• Proceedings of the Korea Institute of Convergence Signal Processing
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• 2003.06a
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• pp.262-267
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• 2003

At process of production according to development of accumulation degree of semi-conductor element, because functional mistake examination time required increases, is becoming big obstacle factor in cost-cutting. Studied pattern generator that generate pattern and address that is bundle enemy to process these controversial point effectively.

• Journal of the Korea Fashion and Costume Design Association
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• v.25 no.4
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• pp.45-57
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• 2023

This research compared and analyzed a representative jacket pattern making method to suggest implications for the mass customization process of clothing. Four types of pattern making methods were selected according to the degree of reflection of human body measurements. Patterns were analyzed according to the size of middle-aged women. The results of this study are as follows. First, it identified and compared the difference in human body measurement and drafting processes required for pattern drafting. Next, as a result of analyzing the manuals and institutional figures presented in the pattern drafting manuals, problems such as B.P. location and compartment of the chest circumference, which are not appropriate, were found and the human body measurement method is different for each pattern making method. Through the above analysis, the advantages and disadvantages of the pattern making methods were identified and proposed improvements and implications for the application to the apaarel mass customization process were presented.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.3
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• pp.185-192
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• 2004

Vibration table is required to obtain high packing density in expendable pattern casting process. Packing density. which is an important manufacture factor, depends on the vibration pattern induced by vibration table. In general, circular vibration pattern is recognized as the best pattern. The existing vibration table is investigated to identify current vibration pattern and consider a countermeasure. Modal test is utilized to identify the dynamic characteristics of vibration table, and finite element method is used to propose the improved design. In simulation using finite element method, the position of stiffeners is obtained to satisfy the required dynamic characteristics.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.160-165
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• 2002

Vibration table is required to obtain high packing density in expendable pattern casting process. Packing density, which is an important manufacture factor, depends on the vibration pattern induced by vibration table. In general, circular vibration pattern is recognized as the best pattern. The existing vibration table is investigated to identify current vibration pattern and consider a countermeasure. Modal test is utilized to identify the dynamic characteristics of vibration table, and finite element method is used to present the improved design.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.15-20
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• 2015

I developed a high-quality metal door with a hologram-pattern design using a high-speed electroforming process. In this study, the major processes were master production, conducting grant, nickel-sulfamate acid electroforming, ablation treatment, and final dressing. The processing system was provided with a nickel sulfamate pole, and a rotary-pole PP-plating jig in a circular tank. This approach could reduce defects and errors, as much as possible, by its use of a hologram pattern to create the master of a metal door. The thin-sheet metal-creation process for the door built-in metal pattern using electroforming with hologram was successful.

• International Journal of Precision Engineering and Manufacturing
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• v.5 no.3
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• pp.11-18
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• 2004

In this paper, the classification of artificial defects in semiconductor packages is studied by using pattern recognition technology. For this purpose, the pattern recognition algorithm includes the user made MATLAB code. And preprocess is made of the image process and self-organizing map, which is the input of the back-propagation neural network and the dimensionality reduction method, The image process steps are data acquisition, equalization, binary and edge detection. Image process and self-organizing map are compared to the preprocess method. Also the pattern recognition technology is applied to classify two kinds of defects in semiconductor packages: cracks and delaminations.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

• Journal of Korea Foundry Society
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• v.22 no.5
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• pp.265-270
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• 2002

A novel jewelry master pattern manufacturing process which reduce manufacturing steps by employing a Duraform rapid prototyping mold and a low melting alloy has been suggested. The novel process follows the steps of 'jewelry 3D CAD design ${\rightarrow}$ Durafrom RP mold ${\rightarrow}$ low melting alloy master pattern' while the previous process follows more complicated steps of 'jewelry idea sketch ${\rightarrow}$ detailed drawing ${\rightarrow}$ wax carving ${\rightarrow}$ flask ${\rightarrow}$ silver master pattern.' An upper and a lower part of molds have been manufactured of Duraform powder, of which melting point is $190^{\circ}C$. A maser pattern was manufactured by pouring a low melting alloy of Pb-Sn-Bi-Cd, so called Woods Metal, of which melting point is $70^{\circ}C$, into the mold. The master pattern is a shape of a disk of 20mm diameter that contains various design factors. The variations of dimensions, surface roughness, surface pore ratio were measured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of were maeasured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of low melting alloy has sufficient surface hardness, and surface pore ratio to be used as the jewelry master pattern.