• Title/Summary/Keyword: process equipment

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Test Method for Particle Removal Characteristic of Equipment Fan Filter Unit (EFFU) (Equipment Fan Filter Unit (EFFU)의 Particle 제거 성능평가 방법)

  • Lee, Yang-Woo;Ahn, Kang-Ho
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.2
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    • pp.59-62
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    • 2012
  • This test method covers a procedure for measuring particle removal characteristic of equipment fan filter unit(EFFU) installed inside of semiconductor process equipments, FPD manufacturing equipments and so on. Since EFFU is a combination of air filter and the assembly of fan, motor and frame, the integrity of these parts is very important for the performance of EFFU. So a conventional particle removal test method for air filters is not suitable for EFFU particle removal performance. This test method defines an evaluation method for EFFU which is installed inside an enclosed space to remove particles that are generated inside process equipment. The particle removal performance of EFFUs is usually depending on the performance of filter media and air flow rate. To understand a performance of an EFFU, the filter media characteristic, air flow rate and the integrity of EFFU parts should be considered simultaneously. This test method is intended to demonstrate the system performance of an EFFU and successfully evaluated EFFU performance characteristics.

Performance Evaluation of Road Stripe Removing Equipment Using High Pressure Water-Jet (워터젯을 이용한 노면표시 제거장비의 성능평가에 관한 연구)

  • Han, Jae-Goo;Kwon, Soon-Wook;Kim, Kyoon-Tai
    • Korean Journal of Construction Engineering and Management
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    • v.7 no.6
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    • pp.79-89
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    • 2006
  • Current removing process is labor intensive and time consuming, employing a conventional grinding type manual machine. From a social and economic point of views, these kinds of manual tasks bring about social inconvenience and economic loss including traffic jam and high labor costs. The objective of the study was to develop and evaluate a road stripe removal equipment using water jet technology. The following shows the results. First, It was analyzed that the obtainable productivity from the equipment developed in the study is 280% compared to the current equipment. In this study, it was also calculated the Benefit/Cost Ratio and the result showed that the ratio is 3.28, so it is expected that the equipment can produce great benefits for the relevant companies. Second, an analysis was also conducted on the traffic congestion cost, and the equipment could save about \2,550 million per day compared to the conventional equipment. Therefore, it is analyzed that the economic viability of the equipment is sufficient.

Development of Automatic Test Equipment for Hardware Verification of Aircraft Stores Management Computer (항공기용 무장관리컴퓨터 하드웨어 검증을 위한 자동시험 장비 개발)

  • Oh, Soo-heon;Jeon, Eun-seon;Kim, Kap-dong;Park, Jun-hyun
    • Journal of Advanced Navigation Technology
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    • v.25 no.5
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    • pp.377-383
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    • 2021
  • In this paper, we describe the case of automatic test equipment development for hardware verification of stores management computer mounted on aircraft. Recently, the required functions of aircraft have been diversified and the related technologies of avionics equipment have developed, and the types and quantity of interfaces required for avionics equipment have increased. In addition to the existing old stores, the stores management computer also needs to control the interface in large quantities as the requirements for the new stores are added. For this reason, the time and manpower required for the inspection of avionic equipment are also increasing, and if the test process of avionic equipment can be automated and unmanned, more efficient inspection system operation will be possible. Therefore, this paper introduces the case of designing test software and test scenario to automate the structural design contents and verification process of test equipment required for the verification of hardware function of stores management computer.

ELECTROSLAG STRIP OVERLAY OF PIPE, FITTINGS, AND PRESSURE VESSELS

  • Dan, Capitanescu
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.355-360
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    • 2002
  • ElectroSlag Strip Overlaying (ESSO) process has been around since 1970. ESSO process had limited acceptance due to a few problems associated with the use of this process in its very early stage. Limited knowledge and, most significantly, poor quality of the equipment and welding flux gave the ESSO process a bad name. However, this process is well accepted today and used in North America, Europe and Japan. The ESSO process provides low dilution overlays at high deposition rates, excellent and consistent deposit chemistry with excellent surface quality, and virtually no defects. Capitan has taken this process one step further through extensive research and development of the process itself as well as the equipment. The improvement brought to the process warranted the issuance in May 2000 of an US patent. This study demonstrates the feasibility of this process with immediate positive production results. The main achievements of this work are as follows: $\textbullet$ Development of six various strip-flux combinations on three different base materials: carbon steel, $\frac{1}{4}$ Cr/.5 Mo and 2 $\frac{1}{4}$ Cr/l Mo, fully tested with: penetrant, ultrasound, bends, hardness, overlay chemistry, corrosion and hydrogen disbonding. $\textbullet$ 12" dia. 90 hot formed elbows from straight pipe electroslag overlayed with "1 layer" and "2 layer" Alloy 625 $\textbullet$ a very unique development of miniaturized overlaying equipment able to perform overlay in pipe with diameters as low as 10" (254 mm). This development has large applications in the field of offshore, petrochemical, refining, pulp and paper and power generation industries. The aftermath of this development was its immediate acceptance by major end users with the completion of four projects of overlayed pipe in the USA and Far East Asia.

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Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

THE SCIENTIFIC BASIS OF THE PROCESS OF VEGETABLE JUICE SQUEEZINDG OUT OF LEAFSTALK BIOMASS

  • Proydak, N.I.
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 1996.06c
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    • pp.953-956
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    • 1996
  • The main regularities of the process of strain of the leafstalk boimass of the annual and parennial sown grasses (hard phase) with the simulataneous filtration of the vegetable juice (liquid phase) in the working members of the uninterrupted action(screw press) and the periodic action (Briqueting stamp press) were established . The engineering methods of calculation of the basic constructive -technological parameter of the pres equipment of the given types were worked out.

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Development of Failure Reporting Analysis and Corrective Action System

  • Hong, Yeon-Woong
    • 한국데이터정보과학회:학술대회논문집
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    • 2006.11a
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    • pp.97-112
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    • 2006
  • FRACAS(Failure Reporting, Analysis and Corrective Action System) is intended to provide management visibility and control for reliability and maintainability improvement of hardware and associated software by timely and disciplined utilization of failure and maintenance data to generate and implement effective corrective actions to prevent failure recurrence and to simplify or reduce the maintenance tasks. This process applies to acquisition for the design, development, fabrication, test, and operation or military systems, equipment, and associated computer programs. This paper shows the FRACAS development process and developed FRACAS system for a defense equipment.

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Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

  • Hong, Sang-Jeen;Hwang, Jong-Ha;Seo, Dong-Sun
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.3
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    • pp.115-118
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    • 2011
  • Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

Evaluation of Process Performance and Mechanical Properties according to Process Variables of Pneumatic Carbon Fiber Tow Spreading (공기에 의한 탄소섬유 스프레딩 공정 변수에 따른 프로세스 성능 및 기계적 물성 평가)

  • Roh, Jeong-U;Baek, Un-Gyeong;Roh, Jae-Seung;Nam, Gibeop
    • Composites Research
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    • v.33 no.6
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    • pp.390-394
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    • 2020
  • The carbon fiber has been damaged via tow spreading process for carbon fiber spread tow. The fiber damage is caused by friction between equipment and fibers or between fibers and fibers in the process of spreading. As a result, mechanical properties are decreased due to differences in process via material and equipment condition. Therefore, minimizing fiber damage have to be considered in the process. In this study, the change in carbon fiber pneumatic spreading process was observed by according to the filament count, sizing content of carbon fiber and process variables in spreading equipment (fiber tension at the beginning, air temperature in spreading zone, vacuum pressure in spreading zone). Tensile strength was evaluated using samples prepared under optimal conditions for each of the carbon fiber varieties, and mechanical properties were reduced due to damage on the carbon fiber.