• Biotechnology and Bioprocess Engineering:BBE
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• 제4권1호
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• pp.46-50
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• 1999

The application of pulsed electric field was investigated in the crossflow ultrafiltration of BSA (bovine serum albumn) to economize the application time of electric current as well as to avoid inherent problems of long-term application of electric field. During the application of various cyclic patterns of pulsed electric current, the averaged filtration flowrate and the degree of concentration were maintained higher than those obtained in the absence of electric current application. The temperature increase, pH change, and BSA loss by electrodeposition were all negligible during the operation. The averaged filtration flowrate increased as the ON/OFF duration ratio of electric current was higher and as the period of ON/OFF cycle was shorter. The re-establishment of concentration polarization was dependent to the duration of current OFF state and, therefore, a longer duration of OFF state was not favorable in maintaining higher filtration flow rate. Although the averaged filtration flowrate was enhanced as the magnitude of electric current increased, the flowrate enhancement became smaller as the magnitude of current value above which the degree of electrokinetic depolarization is no further improved.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.178-179
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• 2014

In this study, $Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electrodeposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano particles. The structure and microstructure ofcoatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on microstructure, microhardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.171-172
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• 2015

$Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electro-deposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano-particles. The structure and micro-structure of coatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on micro-structure, micro-hardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• 한국표면공학회지
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• 제27권5호
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• 전기화학회지
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• 제12권3호
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• pp.276-281
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• 2009

본 연구는 고온화학공정에 사용할 전기화학적 센서 기술 개발의 사전 연구로서 고온 LiCl-KCl 공융염에 $UCl_3$나 $GdCl_3$를 녹여 $U^{3+}$와 $Gd^{3+}$의 전기화학 반응을 조사하였다. $U^{3+}$는 고온 LiCl-KCl 용융염내에서 -0.2V/-0.35 V에서 $U^{4+}$로의 산화/환원반응의, -1.51 V/-1.35 V에서 전착/해리 반응전류의 피크를 나타내었다. $Gd^{3+}$의 경우 -2.15 V에서 전착반응 피크를, -1.9 V에서 산화해리전류 피크를 나타내었다. $U^{3+}$와 $Gd^{3+}$의 혼합 고온 용융염에서는 $Gd^{3+}$의 전착 피크가 양의 전위로 이동하였다. 일정전류법의 결과는 시간이 지남에 따라 전위값이 일정해졌으며 그 전위값은 전해질 내 반응물의 환원전위값과 일치하였다. 노멀펄스전위법과 직각파전위법은 두 원소의 정성분석을 위한 좋은 전기화학적 방법론임을 보였으며 특히 노멀펄스전위곡선을 미분한 결과는 사용된 다른 방법에 비해 반응전류의 피크분리가 잘 일어났다.

• 한국정보통신학회논문지
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• 제10권9호
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• pp.1663-1670
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• 2006

펄스 전기증착법에 의해 단결정 Fe 박막을 n-Si(111) 기판위에 직접 성장시켰다. CV 분석 을 통해 $Fe^{2+}n-Si(111)$ 계면은 쇼트키 장벽 형성에 따른 다이오드 특성을 가진다는 사실을 알 수 있었다. 또한 인가 전압에 따른 전기용량의 변화를 보여주는 Mott-Schottky chottky(MS) 관계식을 이용하여 전해질 내에서 n-Si(111) 기판의 flat-band potential(EFB)을 조사하였으며, 0.1M $FeCl_2$ 전해질 내에서 EFB와 산화-환원 전위는 각각 -0.526V 과 -0.316V 임을 알 수 있었다. Fe/n-Si(111) 계면반응 시, Fe 증착 초기 단계에서의 핵 형성과 성장 운동학은 과도전류 특성을 이용하여 조사하였으며, 과도전류 특성을 통해 Fe 박막의 성장모드는 "instantaneous nucleation and 3-dimensional diffusion limited growth"임을 알 수 있었다. 주파수가 300Hz, 최대 전압이 1.4V인 펄스 전압을 이용하여 n-Si(111) 기판위에 Fe를 직접 전기 증착 시켰으며, 형 성 된 Fe 박막은 단결정 ${\alpha}-Fe$로 Si 기판위에 ${\alpha}-Fe(110)/Si(111)$의 격자 정합성을 가지고 성장하였음을 XRD 분석을 통해 확인하였다.