vol%) of the single walled carbon nanotubes were dispersed onto the pure aluminum, 5052 aluminum alloy, pure titanium, Ti6Al4Vanadium alloy, pure copper, and stainless steel 316L. Each composite powders were spark plasma sintered at $600^{\circ}C$ and well synthesized regardless of the matrices. Vickers hardness of the composite materials was measured and they exhibited higher values regardless of the carbon nanotubes composition than those of the pure materials. Moreover, single walled carbon nanotubes reinforced copper matrix composites showed highest enhancement between the other metal matrices system. We believe that low energy mechanical ball milling and spark plasma sintering processes are useful tool for fabricating of the carbon nanotubes-reinforced various metal matrices composite materials. The single walled carbon nanotubes-reinforced various metal matrices composite materials could be used as an engineering parts in many kind of industrial fields such as aviation, transportation and electro technologies etc. However, detail strengthening mechanism should be carefully investigated.

A Study on Thermal Properties of Ethylene Glycol Containing Copper Oxide Nanoparticles (산화구리 나노분말을 포함하는 에틸렌글리콜 용액의 열전특성에 관한 연구)

  • Kim, Chang-Kyu;Lee, Gyoung-Ja;Rhee, Chang-Kyu
    • Journal of Powder Materials
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    • v.17 no.4
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    • pp.276-280
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    • 2010
  • In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

Metal Flow and Interface Bonding of Copper Clad Aluminum Rods by the Direct Extrusion (직접압출에 의한 Cu-Al 층상 복합재료 봉의 금속유동과 계면접합)

  • Yun, Yeo-Kwon;Kim, Hee-Nam
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.6
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    • pp.166-173
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    • 2001
  • Composite materials consists of two or more different material layers. The usefulness of clad metal rods forms the possibilities of combination of properties of different metals. Copper clad aluminum composite materials are being used for economic and structural purpose. In this study, composite billet consists of commercially pure copper and aluminum(A6061) and experimental conditions consist of the combinations of clad thickness, extrusion ratio, and semi-cone angle of die. In order to investigate the influence of these parameters on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with various extrusion temperatures, extrusion ratios, semi-cone angles of die, and composition rate of Cu:Al.

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Effect of the Friction Characteristics of Sliding Contacts on Electrical Signal Transmission

  • Jang, Ho;Park, Hyung Kyu
    • KSTLE International Journal
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    • v.2 no.1
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    • pp.22-28
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    • 2001
  • A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.

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Effects of Post-deposition Annealing on the Copper Films Electrodeposited on the ECR Plasma Cleaned Copper Seed Layer (ECR plasma로 전처리된 Cu seed층 위에 전해도금 된 Cu 막에 대한 Annealing의 효과)

  • Lee, Han-seung;Kwon, Duk-ryel;Park, Hyun-ah;Lee, Chong-mu
    • Korean Journal of Materials Research
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    • v.13 no.3
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    • pp.174-179
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    • 2003
  • Thin copper films were grown by electrodeposition on copper seed layers which were grown by sputtering of an ultra-pure copper target on tantalum nitride-coated silicon wafers and subsequently, cleaned in ECR plasma. The copper films were then subjected to ⅰ) vacuum annealing, ⅱ) rapid thermal annealing (RTA) and ⅲ) rapid thermal nitriding (RTN) at various temperatures over different periods of time. XRD, SEM, AFM and resistivity measurements were done to ascertain the optimum heat treatment condition for obtaining film with minimum resistivity, predominantly (111)-oriented and smoother surface morphology. The as-deposited film has a resistivity of ∼6.3 $\mu$$\Omega$-cm and a relatively small intensity ratio of (111) and (200) peaks. With heat treatment, the resistivity decreases and the (111) peak becomes dominant, along with improved smoothness of the copper film. The optimum condition (with a resistivity of 1.98 $\mu$$\Omega$-cm) is suggested as the rapid thermal nitriding at 400oC for 120 sec.

Preparation of Phase Pure Cuprate Superconductors via The Modification of Sol-Gel Method

  • Ahn, Beom-Shu
    • Journal of the Korean Applied Science and Technology
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    • v.17 no.2
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    • pp.144-148
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    • 2000
  • A modification of the sol-gel method to obtain phase pure superconducting oxides is described. The method starts from organic salts of yttrium, barium and copper, such as acetates, and avoids the sudden and uncontrollable decomposition of the organic fraction which occurs if nitrates are used as starting materials. The aqueous solution obtained with citric acid in an alkaline medium is concentrated under vacuum. The solid so prepared is decomposed at about $300^{\circ}C$ thus giving an oxide precursor containing well dispersed yttrium, barium and copper. Pyrolysis at 850 - $920^{\circ}C$ followed by oxygen annealing gives the superconducting orthorhombic 123 phase. The results of TGA/DTA of the precursor, as well as XRD, electrical and magnetic property measurements on the pyrolysis products are presented and discussed.

Densification Behavior of Dissimilar Material Powder during Die Compaction (금형압축 하에서 구리/철 이종재료 분말의 치밀화 거동)

  • Kim, Taek-Eui;Lee, Sung-Chul;Kim, Ki-Tae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.5
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    • pp.379-386
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    • 2008
  • Densification behavior of dissimilar material powder (copper and pure iron powder) under die compaction was investigated. Experimental data were obtained for copper and pure iron powder compacts with various volume ratios under die compaction. Dissimilar material powder was simultaneously compacted into a jointed cylindrical compact with different powder materials in inner and outer part, respectively. To simulate densification behavior of dissimilar material powder, elastoplastic constitutive equation proposed by Shima and Oyane was implemented into a finite element program (ABAQUS) under die compaction. Finite element results were compared with experimental data for densification, deformed geometry and density distribution of powder compacts under die compaction.

A Physically Based Dynamic Recrystallization Model for Predicting High Temperature Flow Stress (열간 유동응력 예측을 위한 물리식 기반 동적 재결정 모델)

  • Lee, H.W.;Kang, S.H.;Lee, Y.S.
    • Transactions of Materials Processing
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    • v.22 no.8
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    • pp.450-455
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    • 2013
  • In the current study, a new dynamic recrystallization model for predicting high temperature flow stress is developed based on a physical model and the mean field theory. In the model, the grain aggregate is assumed as a representative volume element to describe dynamic recrystallization. The flow stress and microstructure during dynamic recrystallization were calculated using three sub-models for work hardening, for nucleation and for growth. In the case of work hardening, a single parameter dislocation density model was used to calculate change of dislocation density and stress in the grains. For modeling nucleation, the nucleation criterion developed was based on the grain boundary bulge mechanism and a constant nucleation rate was assumed. Conventional rate theory was used for describing growth. The flow stress behavior of pure copper was investigated using the model and compared with experimental findings. Simulated results by cellular automata were used for validating the model.