• 제목/요약/키워드: process temperature

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변형률속도를 고려한 상온 나노임프린트 공정의 유한요소해석 (Finite Element Analysis of the Room Temperature Nanoimprint Lithography Process with Rate-Dependent Plasticity)

  • 송정한;김승호;;허훈
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.63-66
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    • 2005
  • Nanoimprint lithography (NIL) process at room temperature has been newly proposed in recent years to overcome the shape accuracy and sticking problem induced in a conventional NIL process. Success of the room temperature NIL relies on the accurate understand of the mechanical behavior of the polymer. Since a conventional NIL process has to heat a polymer above the glass transition temperature to deform the physical shape of the polymer with a mold pattern, viscoelastic property of polymer have major effect on the NIL process. However, rate dependent behavior of polymer is important in the room temperature NIL process because a mold with engraved patterns is rapidly pressed onto a substrate coated with the polymer by the hydraulic equipment. In this paper, finite element analysis of the room temperature NIL process is performed with considering the strain rate dependent behavior of the polymer. The analyses with the variation of imprinting speed and imprinting pattern are carried out in order to investigate the effect of such process parameters on the room temperature NIL process. The analyses results show that the deformed shape and imprint force is quite different with the variation of punch speed because the dynamic behavior of the polymer is considered with the rate dependent plasticity model. The results provide a guideline for the determination of process conditions in the room temperature NIL process.

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목재건조(木材乾燥)의 자동화(自動化)에 관한 연구(硏究)(I) -연속온도상승(連續溫度上昇)스케쥴을 이용한 목재건조장치(木材乾燥裝置) 자동화(自動化)- (Automation of Lumber Drying System(I) -Continuously Rising Temperature Drying of Pinus densiflora-)

  • 이형우
    • Journal of the Korean Wood Science and Technology
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    • 제22권1호
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    • pp.12-19
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    • 1994
  • An electrically heated experimental lumber dry kiln was retrofitted with a computer-based control system to control kiln conditions more precisely and monitor and record several kiln variables. Flat-sawn 2.5cm-thick Pinus densiflora boards were dried in constant temperature process(65$^{\circ}C$ & 50~60 %RH) and continuously rising temperature process, respectively. The average drying rate in continuously rising temperature process was 5.7 %/hr, which was above 3 times faster than that in constant temperature process. But, the average rate of case-hardening and moisture difference between shells and cores of boards dried in continuously rising temperature process were 82 % and 5.5 %, respectively, which were much larger than those of boards dried in constant temperature process.

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Heat source control intelligent system for heat treatment process

  • Lee, JeongHoon;Cho, InHee
    • International journal of advanced smart convergence
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    • 제11권4호
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    • pp.28-40
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    • 2022
  • Although precise temperature control in the heat treatment process is a key factor in process reliability, there are many cases where there is no separate heat source control optimization system in the field. To solve this problem, the program monitors the temperature data according to the heat source change through sensor communication in a recursive method based on multiple variables that affect the process, and the target heat source value and the actual heat treatment heat source to match the internal air temperature and material temperature. A control optimization system was constructed. Through this study, the error rate between the target temperature and the atmosphere (material surface) temperature of around 10.7% with the existing heat source control method was improved to an improved result of around 0.1% using a process optimization algorithm and system.

유한요소해석을 이용한 Mg 합금 판재 성형 공정 변수 분석 (FEM analysis for process variables in sheet metal forming for Mg alloy)

  • 이영선;권용남;이정환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.1082-1086
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    • 2004
  • Since the sheet forming of Mg alloy has many difficulties due to the low formability, many forming conditions need to be selected properly. Especially, the process variables should be investigated to increase the formability, such as, forming temperature. In this paper, the effects of forming process variables has been investigated using the bending and deep drawing process. A simple U-bending designed for mobile part could be formed in room temperature and springback amounts are surveyed. On the other hand, square cup part couldn't be formed in room temperature due to the low formability. Therefore, the effects of forming temperature are investigated in deep drawing process for square cup part. As a experimental and FEM results, the optimum forming temperature is presence and formability in a higher temperature is less than that of lower temperature. Above experimental results are compared with the FEM analysis and well coincided with the experimental results. Therefore, more detail investigations could be progressed to select more appropriate process conditions by the FEA.

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온도 및 공정 보상 전류 미러를 이용한 정밀한 전류 레퍼런스 (An Accurate Current Reference using Temperature and Process Compensation Current Mirror)

  • 양병도
    • 대한전자공학회논문지SD
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    • 제46권8호
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    • pp.79-85
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    • 2009
  • 본 논문에서는 온도 및 공정 보상 전류 미러(temperature and process compensation current mirror: TPC-CM)를 이용한 정밀 전류 레퍼런스를 제안하였다. 온도 변화에 영향을 받지 않는 기준 전류는 절대 온도에 비례하여 증가하는 PTAT (proportional to absolute temperature) 전류와 온도에 반비례하여 감소하는 CTAT(complementary to absolute temperature) 전류의 합으로 생성된다. 그러나 온도 계수(temperature coefficient)와 기준 전류의 크기는 공정 변화에 크게 영향을 받는다. 이런 공정 변화를 보정하기 위하여, 제안된 TPC-CM에서는 온도 계수와 기준 전류의 크기를 조절하는 두 개의 이진 가중치 전류 미러(binary weighted current mirror)를 이용하였다. 제작된 각 칩마다 PTAT 전류와 CTAT 전류를 측정한 후, 기준 전류의 크기가 온도에 상관없이 일정하도록, TPC-CM의 스위치 코드를 결정하고 그 값을 비휘발성 메모리에 저장한다. 시뮬레이션에서 TPC-CM는 공정변화 영향을 19.7%에 서 0.52%로 줄였다. 제안된 전류 레퍼런스는 3.3V 0.35um CMOS 공정을 이용하여 제작되었으며, 측정된 칩의 기준 전류 변화율은 $20^{\circ}$C${\sim}$100$^{\circ}$C에서 0.42%였다.

모듈형 퍼지-신경망을 이용한 미성형 사출제품의 최적 해결에 관한 연구 (A Study on Optimal Solution of Short Shot Using Modular Fuzzy Logic Based Neural Network (MENN))

  • 강성남;허용정;조현찬
    • 한국지능시스템학회논문지
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    • 제11권6호
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    • pp.465-469
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    • 2001
  • In injection molding short shot is one of the frequent and fatal defects. Experts of Injection molding usually adjust process conditions such as injection time, mold temperature, and melt temperature because it is most economic way in time and cost. However, it is difficult task to find appropriate process conditions for troubleshooting of short shot as injection molding process is a highly nonlinear system and process conditions are coupled. In this paper, a modular fuzzy neural network (MFNN) has been applied to injection molding process to shorten troubleshooting time of short shot. Based on melt temperature and fill time, a reasonable initial mo이 temperature is recommenced by the NFNN, and then the mold temperature is inputted to injection molding process. Depending on injection molding result, specifically the insufficient quantity of an injection molded part. and appropriate mold temperature is recommend repeatedly through the NFNN.

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고탄소강의 다단 인발 공정에서의 선재의 온도 예측 (Prediction of the wire temperature in a high carbon steel drawing process)

  • 김영식;김용철;김병민
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집A
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    • pp.821-825
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    • 2000
  • Drawing is one of the oldest metal forming operations and has major industrial significance. This process allows excellent surface finishes and closely controlled dimensions to be obtained in long products that have constant cross sections. In drawing of the high carbon steel wire, exit speeds of several hundreds meters per minute are very common. Drawing is usually conducted at room temperature using a number of passes or reductions through consequently located dies. In multi-stage drawing process like this, temperature rise in each pass affects the mechanical properties of final product such as bend, twist and tensile strength. In this paper, therefore, to estimate the wire temperature in multi-stage wire drawing process, wire temperature prediction method was mathematically proposed. Using this method, temperature rise at deformation zone as well as temperature drop between die exit and the next die inlet were calculated.

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레이저 열원을 이용한 난삭재 열처리 공정의 온도 효과에 관한 연구 (Study on Temperature Effect of Difficulty-to-Cut Material in Laser Heat Treatment Process)

  • 김동홍;정동원;이춘만
    • 한국정밀공학회지
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    • 제31권1호
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    • pp.29-33
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    • 2014
  • Recently, Difficult-to-cut materials are used in many manufacturing industry. But the difficult-to-cut materials are difficult-to-cutting process. So difficult to cut material cutting process was used after heat treatment through preheating for easy cutting process. In this study, Inconel 625 was preheating using laser heat source in computer simulation. Laser heat source temperature applied $1290^{\circ}C$ that suitable preheating temperature for Inconel 625. And temperature effects such as temperature distribution for moving heat source studied apply to similar actual process condition. Simulation results for heat treatment effects through temperature distribution verified.

Research on the copper diffusion process in germanium metal induced crystallization by different thickness and various temperature

  • Kim, Jinok;Park, Jin-Hong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.289.1-289.1
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    • 2016
  • Germanium (Ge) with higher carrier mobility and a lower crystallization temperature has been considered as the channel material of thin-film transistors for display applications. Various methods were studied for crystallizaion of poly-Ge from amorphous Ge at low temperature. Especially Metal induced crystalliazation (MIC) process was widely studied because low process cost. In this paper, we investigate copper diffusion process of different thick (70 nm, 350 nm) poly-Ge film obtained by MIC process at various temperatures (250, 300, and $350^{\circ}C$) through atomic force microscopy (AFM), Raman spectroscopy, and secondary ion mass spectroscopy (SIMS) measurement. Crystallization completeness and grain size was similar in all the conditions. Copper diffusion profile of 370 nm poly-Ge film show simirly results regardless of process temperature. However, copper diffusion profile of 70 nm poly-Ge film show different results by process temperature.

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고탄소강의 연속 건식 신선 공정에서 선재의 온도 예측 기법 개발 (Development of Wire Temperature Prediction Method in a Continuous Dry Wire Drawing Process Using the High Carbon Steel)

  • 김영식;김동환;김병민;김민안;박용민
    • 대한기계학회논문집A
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    • 제25권2호
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    • pp.330-337
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    • 2001
  • Wire drawing process of the high carbon steel with a high speed is usually conducted at room temperature using a number of passes or reductions through consequently located dies. In multi-stage drawing process, temperature rise in each pass affects the mechanical properties of final product such as bend, twist and tensile strength. Also, this temperature rise during the deformation is the reason that the wire in drawing process is broken by the embrittlement due to rapid strain aging effect. This paper presents the estimation of the wire temperature for the multi-stage wire drawing process. Using the proposed calculation method of wire temperature, temperature rise at deformation zone as well as temperature drop in block considering the heat transfer between the block and wire were calculated. As these calculated wire temperatures were applied to the real industrial fields, it was known that the calculated results were in a good agreement with the measured wire temperature.