• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.477-481
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• 2014

Flexible electronics have been to the fore because it is believed that flexibility can add incredible value such as light weight and mobility into the existing electronic devices and create new markets of large-area and low-cost electronics such as wearable eletronics in near future. Offset printing processes are regarded as major candidates for manufacturing the flexible electronics because they can provide the patterning resolution of micron-size effectively in large-area. In view of mechanics, the most important viewpoint in offset printing is how to achieve the synchronized movement of two contact surfaces in order to prevent slip between two contact surfaces and distortion of the blanket surface during ink transfer so that the high-resolution and good-overlay patterns can be printed. In this paper, a novel low-cost measurement method of the synchronization error using the motor control output signals is proposed and the compensation method is presented to minimize the synchronization error.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.10
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• pp.1141-1145
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• 2011

Recently, there are many issues about R2R printing technique for mass production of electronic devices. Among the various Roll-to-roll based printing techniques such as gravure, off-set, flexo and so on, "Gravure off-set printing technique" has an advantage of higher printing resolution. The printing unit of gravure off-set printing technique usually consists of plate roll, blanket roll and impressure roll whose. Linear velocities should be synchronized each other for fine pattern printing. However, roller's manufacturing error and printing variations such as pringting pressure, printing speed, roll stroke and so on actually affected their synchronization anf thus the quality of fine fattern. In this paper, we analyzed the effective of synchronization error on printing quality. Also, this paper reviews the relative motion with each roll. And, this paper studys the synchronization error about its generation problem.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.976-980
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• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.987-993
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• 2001

In this paper, we presents the construction details and output characteristics of a thick film piezoresistive strain gage. The thick film was printed on the ceramic diaphragm back side by screen printing and cured at 850$^{\circ}C$. The strain distribution and deflection on ceramic diaphragm were performed with finite-element method(FEM tool ANSYS-5.3). Various thick film strain gage characteristics were analysed, including nonlinearity, hysteresis, stability and sensitivity of thick film strain gages.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.846-851
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• 2013

Recently, energy harvesting technologies are considered as the great alternatives to reduce the dependency on secondary batteries. In this paper, we proposed PCB type energy harvester which can be directly integrated with other electronic components on same board. To form the three dimensional coil structure, two PCBs with patterned metal lines are solder bonded. For magnetic induction, inside of coil structure was filled with magnetic substance and rotary motioned external magnets are applied to near the harvester. The effects of metal wire width on PCB, thickness of magnetic substance, and frequency of rotary motion on energy harvesting performance are analyzed by computer simulation and experiments. Experimental results showed 29.89 ${\mu}W$ of power generation performance at the frequency of 5.2 Hz and it is shown that designed harvester can be effectively applied on vibration environment with very limited frequency.

• Journal of IKEEE
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• v.21 no.3
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• pp.272-275
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• 2017

Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

• Transactions on Electrical and Electronic Materials
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• v.6 no.2
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• pp.78-84
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• 2005

Standard crystalline solar cells are generally fabricated with the front grid pattern of silver paste contact. We have reported a detailed theoretical analysis of the proposed segmented cross grid line pattern in this paper. This work was carried out for the optimization of spacing and width of grid finger, main busbar and sub-busbar. The overall electrical and optical losses due to front contact were brought down to $10\%$ or even less as compared to the usual loss of $15\%$ or more in the conventional screen printed silver paste technology by choosing proper grid pattern and optimizing the grid parameters. The total normalized power loss for segmented mesh grid with plated metal contact was also observed and the total power loss could be brought down to $10.04\%$ unlike $11.57\%$ in the case of continuous grid and plated contact. This paper is able to outline the limitations of conventional screen printed contact.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.11
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• pp.90-94
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• 2008

Recently, a great deal of research is focused on the printed electronics. One of their mainly concerned products is printed RFID tag. RFID technology has attracted researchers and enterprises as a promising method for automatic identification, and they are expected to replace conventional bar codes in inventory tracking and management. The key to successful RFID technology lies in developing low-cost RFID tags and the first step in applying printing technology to RFID systems is to replace antennas that are conventionally produced by etching copper or aluminum. However, due to the printing quality variations, errors, and lower conductivity, the performance of the printed RFID antennas is lower than that of antennas manufactured by conventional etching methods. In this paper, the effect of variations in the printing conditions on the antenna performance is investigated. Three levels for each condition parameter is assumed and effect on the resonant frequency are examined experimentally based on orthogonal array. The most serious factor that affects the resonant frequency of the antenna is the non-uniformity of the edge and the resonant frequency is found to be lower as the non-uniformity increases.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.2
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• pp.14-21
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• 2003

Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional. RP systems, the concept of Functional Phototype Development (FPD) is newly proposed in this paper FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that It Will be a powerful tool in the neat future.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.