• Journal of the Korean institute of surface engineering
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• v.31 no.1
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• pp.45-53
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• 1998

Sharp tips are commonly used for applications in fields as diverse as nanolithography, lowvoltage field emitters, emitters, nanoelectroniecs, electrochemisty, cell biology, field-ion and electron microscopy. tungsten wire, mater만 used in this experiment, which test the chip of wafer has been used to the needle of probe card. Tungsten wire was sharpened by electrochemical etching methode to get a typical tip shape.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.77-81
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• 2017

Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

• Journal of Advanced Marine Engineering and Technology
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• v.30 no.3
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• pp.438-443
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• 2006

The probe type sensor using strain gauges was used to track a container box's seam in this paper. A strain gauge has a property which the specific resistance is changed by varying of the sectional area and length when tensile and compressive stresses are generated at the strain gauge. We designed the automatic seam tracking device by attaching the probe type strain gauge sensor, motor driving slide, encorder to check the moving distance and interface card connected MPU upside the speed controllable carriage. The folded work piece for a container box is made to examine whether the device can track the seam automatically or not. Seam tracking experiments were done by changing the carriage moving speed at 300. 400. 500. 600[mm/min] each as the voltage of side track was 2.5[V]. We compared and analyzed the sampling data which is obtained by output voltage of strain gauge sensor and rotary encorder pulse every 100 [m/s]. The welding experiments were performed by using $CO_2$ welding machine about the carriage moving speed that has good seam tracking condition in the seam tracking experiments above. And we compared the seam tracking status.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.18 no.2
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• pp.111-120
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• 2000

Water, waste, electric and gas facilities are urban based facilities that needed in our life and are often located in underground. Therefore, underground facilities are more difficult to manage efficiently than ground facilities. It is needed to carry out survey/probe into underground facilities and to build database in order to prevent city-misfortunes being occurred because of negligent management and in order to minimize budget-waste and a traffic jam according to repetition of road excavation constructions. Also, the development of application system is required to manage efficiently underground facility. Chonju city has launched underground water supply facility computerizing project as a part of National Geographic Information System project until December 1998 and executed survey/probe into 402.89 km water supply that is 80 mm up inside central town area 39.6 $km^2$. Also, chonju city built database into 537 km water supply that is 80 mm below based on water supply card without other survey/probe works. Also, existing work process each department is changed into GIS applied work process and underground water supply facility management system is developed by its work process basis. Water supply underground facility management system that is developed is composed of sub-system like base-map management, water supply inspect, water supply management and water supply inquiry, construction work management, administration management and map management. This research presents the procedure and method of underground water supply facility survey/probe and problem being occurred during survey/probe procedure and also show the functions of each sub-systems composing underground water supply facility management system.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.667-670
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• 2005

본 논문은 100um와 80um의 텅스텐 와이어를 이용하여 세라믹(Ceramic)기판에 홀(Hole)을 뚫어 텅스텐 와이어를 수직으로 세우는 방식으로 수직형의 마이크로 스프링을 제작하였다. 마이크로 스프링의 설계를 위해 제한된 실험 결과와 신경회로망을 이용하여 텅스텐 와이어의 두께와 높이, 쉬프트(Shift)의 양을 변화시키면서 장력(Tension force)을 모델링하였고 제작을 통해 검증하였다. 이는 기존의 수평형 프로브카드의 한계를 대체할 수 있는 수직형 프로브카드의 핵심 모듈로서 멀티다이(Multi Die) 뿐만 아니라 범핑(Bumping)타입의 칩 테스트도 가능하다.

• Transactions of Materials Processing
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• v.27 no.4
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• pp.244-249
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• 2018

Rhodium is a representative platinum group material. Rhodium is used in several industrial fields including jewelry, chemical reaction catalyst, electric component etc. In recently, ultra-fine rhodium wire has been applied to the pins of probe card used to test a semiconductor. In this study, in order to produce a fine rhodium wire with the diameter of $50{\mu}m$, a fine rhodium wire drawing process was designed. After design of the fine wire drawing process by using a uniform reduction ratio theory, finite element analysis was performed. Finally, fine wire drawing experiment was performed to verify the effectiveness of the designed process.

• Journal of Korea Technology Innovation Society
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• v.17 no.3
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• pp.490-518
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• 2014

This study investigated the success factors of technology transfer and commercialization in the high-technology industries. We specifically analyzed the case of technology transfer between KETI and probe card company. The main purpose of this research is to seek and analyze the most influential factors which can lead to successful technology transfer and technology commercialization both in terms of government policy and corporation strategy. This research oversees the previous research works. framework setting and case study analysis to derive implications in the following points of views: technology receiver, technology provider, technology's characteristics, technology transfer's process. The important findings of this study are as follows. In the terms of technology receiver, the experience in technology transfer and commercialization, will to support for R&BD and rich technology pool are also important. In terms of technology provider, acquisition strategy, will to push, complementary assets and absorptive capacity are very crucial. In terms of technology's characteristics, R&D stage, technology category and connectivity of existing technology are closely related with successful transfer and commercialization. Finally, Support of TLO and active participation of transfer process are important factors in terms of technology transfer's process.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.449-449
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• 2013

최근 반도체 소자의 집적회로는 점점 복잡해지고 있는 반면, 소자의 크기는 작아지고 있으며 그로 인해 패드의 크기가 작아지고 패드사이의 간격 또한 협소해지고 있다. 따라서 웨이퍼 단계에서 제조된 집적회로의 불량여부를 판단하기위한 검사 장비인 프로브카드(Probe Card)의 높은 집적도가 요구되고 있다. 하지만 기존의 MEMS 공법으로 제작되는 프로브 빔은 복잡한 제조 공정과 높은 생산비용, 낮은 집적도의 문제점을 가지고 있다. 본 연구에서는 이러한 문제점을 해결하기 위하여 간단한 제조 공정과 낮은 생산비용, 높은 집적도를 가지는 프로브 빔을 개발하기 위하여 절연절단 방식으로 BeCu (Beryllium-Copper) 프로브 빔을 제작하였다. 낮은 소비 전력으로 우수한 프로브 빔 어레이를 제작하기 위해서 가장 고려해야할 대상은 프로브 빔의 재료와 구조(형상)이다. 절연전단 방식으로 프로브 빔을 형성할 때 요구되는 Fusing current는 프로브 빔의 구조(형상)에 크게 영향을 받는다. 낮은 Fusing current는 소비 전력을 줄여주고, 절연절단으로 형성되는 프로브 빔의 단면(끝)을 날카롭게 하여 프로브 빔과 집적회로의 패드 간의 접촉 저항을 감소시킨다. 프로브 빔의 제작은 BeCu 박판을 빔 형태로 식각하여 제작하였으며, 실리콘 비아 홀(Via hole) 구조의 기판위에 정렬하여 soldering 공정을 통해 실리콘 기판과 BeCu 박판을 접합시켰다. 접합된 프로브 빔의 끝부분을 들어 올린 상태로 전류를 인가하여 stress free 상태로 만들어 내부 응력을 제거하였으며, BeCu 박판에 fusing current를 인가하여 BeCu 박판 프레임으로부터 제거를 하였다. 제작된 프로브 빔의 길이는 1.7 mm, 폭은 $50{\mu}m$, 두께는 $15{\mu}m$, 절단부의 단면적은 1$50{\mu}m^2$로 제작되었다. 그리고 프로브 빔의 절단부의 길이는 $50{\mu}m$ 부터 $90{\mu}m$까지 $10{\mu}m$ 증가시켜 제작되었다. 이후에 절연절단 공정에 요구되는 Fusing current를 측정하였고, 절연절단 후의 절단면의 형상을 SEM (Scanning Electron Microscope)장비를 통하여 확인하였다. 절단부의 길이가 $50{\mu}m$일 때 5.98A의 fusing current를 얻었으며, 절연절단 후 절단부 상태 또한 가장 우수했다. 본 연구에서 제안된 프로브 빔 제작 방법은 프로브카드 및 테스트 소켓(Test socket) 생산에 응용이 가능하리라 기대한다.

• Science of Emotion and Sensibility
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• v.15 no.2
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• pp.259-268
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• 2012

In a P300-based concealed information test (P300 CIT), the result of the test is greatly affected by the value of the probe stimulus. With a probe stimulus of low value, the detection rate decreases. The aim of this study was to determine whether the pupil-based concealed information test (Pupil CIT) could be used in addition to the P300 CIT for the probes of low value. Participants were told to choose one card from a deck of five cards (space 2, 3, 4, 5, 6), Then a P300 CIT and a Pupil CIT for the selected card were administered. P300s were measured at 3 scalp sites (Fz, Cz, and Pz), and the pupil sizes of left and right eyes were recorded. The P300 amplitude measured at Fz, Cz, and Pz was significantly different between the probe and irrelevant stimuli. And, in the Pupil CIT, the pupil size was also different between the two stimuli for both eyes. The detection rates of the P300 CIT were 44% at Fz and Cz sites and 36% at Pz site. And the detection rates of the Pupil CIT were 52% for the left eye and 60% for the right eye. There is a trend that the detection rate of the Pupil CIT was higher than that of the P300 CIT, but the difference didn't reach significance partly because of the relatively small sample size. The correlation between the decision based on the P300 CIT and that based on the Pupil CIT was not significant. As a conclusion, it is recommended to use a Pupil CIT instead of a P300 CIT when the value of the probe is low. And a combination of the measures may be superior to either one of them in detection rate.

• Journal of the Korean Society of Marine Environment & Safety
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• v.13 no.4
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• pp.113-117
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• 2007

The study was performed on the development of system in which the bead width can be controlled. In order to control the bead width, we designed the automatic seam tracking device by attaching the probe type strain gauge sensor, motor driving slide and encoder to check the moving distance, and interface card connected MCU(80Cl96KC) upside the speed controllable carriage. Seam tracking experiments were done by changing the bead width. We compared and analyzed the sampling data which were obtained by output voltage of strain gauge sensor and rotary encoder pulse every 50ms.