• Title/Summary/Keyword: process equipment

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Detection of Equipment Faults at Sequencing Batch Reactor Using Dynamic Time Warping (동적시간와핑을 이용한 연속회분식 반응기의 장비고장 감지)

  • Kim, Yejin
    • Journal of Environmental Science International
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    • v.25 no.4
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    • pp.525-534
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    • 2016
  • The biological wastewater treatment plant, which uses microbial community to remove organic matter and nutrients in wastewater, is known as its nonlinear behavior and uncertainty to operate. Therefore, operation of the biological wastewater treatment process much depends on observation and knowledge of operators. The manual inspection of human operators is essential to manage the process properly, however, it is impossible to detect a fault promptly so that the process can be exposed to improper condition not securing safe effluent quality. Among various process faults, equipment malfunction is critical to maintain normal operational state. To detect equipment faults automatically, the dynamic time warping was tested using on-line oxidation-reduction potential (ORP) and dissolved oxygen (DO) profiles in a sequencing batch reactor (SBR), which is a type of wastewater treatment process. After one cycle profiles of ORP and DO were measured and stored, they were warped to the template profiles which were prepared already and the distance result, accumulated distance (D) values were calculated. If the D values were increased significantly, some kinds of faults could be detected and an alarm could be sent to the operator. By this way, it seems to be possible to make an early detecting of process faults.

Development of CTP Selection Methodology of Semiconductor Equipment Line Using AHP and Fuzzy Decision Model (AHP 및 Fuzzy 의사결정 모형을 활용한 반도체 장치라인의 CTP 선정 방법론 개발)

  • Jeong, Jaehwan;Kim, Jungseop;Kim, Yeojin;Lee, Jonghwan
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.6-13
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    • 2021
  • Cases and studies on the selection method of CTQ are relatively active, but there are few cases or studies on the selection method of CTP which is important in the device industry. In fact, many companies simply select and manage CTP from the point of contact based on their experience and intuition. The purpose of this study is to present an evaluation model and a mathematical decision model for rational and systematic CTP selection to improve the process quality of semiconductor equipment lines. In the evaluation model, AHP (Analytic Hierarchy Process) analysis technique was applied to show objective and quantitative figures, and Fuzzy decision-making model was used to solve the ambiguity and uncertainty in the decision-making process. Decision Value (DV) was presented. The subjects were 22 process factors managed in the Plating Process that the representative equipment line can do. As a result, the evaluation model proposed in this study can support more efficient and effective decision-making for process quality improvement by more objectively measuring the problem of subjective CTP selection in manufacturing sites.

Reliability Analysis Procedures for Repairable Systems and Related Case Studies (수리 가능 시스템의 신뢰성 분석 절차 및 사례 연구)

  • Lee, Sung-Hwan;Yum, Bong-Jin
    • Journal of the Korea Institute of Military Science and Technology
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    • v.9 no.2 s.25
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    • pp.51-59
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    • 2006
  • The purpose of this paper is to present reliability analysis procedures for repairable systems and apply the procedures for assessing the reliabilities of two subsystems of a specific group of military equipment based on field failure data. The mean cumulative function, M(t), the average repair rate, ARR(t), and analytic test methods are used to determine whether a failure process follows a renewal or non-renewal process. For subsystem A, the failure process turns out to follow a homogeneous Poisson process, and subsequently, its mean time between failures, availability, and the necessary number of spares are estimated. For subsystem B, the corresponding M(t) plot shows an increasing trend, indicating that its failure process follows a non-renewal process. Therefore, its M(t) is modeled as a power function of t, and a preventive maintenance policy is proposed based on the annual mean repair cost.

Implementation and Effectiveness of Smart Equipment Engineering System (스마트 설비관리시스템 구축 및 효과분석)

  • Sim, Hyun-Sik
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.3
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    • pp.121-126
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    • 2017
  • EES System support to maximize equipment efficiency by providing real-time information of main equipment which has a significant effect on product quality and productivity, and to prevent equipment failure by detecting equipment abnormality in advance. Smart Equipment Engineering System(S-EES) integrates the activities performed at equipment that are the core of production activities and manages them by system so as to maximize the efficiency of equipment and raise the quality level of products to one level. In other words, when the product is put into the equipment, the recipe is downloaded through the RMS, the recipe is set to the optimal condition through R2R(process control), and the system detects and controls the abnormality of the equipment during operation through the FDC function in real time it means. In this way, we are working with the suitable recipe that matches the lot of product, detecting the abnormality of the equipment during operation, preventing the product from being defective, and establishing a system to maximize the efficiency through real-time equipment management. In this study, we review the present status and problems of equipment management in actual production lines, collect the requirements of the manufacturing line for the PCB line, design and develop the system, The measurement model was studied.

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Selecting of Earth-work Equipment Combination Considered CO2 Emission (이산화탄소 배출량을 고려한 토공 장비조합의 선정)

  • Kim, Byung-Soo
    • Proceedings of the KSR Conference
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    • 2011.05a
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    • pp.1750-1756
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    • 2011
  • After Kyoto Protocol was adopted for green gas reduction, each nations are stepping up efforts to reduce $CO_2$ of a typical green gas. Construction industry also is trying $CO_2$ reduction with the techniques of two types which are software and hardware techniques. The software technique are Passive Design considered green gas emission and the environment impact assessment by LCA. The hardware techniques are adjustment of equipment system and development of eco- friendly material. But, it is nonexistent that a study related to $CO_2$ emission considered detail process in construction industry. This study analyzed the relativeness of equipment combination and $CO_2$ emission by calculate $CO_2$ emission follow to equipment combination on earth-work which is the process emitted most $CO_2$ among railway bedding construction.

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The Development and Application of Cloud Computing-based BPM-ERP System for Small and Medium Marine Equipment Makers (중소 조선기자재 업체를 위한 클라우드 컴퓨팅기반 BPM-ERP 시스템 개발 및 적용)

  • Jung, Dong-Gyu;Cho, Chi-Woon;Nam, Yong-Sic
    • IE interfaces
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    • v.23 no.2
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    • pp.126-138
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    • 2010
  • Marine equipment makers today face a multitude of challenges including the needs of an internal system for easy management of their business processes and a collaboration system to streamline communications with the parent company, increasing product complexity and heightened requirements for information technology. In this research, a BPM-ERP system called Biz $Tower^{(R)}$ was implemented based on cloud computing for especially, small and medium marine equipment makers to standardize and visualize the entire business process from order placement to release. This system also provides their parent company with visibility into the status of orders and user can easily access the system on the web at a low price through cloud computing service. Thus far, this paper demonstrates the applicability of Biz $Tower^{(R)}$ to improve management visibility, process performance, and collaboration with the parent company for small and medium marine equipment makers.

Position Control of Wafer Lift Pin for the Reduction of Wafer Slip in Semiconductor Process Chamber

  • Koo, Yoon Sung;Song, Wan Soo;Park, Byeong Gyu;Ahn, Min Gyu;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.4
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    • pp.18-21
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    • 2020
  • Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

Structural Analysis and Safety of FCT Inspection Automation System (FCT 검사 자동화 System의 구조해석 및 구조 안전성에 관한 연구)

  • Jeong, Hae-Jin;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.7
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    • pp.114-119
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    • 2022
  • The analysis conditions were established using the self-weight of the FCT automation equipment, and natural frequency analysis was performed under the same conditions. For the structural analysis, 3D modeling was performed using Inventor, and structural analysis was performed using the Ansys workbench. From the structural analysis, it was concluded that the resulting values of the stress and deformation of the equipment do not affect the equipment. From the dynamic analysis, the resonance does not occur in the equipment driving area, and thus it is judged to be stable.

Development of Forming Equipment Using Electromagnetic Lorentz Force (전자기 로렌쯔력을 이용한 성형장비 개발)

  • Lee, H.M.;Ku, J.K.;Noh, H.G.;Song, W.J.;Ku, T.W.;Kang, B.S.;Kim, J.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.313-317
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    • 2009
  • Electromagnetic forming(EMF) is a high-velocity forming process which uses electromagnetic Lorentz force. Advantages of this forming technique are improved formability, reduction in wrinkling, non-contact forming and applications of various forming process. But the application of electromagnetic forming technique is still limited in industry. Thus for continuous research and development of technique based on experiments, develop the forming equipment and carry out the forming experiments for validation of forming equipment.

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Reliability Analysis of LNG FPSO Liquefaction Cycle in DEVS Environment (DEVS 환경에서 LNG FPSO 액화 공정의 신뢰도 해석)

  • Ha, Sol;Ku, Namkug;Roh, Myung-Il
    • Korean Journal of Computational Design and Engineering
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    • v.18 no.2
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    • pp.138-147
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    • 2013
  • The liquefaction process system is regarded as primary among all topside systems in LNG FPSO. This liquefaction process system is composed of many types of equipment. LNG equipment on offshore plants has quite different demands on the equipment compared to traditional onshore LNG plants, so the reliability analysis of this process system needs to be performed. This study investigates how DEVS formalism for discrete event simulation can be used to reliability analysis of the liquefaction cycle for LNG FPSO. The reliability analysis method based on DEVS formalism could be better model for reflecting the system configuration than the conventional reliability analysis methods, such as fault tree analysis and event tree analysis.