• Title/Summary/Keyword: process change pattern

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The Change of Site Pattern of Buddhist Architecture of Koguryo (고구려사지(高句麗寺址)를 중심(中心)으로 고찰(考察)한 5세기전후(世紀前後) 불사계획(佛寺計劃)의 변화(變化))

  • Kim, Sung-Woo
    • Journal of architectural history
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    • v.5 no.1 s.9
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    • pp.9-17
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    • 1996
  • A few archeological excavation of Buddhist temple sites of Koguryo were reported with information of site arrangement. The interpretation of such information is very important not only for the explanation of Korea early Buddhist architecture but also for the development of East Asian cases in general since no archeological evidences of the same period were found in other countries such as China. Though the investigation of the four temple sites this paper attempt to identify their date of construction and the process of change. The study depended much on comparative studies of the change of site elements such as pagoda, image hall., corridor, and other buildings. The study could conclude that the site of SangO-Ri must be the earliest case which was followed by ChungRung-Sa, which was built in around 427AD. The site of ToSung-Ri was the case which was the work of the rate 5th century. Such process of the development of Buddhist architecture in Koguryo unveils the fact that the process of change was a continuous flow toward a consistent goal of change that had much to do with the contemporary religious situation.

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A Study of The reference value of the CUSUM control chart that can detect small average changes in the process

  • Jun, Sang-Pyo
    • Journal of the Korea Society of Computer and Information
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    • v.25 no.12
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    • pp.73-82
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    • 2020
  • Most process date such as semiconductor and petrochemical processes, autocorrelation often exists between observed data, but when the existing SPC(Statistical process control) is applied to these processes, it is not possible to effectively detect the average change of the process. In this paper, when the average change of a certain size occurs in the process data following a specific time series model, the average of the residuals changes according to the passage of time, and the change pattern of the average is introduced around the ARMA(1,1) process. Based on this result, the reference value required in the design process of the CUSUM (Cumulative sum) control chart is appropriately considered by considering the type of the time series model of the process data of the CUSUM control chart that can detect small mean changes in the process and the width of the process mean change of interest. It was confirmed through simulation that it should be selected and used.

Stick-slip in Chemical Mechanical Polishing Using Multi-Particle Simulation Models (다수의 연마입자를 고려한 CMP 공정의 Stick-Slip 고찰)

  • Jung, Soyoung;Sung, In-Ha
    • Tribology and Lubricants
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    • v.34 no.6
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    • pp.279-283
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    • 2018
  • In this study, we investigate the behavior of abrasive particles and change of the stick-slip pattern according to chemical mechanical polishing (CMP) process parameters when a large number of abrasive particles are fixed on a pad. The CMP process is simulated using the finite element method. In the simulation, the abrasive grains are composed of those used in the actual CMP process. Considering the cohesion of the abrasive grains with the start of the CMP process, abrasive particles with various sizes are fixed onto the pad at different intervals so that stick-slip could occur. In this analysis, we determine that when the abrasive particle size is relatively large, the stick-slip period does not change as the pressure increases while the moving speed is constant. However, if the size of the abrasive grains is relatively small, the amount of deformation of the grains increases due to the elasticity of the pad. Therefore, the stick-slip pattern may not be observed. As the number of abrasive particles increases, the stick-slip period and displacement decrease. This is consistent with the decrease in the von Mises yield stress value on the surface of the wafer as the number of abrasive grains increases. We determine that when the number of the abrasive grains increases, the polishing rate, and characteristics are improved, and scratches are reduced. Moreover, we establish that the period of stick-slip increases and the change of the stick-slip size was not large when the abrasive particle size was relatively small.

Evolution of Human Locomotion: A Computer Simulation Study (인류 보행의 진화: 컴퓨터 시뮬레이션 연구)

  • 엄광문;하세카즈노리
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.5
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    • pp.188-202
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    • 2004
  • This research was designed to investigate biomechanical aspects of the evolution based on the hypothesis of dynamic cooperative interactions between the locomotion pattern and the body shape in the evolution of human bipedal walking The musculoskeletal model used in the computer simulation consisted of 12 rigid segments and 26 muscles. The nervous system was represented by 18 rhythmic pattern generators. The genetic algorithm was employed based on the natural selection theory to represent the evolutionary mechanism. Evolutionary strategy was assumed to minimize the cost function that is weighted sum of the energy consumption, the muscular fatigue and the load on the skeletal system. The simulation results showed that repeated manipulations of the genetic algorithm resulted in the change of body shape and locomotion pattern from those of chimpanzee to those of human. It was suggested that improving locomotive efficiency and the load on the musculoskeletal system are feasible factors driving the evolution of the human body shape and the bipedal locomotion pattern. The hypothetical evolution method employed in this study can be a new powerful tool for investigation of the evolution process.

Extraordinary State Classification of Grinding Wheel Surface Based on Gray-level Run Lengths (명암도 작용 길이에 따른 연삭 숫돌면의 이상 현상 분류)

  • 유은이;김광래
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.13 no.3
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    • pp.24-29
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    • 2004
  • The grinding process plays a key role which decides the quality of a product finally. But the grinding process is very irregular, so it is very difficult to analyse the process accurately. Therefore it is very important in the aspect of precision and automation to reduce the idle time and to decide the proper dressing time by watching. In this study, we choose the method which can be observed directly by using of computer vision and then apply pattern classification technique to the method of measuring the wheel surface. Pattern classification technique is proper to analyse complicated surface image. We observe the change of the wheel surface by using of the gray level run lengths which are representative in this technique.

Decision of Optimum Grinding Condition by Pass Schedule Change (열간압연 스케줄변경에 따른 최적연삭조건 결정)

  • Bae, Yong-Hwan
    • Journal of the Korean Society of Safety
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    • v.23 no.6
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    • pp.7-13
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    • 2008
  • It is important to prevent roll failure in hot rolling process for reducing maintenance cost and production loss. The relationship between rolling pass schedule and the work roll wear profile will be presented. The roll wear pattern is related with roll catastrophic failure. The irregular and deep roll wear pattern should be removed by On-line Roll Grinder(ORG) for roll failure prevention. In this study, a computer roll wear prediction model under real process working condition is developed and evaluated with hot rolling pass schedule. The method of building wear calculation functions for center portion abrasion and marginal abrasion respectively was used to develop a work roll wear prediction mathematical model. The three type rolling schedule are evaluated by wear prediction model. The optimum roll grinding methods is suggested for schedule tree rolling technique.

Investigation of the Changes of Fabry-Perot Fringe Patterns in Porous Silicon During Etching Process

  • Jang, Seunghyun
    • Journal of Integrative Natural Science
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    • v.5 no.1
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    • pp.13-17
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    • 2012
  • Changes of Fabry-Perot fringe patterns in porous silicon during etching process has been investigated. Four porous silicon samples were prepared with four different etch currents: (a) 10 $mA/cm^2$, (b) 30 $mA/cm^2$, (c) 50 $mA/cm^2$, (d) 100 $mA/cm^2$, respectively. Optical characterization of Fabry-Perot fringe pattern on porous silicon was achieved by Ocean optics 2000 spectrometer. The change of Fabry-Perot fringes was monitored and measured during the etching process. Fabry-Perot fringes pattern start to form after couple of minutes. As the etching time increased, more reflection peaks were observed. Its full width at half maximum (FWHM) decreased rapidly when the etching time increased.

A study on the Relation between Strain & Conductivity of the Printed Pattern in Post-Printing Section of Roll to Roll process (롤투롤 공정의 인쇄 후 구간에서 변형률과 인쇄한 패턴의 전기 전도도와의 관계에 대한 연구)

  • Choi, Jae-Ho;Lee, Chang-Woo;Shin, Kee-Hyun
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.877-880
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    • 2009
  • A curing process in post-printing section of R2R process is required for an electrical property of the printed pattern when devices such as RFID, Solar cell are printed. PEN as well as heat-stabilized PET which is used as a plastic substrate would be deformed at high temperature due to change of its elastic modulus. And crack in the printed pattern, which is on the plastic substrate is occurred due to the deformation of the substrate. The occurrence of crack causes electrical resistance to increase and the quality of the device to deteriorate. In case of RFID antenna, the range of reading distance is shortened as the electrical resistance of the antenna is increased. Therefore, the deformation of the plastic substrate, which causes the occurrence of crack, should be minimized by setting up low operating tension in R2R process. In low tension, slippage between a moving substrate and a roller would be generated when the operating speed is increased. And scratch would be occurred when slippage is generated due to an air entrainment, which is related to the thickness of the air film. The thickness of the air film is increased when operating speed is increased as shown by simulation based on mathematical model. The occurrence of scratch in conductive pattern printed by roll to roll process is a critical damage because it causes degradation or failure of electrical property of it.

The Spatiotemporal Impact of Urban Growth based on Landuse Pattern (도시성장에 따른 토지이용패턴의 시공간적 영향 평가)

  • Lee, Dong-Kun;Choe, Hye-Yeong;Oh, Kyushik
    • Journal of Environmental Impact Assessment
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    • v.18 no.3
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    • pp.161-170
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    • 2009
  • As urban growth continues, the earth ecosystem is increasingly dependent on the patterns of urban growth. The impact intensity from urban growth is expected to change predictably with distance from the urban center. However we can't fully understand yet how urban development pattern affects urban ecosystem. In researches about urban ecosystem, it is important to relate the spatial pattern of urbanization to ecological processes. So we used gradient analysis with time data; 1980's, 1990's and 2000's. We attempted to quantify the urban spatiotemporal impacts in Daejeon-city and Cheonan-city, Korea, along a 75km long and 3km wide transect. Through the results, we found the impacts range of urbanization with urban development process of two cities. When the urban growth was concentrated on in both cities, the impacts intensity and range were much stronger and wider. As a result, in urban planning or green space planning, we have to consider suitable urban development forms with surrounding areas, and make legal clauses which limits landuse change. This quantifying the urban gradient is an important step in understanding urban ecology.

Design and Implementation of Parabolic Speed Pattern Generation Pulse Motor Control Chip (포물선 가감속 패턴을 가지는 정밀 펄스 모터 콘트롤러 칩의 설계 및 제작)

  • Won, Jong-Baek;Choi, Sung-Hyuk;Kim, Jong-Eun;Park, Jone-Sik
    • Proceedings of the KIEE Conference
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    • 2001.11c
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    • pp.284-287
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    • 2001
  • In this paper, we designed and implemented a precise pulse motor control chip that generates the parabolic speed pattern. This chip can control step motor[1], DC servo[2] and AC servo motors at high speed and precisely. It can reduce the mechanical vibration to the minimum at the change point of a degree of acceleration. Because the parabolic speed pattern has the continuous acceleration change. In this paper, we present the pulse generation algorithm and the parabolic pattern speed generation. We verify these algorithm using visual C++. We designed this chip with VHDL(Very High Speed Integrated Circuit Hardware Description Language) and executed a logic simulation and synthesis using Synopsys synthesis tool. We executed the pre-layout simulation and post-layout simulation with Verilog-XL simulation tool. This chip was produced with 100 pins, PQFP package by 0.35 um CMOS process and implemented by completely digital logic. We developed the hardware test board and test program using visual C++. We verify the performance of this chip by driving the servo motor and the function by GUI(Graphic User Interface) environment.

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